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LM70CILDX-5/NOPB

Texas Instruments

LM70CILDX-5/NOPB by Texas Instruments

LM70CILDX-5/NOPB by Texas Instruments is a 11-bit temperature sensor with a max supply voltage of 5.5V and accuracy of 3.50 °C. It is ideal for applications requiring precise temperature monitoring in a compact form factor, such as IoT devices, industrial automation, and consumer electronics.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,365 parts In-Stock

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8,365

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Digiode

USA . 681 parts In-Stock

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681

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Anansix

USA . 158 parts In-Stock

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158

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 318 parts In-Stock

1+ parts

$3.044

100+ parts

$282.663

1k+ parts

$2.739

10k+ parts

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318

$3.044

$282.663

$2.739

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DigiPath Technology Company

USA . 2,070 parts In-Stock

1+ parts

$3.352

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2,070

$3.352

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ChromeModa Solutions

Germany . 4,595 parts In-Stock

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$3.420

100+ parts

$2.804

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4,595

$3.420

$2.804

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IDEA Electronic Components Group

UK . 2,311 parts In-Stock

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$3.420

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$3.078

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2,311

$3.420

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$3.078

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One Stop Electronics

USA . 1,327 parts In-Stock

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$6.750

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1,327

$6.750

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AZTECH Wire

Italy . 666 parts In-Stock

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$7.284

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Corphita

USA . 802 parts In-Stock

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802

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Overview

Elevate your temperature sensing capabilities with the LM70CILDX-5/NOPB by Texas Instruments. As a trusted manufacturer, Texas Instruments delivers top-quality temperature sensors that provide precise and reliable measurements for a wide range of applications. Whether you're monitoring industrial processes or ensuring optimal performance in consumer electronics, this sensor offers unmatched accuracy and efficiency. Say goodbye to guesswork and hello to peace of mind with the LM70CILDX-5/NOPB.

Feature Benefit Bullets

Maximum Supply Voltage: 5.5 V

Higher supply voltage allows for more stable and reliable operation.

No. of Bits: 11

Higher number of bits provides greater resolution and accuracy in temperature measurements.

Body Width: 3 inch

Compact size makes it easy to integrate into various applications.

Sensors or Transducers Type: TEMPERATURE SENSOR, SWITCH/DIGITAL OUTPUT, SERIAL

Versatile sensor types allow for different types of temperature readings and outputs to suit different needs.

Body Height: 0.8 mm

Low profile design enables the sensor to be used in tight spaces.

Package Shape or Style: SQUARE

Square shape allows for easy mounting and placement in electronic circuits.

Minimum Supply Voltage: 4.5 V

Lower minimum supply voltage helps in reducing power consumption.

Maximum Operating Temperature: 150 °C

High operating temperature range makes the sensor suitable for a wide range of environments.

Minimum Operating Temperature: -55 °C

Low operating temperature range allows the sensor to be used in extreme cold conditions.

Terminal Finish: Tin (Sn)

Tin finish provides good conductivity and corrosion resistance for long-term reliability.

Maximum Operating Current: 0.49 mA

Low operating current helps in reducing power consumption.

Housing: PLASTIC

Plastic housing is lightweight and cost-effective while still providing adequate protection for the sensor components.

Maximum Accuracy °C: 3.50

High accuracy ensures precise temperature measurements for critical applications.

Body Length/Diameter: 3 mm

Small size makes the sensor suitable for compact electronic devices.

Termination Type: SOLDER

Solder termination allows for easy and secure connection to circuit boards.

Output Interface Type: 3-WIRE INTERFACE

3-wire interface simplifies connectivity and communication with other devices.

Mounting Feature: SURFACE MOUNT

Surface mount capability makes it easy to mount the sensor on PCBs for easy integration into electronic systems.

Technical Specifications

Temperature Sensors LM70CILDX-5/NOPB attributes and parameters. Explore more Temperature Sensors devices from Texas Instruments

Specs

Maximum Accuracy (Cel):

3.50

Body Width:

3 inch

Body Height:

.8 mm

Body Length/Diameter:

3 mm

Housing:

PLASTIC

JESD-609 Code:

e3

Mounting Feature:

No. of Bits:

11

Maximum Operating Current:

.49 mA

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Output Interface Type:

3-WIRE INTERFACE

Package Shape or Style:

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Terminal Finish:

Tin (Sn)

Termination Type:

SOLDER

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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