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LM63DIMA

Texas Instruments

LM63DIMA by Texas Instruments

LM63DIMA by Texas Instruments is a temperature sensor with 11-bit resolution, operating b/w 0-85°C. It features a supply voltage range of 3-3.6V and an output interface of 2-wire serial. Ideal for applications requiring precise temperature monitoring in compact spaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

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Anansix

USA . 2,185 parts In-Stock

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Vyrian

USA . 1,935 parts In-Stock

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Digiode

USA . 951 parts In-Stock

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951

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Semi Source

USA . 444 parts In-Stock

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ComSIT Distribution GmbH

Germany . 380 parts In-Stock

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Euro-Tech

UK . 54 parts In-Stock

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Parana Technologies

USA . 63 parts In-Stock

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$2.000

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$185.715

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$1.800

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63

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DigiPath Technology Company

USA . 414 parts In-Stock

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$2.202

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IDEA Electronic Components Group

UK . 2,154 parts In-Stock

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$2.247

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$2.022

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ChromeModa Solutions

Germany . 1,591 parts In-Stock

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$2.247

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$1.843

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AZTECH Wire

Italy . 400 parts In-Stock

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$5.750

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One Stop Electronics

USA . 388 parts In-Stock

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$11.750

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Authorized Procurement Solutions

USA . 12,600 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,665 parts In-Stock

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Corphita

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Kepictronics

USA . 1,079 parts In-Stock

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Microchip USA

USA . 155 parts In-Stock

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Overview

Enhance your temperature sensing capabilities with the LM63DIMA by Texas Instruments. With a reputation for top-notch quality and reliability, Texas Instruments delivers cutting-edge technology in the field of temperature sensors. Perfect for a wide range of applications, this sensor offers unparalleled accuracy and precision, ensuring optimal performance in any environment. Say goodbye to guesswork and hello to real-time temperature monitoring with the LM63DIMA. Trust Texas Instruments to provide you with the best in temperature sensing technology.

Feature Benefit Bullets

Maximum Supply Voltage: 3.6 V

Having a high maximum supply voltage allows for compatibility with a wide range of power sources.

No. of Bits: 11

Having 11 bits ensures high resolution and accuracy in temperature measurement.

Body Width: 3.899 inch

Compact body width makes it suitable for applications where space is limited.

Sensors or Transducers Type: TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL

Versatile sensor type that can be used in various applications including switching and digital output.

Body Height: 1.55 mm

Low profile body height makes it suitable for applications with height constraints.

Package Shape or Style: RECTANGULAR

Rectangular shape allows for easy integration into electronic circuits and systems.

Minimum Supply Voltage: 3 V

Low minimum supply voltage ensures energy efficiency and compatibility with a wide range of power sources.

Maximum Operating Temperature: 85 °C

Wide operating temperature range allows for use in both low and high-temperature environments.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature ensures accurate temperature measurement in various environmental conditions.

Terminal Finish: TIN LEAD

Tin lead terminal finish provides good solderability and long-term reliability.

Body Length/Diameter: 4.9 mm

Compact body length/diameter makes it suitable for applications where space is limited.

Termination Type: SOLDER

Solder termination type ensures easy and reliable connection to electronic circuits.

Output Interface Type: 2-WIRE INTERFACE

2-wire interface simplifies communication with other devices and systems.

Mounting Feature: SURFACE MOUNT

Surface mounting feature allows for easy and secure installation on PCBs.

Technical Specifications

Temperature Sensors LM63DIMA attributes and parameters. Explore more Temperature Sensors devices from Texas Instruments

Specs

Body Width:

3.899 inch

Body Height:

1.55 mm

Body Length/Diameter:

4.9 mm

JESD-609 Code:

e0

Mounting Feature:

No. of Bits:

11

Maximum Operating Current:

2 mA

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Output Interface Type:

2-WIRE INTERFACE

Package Shape or Style:

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Terminal Finish:

TIN LEAD

Termination Type:

SOLDER

Trade Compliance

LM63DIMA Sensors & Transducers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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