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LM63DIMAX

Texas Instruments

LM63DIMAX by Texas Instruments

LM63DIMAX by Texas Instruments is a temperature sensor with 11-bit resolution, operating b/w 0-85°C. It features a supply voltage range of 3-3.6V and an output interface type of 2-wire interface. Ideal for applications requiring precise temperature monitoring in compact spaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 4,675 parts In-Stock

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Digiode

USA . 4,574 parts In-Stock

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Anansix

USA . 1,363 parts In-Stock

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Component Stockers USA

USA . 3,284 parts In-Stock

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$0.990

100+ parts

$0.940

1k+ parts

$0.910

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3,284

$0.990

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$0.910

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Parana Technologies

USA . 1,226 parts In-Stock

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$2.223

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$2.728

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DigiPath Technology Company

USA . 599 parts In-Stock

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$2.448

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$2.252

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IDEA Electronic Components Group

UK . 523 parts In-Stock

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$2.498

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$2.248

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ChromeModa Solutions

Germany . 459 parts In-Stock

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$2.498

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$2.048

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AZTECH Wire

Italy . 666 parts In-Stock

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$5.138

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One Stop Electronics

USA . 301 parts In-Stock

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$24.750

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Alle Elektronik GmbH

Germany . 4,691 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,530 parts In-Stock

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Corphita

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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Lixinc

USA . 2,028 parts In-Stock

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Infinite Electronics LLP (Excess)

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Kepictronics

USA . 1,650 parts In-Stock

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Assy Fe

Spain . 1,000 parts In-Stock

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Microchip USA

USA . 467 parts In-Stock

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Overview

Upgrade your temperature sensing capabilities with the LM63DIMAX by Texas Instruments. With a reputation for top-quality electronics, Texas Instruments delivers unparalleled precision and reliability in the field of temperature sensors. This versatile device is perfect for a wide range of applications, offering customers the value of precise temperature measurement in a compact package. Whether you're monitoring industrial processes or ensuring optimal performance in consumer electronics, the LM63DIMAX provides the accuracy and efficiency you need to take your projects to the next level.

Feature Benefit Bullets

Maximum Supply Voltage: 3.6 V

Allows for a higher supply voltage, providing more flexibility in power source options.

No. of Bits: 11

Higher number of bits allows for more precise temperature measurements and readings.

Body Width: 3.899 inch

Compact size makes it easy to integrate into various systems or devices.

Sensors or Transducers Type: TEMPERATURE SENSOR, SWITCH/DIGITAL OUTPUT, SERIAL

Versatile functionality allows for multiple types of temperature monitoring and output options.

Body Height: 1.55 mm

Low profile design for efficient space utilization in compact applications.

Package Shape or Style: RECTANGULAR

Rectangular shape for easy mounting and integration into existing systems.

Minimum Supply Voltage: 3 V

Low minimum supply voltage helps in reducing power consumption.

Maximum Operating Temperature: 85 °C

Capable of measuring temperature in relatively high-temperature environments.

Minimum Operating Temperature: 0 °C

Works effectively in a wide range of temperature conditions, from freezing to room temperature and above.

Terminal Finish: TIN LEAD

Provides reliable and durable terminal finish for long-term use.

Body Length/Diameter: 4.9 mm

Compact size for easy installation and integration in small spaces.

Termination Type: SOLDER

Solder termination for secure and reliable electrical connections.

Output Interface Type: 2-WIRE INTERFACE

Standard 2-wire interface for easy communication with other systems or devices.

Mounting Feature: SURFACE MOUNT

Surface mount design for easy and secure installation on PCBs or other surfaces.

Technical Specifications

Temperature Sensors LM63DIMAX attributes and parameters. Explore more Temperature Sensors devices from Texas Instruments

Specs

Body Width:

3.899 inch

Body Height:

1.55 mm

Body Length/Diameter:

4.9 mm

JESD-609 Code:

e0

Mounting Feature:

No. of Bits:

11

Maximum Operating Current:

2 mA

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Output Interface Type:

2-WIRE INTERFACE

Package Shape or Style:

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Terminal Finish:

TIN LEAD

Termination Type:

SOLDER

Trade Compliance

LM63DIMAX Sensors & Transducers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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