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LM48903TLE/NOPB

Texas Instruments

LM48903TLE/NOPB by Texas Instruments

LM48903TLE/NOPB by Texas Instruments is a Class D audio amplifier with 2 functions, operating at temperatures from -40 to 85°C. It has a max supply current of 19mA and supports power supplies of 1.8V and 3/5V. This surface-mount device with a grid array package is ideal for industrial audio and video applications.

Median Price

$2.243

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 250 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.243

10k+ parts

$2.152

250

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-

$2.243

$2.152

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,615 parts In-Stock

1+ parts

$4.266

100+ parts

-

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4,615

$4.266

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Vyrian

USA . 2,335 parts In-Stock

1+ parts

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100+ parts

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2,335

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,171 parts In-Stock

1+ parts

$3.251

100+ parts

-

1k+ parts

$3.774

10k+ parts

-

1,171

$3.251

-

$3.774

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DigiPath Technology Company

USA . 1,613 parts In-Stock

1+ parts

$3.580

100+ parts

$3.294

1k+ parts

-

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-

1,613

$3.580

$3.294

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-

ChromeModa Solutions

Germany . 6,211 parts In-Stock

1+ parts

$3.653

100+ parts

$2.995

1k+ parts

-

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6,211

$3.653

$2.995

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IDEA Electronic Components Group

UK . 215 parts In-Stock

1+ parts

$3.653

100+ parts

-

1k+ parts

$3.288

10k+ parts

-

215

$3.653

-

$3.288

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Corphita

USA . 478 parts In-Stock

1+ parts

$4.041

100+ parts

-

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478

$4.041

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Microchip USA

USA . 2,414 parts In-Stock

1+ parts

$22.080

100+ parts

$21.940

1k+ parts

$21.880

10k+ parts

$21.810

2,414

$22.080

$21.940

$21.880

$21.810

QUARKTWIN TECHNOLOGY LTD

USA . 9,517 parts In-Stock

1+ parts

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9,517

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iodParts Technologies Inc.

India . 500 parts In-Stock

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500

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Perfect Parts

USA . 475 parts In-Stock

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475

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Overview

Elevate your audio experience with the LM48903TLE/NOPB by Texas Instruments. This top-notch Class D audio amplifier offers unparalleled quality and performance, making it a standout choice in the Audio & Video Amplifiers category. With a sleek rectangular package design and advanced technology, this amplifier delivers crystal-clear sound and efficient power management. Perfect for a wide range of applications, this innovative product provides customers with exceptional value, superior benefits, and unmatched advantages. Upgrade your audio system today with the LM48903TLE/NOPB and enjoy a whole new level of audio excellence.

Feature Benefit Bullets

Surface Mount: YES

This product is easy to install and saves space on the PCB by being surface mounted.

No. of Functions: 2

With multiple functions, this amplifier can handle different audio tasks efficiently.

Package Shape: RECTANGULAR

The rectangular shape allows for easier integration into electronic devices or systems.

General IC Type: CLASS D AUDIO AMPLIFIER

Class D amplifiers are known for their high efficiency and low heat dissipation, making them ideal for audio applications.

Power Supplies (V): 1.8,3/5

Support for multiple power supply voltages allows for flexibility in different applications.

No. of Terminals: 30

The high number of terminals provide connectivity options and support for various components.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

This package style offers a compact design with high component density, suitable for space-constrained applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance even under demanding conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for operation in a wide range of environments.

Terminal Finish: TIN SILVER COPPER

The terminal finish provides durability and ensures good electrical conductivity.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy PCB layout and routing of connections.

Maximum Time At Peak Reflow Temperature (s): 30

Support for peak reflow temperature for a specified duration ensures proper soldering during assembly.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures reliable soldering connections.

Temperature Grade: INDUSTRIAL

Industrial temperature grade means the amplifier can operate in harsh industrial environments.

Terminal Form: BALL

The ball terminal form offers strong mechanical connections and ease of soldering.

Maximum Supply Current: 19 mA

Low supply current ensures power efficiency and minimizes heat generation.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for compact design and high component density on the PCB.

Technical Specifications

Audio & Video Amplifiers LM48903TLE/NOPB attributes and parameters. Explore more Audio & Video Amplifiers devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

R-XBGA-B30

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Terminals:

30

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

BGA30,5X6,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8,3/5

Qualification:

Not Qualified

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

19 mA

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

LM48903TLE/NOPB General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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