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LM70CILDX-3

Texas Instruments

LM70CILDX-3 by Texas Instruments

LM70CILDX-3 by Texas Instruments is a temperature sensor with 11-bit resolution, operating from -55 to 150°C. It features a 3-wire interface, requires 2.65-5.5V supply voltage, and has ±3.5°C accuracy. Ideal for applications needing precise temperature monitoring in compact spaces with surface mount requirements.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Cyclops Electronics Ltd

UK . 9,000 parts In-Stock

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Vyrian

USA . 4,069 parts In-Stock

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Anansix

USA . 953 parts In-Stock

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Digiode

USA . 528 parts In-Stock

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Parana Technologies

USA . 1,548 parts In-Stock

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$1.592

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$2.225

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$1.592

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DigiPath Technology Company

USA . 1,490 parts In-Stock

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$1.753

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$1.613

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ChromeModa Solutions

Germany . 2,761 parts In-Stock

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$1.789

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$1.467

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IDEA Electronic Components Group

UK . 1,637 parts In-Stock

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$1.789

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$1.610

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One Stop Electronics

USA . 704 parts In-Stock

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$4.750

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704

$4.750

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AZTECH Wire

Italy . 823 parts In-Stock

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$5.407

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Ampacity Inc.

Singapore . 248 parts In-Stock

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$36.750

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Authorized Procurement Solutions

USA . 30,000 parts In-Stock

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Corphita

USA . 4,664 parts In-Stock

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Alle Elektronik GmbH

Germany . 1,800 parts In-Stock

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Kepictronics

USA . 54 parts In-Stock

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Overview

Upgrade your temperature sensing capabilities with the LM70CILDX-3 by Texas Instruments. Known for their top-notch quality and reliability, Texas Instruments brings you a temperature sensor that offers precise measurements and a wide operating range. Ideal for various applications, this sensor provides accurate readings while consuming minimal power. Say goodbye to guesswork and hello to efficiency with the LM70CILDX-3.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight and durable material that allows for easy installation and protection of the internal components.

Maximum Supply Voltage: 5.5 V

Wide range of supply voltage allows for compatibility with various systems and applications.

No. of Bits: 11

High resolution output for precise temperature measurements.

Body Width: 3 inch

Compact size for easy integration into different devices and systems.

Power Supplies (V): 3.3

Efficient power consumption with a stable power supply.

Sensors or Transducers Type: TEMPERATURE SENSOR, SWITCH/DIGITAL OUTPUT, SERIAL

Versatile sensor with multiple output options for diverse applications.

No. of Terminals: 8

Sufficient terminals for connecting to other components and systems.

Body Height: 0.8 mm

Low profile design for space-saving installation.

Package Shape or Style: SQUARE

Uniform shape for easy mounting and alignment in electronic systems.

Minimum Supply Voltage: 2.65 V

Low minimum supply voltage for efficient energy usage.

Maximum Operating Temperature: 150 °C

High maximum operating temperature range for use in extreme environments.

Minimum Operating Temperature: -55 °C

Wide minimum operating temperature range for versatility in different settings.

Terminal Finish: TIN LEAD

Durable terminal finish for reliable connections and long-lasting performance.

Maximum Operating Current: 0.49 mA

Low operating current for energy efficiency.

Maximum Accuracy °C: 3.5

High accuracy for precise temperature measurements.

Body Length/Diameter: 3 mm

Compact size for easy integration and installation.

Temperature Coef (ppm/°C): POSITIVE

Positive temperature coefficient for accurate temperature compensation.

Termination Type: SOLDER

Secure solder termination for stable connections.

Output Interface Type: 3-WIRE INTERFACE

Standard interface for easy communication with other devices.

Mounting Feature: SURFACE MOUNT

Convenient surface mount design for easy and secure installation.

Technical Specifications

Temperature Sensors LM70CILDX-3 attributes and parameters. Explore more Temperature Sensors devices from Texas Instruments

Specs

Maximum Accuracy (Cel):

3.5

Additional Features:

SEATED HEIGHT-MAX

Body Width:

3 inch

Body Height:

.8 mm

Body Length/Diameter:

3 mm

JESD-609 Code:

e0

Mounting Feature:

No. of Bits:

11

No. of Terminals:

8

Maximum Operating Current:

.49 mA

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Output Interface Type:

3-WIRE INTERFACE

Package Body Material:

PLASTIC/EPOXY

Package Equivalence Code:

SOLCC8,.11,20

Package Shape or Style:

Power Supplies (V):

3.3

Sub-Category:

Other Sensors/Transducers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.65 V

Temperature Coef (ppm/Cel):

POSITIVE

Terminal Finish:

TIN LEAD

Termination Type:

SOLDER

Trade Compliance

LM70CILDX-3 Sensors & Transducers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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