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LM555MW8

Texas Instruments

LM555MW8 by Texas Instruments

Texas Instruments LM555MW8 is a BIPOLAR PULSE/RECTANGULAR IC with Vsup range of 4.5-16V. It's a surface mount UNCASED CHIP for Analog Waveform Generation, operating at 5V. Ideal for applications requiring precise timing control in electronic circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,663 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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7,663

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-

-

-

Anansix

USA . 1,906 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,906

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-

-

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Digiode

USA . 674 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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674

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 949 parts In-Stock

1+ parts

$4.500

100+ parts

-

1k+ parts

-

10k+ parts

-

949

$4.500

-

-

-

Parana Technologies

USA . 232 parts In-Stock

1+ parts

$12.773

100+ parts

-

1k+ parts

$13.241

10k+ parts

-

232

$12.773

-

$13.241

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ChromeModa Solutions

Germany . 6,175 parts In-Stock

1+ parts

$14.352

100+ parts

$11.769

1k+ parts

-

10k+ parts

-

6,175

$14.352

$11.769

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IDEA Electronic Components Group

UK . 860 parts In-Stock

1+ parts

$14.352

100+ parts

$13.634

1k+ parts

$12.917

10k+ parts

-

860

$14.352

$13.634

$12.917

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AZTECH Wire

Italy . 474 parts In-Stock

1+ parts

$17.722

100+ parts

-

1k+ parts

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474

$17.722

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Corphita

USA . 658 parts In-Stock

1+ parts

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658

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DigiPath Technology Company

USA . 138 parts In-Stock

1+ parts

-

100+ parts

$12.940

1k+ parts

-

10k+ parts

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138

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$12.940

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Overview

Unlock the power of analog waveform generation with the LM555MW8 by Texas Instruments. Known for their top-quality products, Texas Instruments delivers unmatched reliability and performance in the industry. Ideal for pulse and rectangular wave generation, this surface mount chip offers a nominal supply voltage of 5V, making it versatile for various applications. Experience the value and benefits of precision engineering with the LM555MW8, providing customers with the advantage of seamless integration and superior functionality in their projects. Elevate your designs with Texas Instruments today.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for efficient and compact placement of the component on a circuit board, saving space and simplifying assembly.

Nominal Supply Voltage (Vsup): 5 V

The consistent supply voltage of 5V ensures stable and reliable operation of the product within the specified power range.

Package Style (Meter): UNCASED CHIP

The unencased chip package style offers flexibility in mounting options and allows for customization based on specific application requirements.

Terminal Position: UPPER

The upper terminal position simplifies connections and accessibility for integration into various circuits or systems.

Other IC type: PULSE; RECTANGULAR

The inclusion of pulse and rectangular waveforms as IC types provides versatility in waveform generation for a wide range of applications.

Minimum Supply Voltage (Vsup): 4.5 V

The minimum supply voltage of 4.5V ensures compatibility with various power sources and allows for flexibility in operating conditions.

Technology: BIPOLAR

The bipolar technology used in this product offers high precision and accuracy in waveform generation, making it suitable for applications requiring reliable performance.

Terminal Form: NO LEAD

The no-lead terminal form simplifies installation and reduces the risk of solder joints or connection issues, enhancing the overall durability of the product.

Maximum Supply Voltage (Vsup): 16 V

The maximum supply voltage of 16V provides a wide operating range, allowing the product to withstand voltage fluctuations and ensuring long-term reliability in various environments.

Technical Specifications

Analog Waveform Generation LM555MW8 attributes and parameters. Explore more Analog Waveform Generation devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

X-XUUC-N

No. of Functions:

1

Package Body Material:

UNSPECIFIED

Package Code:

DIE

Package Shape:

Package Style (Meter):

UNCASED CHIP

Qualification:

Not Qualified

Maximum Supply Voltage (Vsup):

16 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Technology:

BIPOLAR

Terminal Form:

NO LEAD

Terminal Position:

UPPER

Trade Compliance

LM555MW8 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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