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LM3578AMDC

Texas Instruments

LM3578AMDC by Texas Instruments

LM3578AMDC by Texas Instruments is a surface mount switching regulator with boost switcher config. It operates b/w 0-70°C, supports input voltage range of 2-40V, and has max output current of 0.75A. Ideal for applications requiring efficient power conversion in commercial temperature grade environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,838 parts In-Stock

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Digiode

USA . 4,329 parts In-Stock

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4,329

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Anansix

USA . 1,855 parts In-Stock

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One Stop Electronics

USA . 207 parts In-Stock

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$1.500

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207

$1.500

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AZTECH Wire

Italy . 489 parts In-Stock

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$6.201

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489

$6.201

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Parana Technologies

USA . 1,402 parts In-Stock

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$6.488

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$7.234

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1,402

$6.488

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$7.234

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DigiPath Technology Company

USA . 1,896 parts In-Stock

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$7.144

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1,896

$7.144

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ChromeModa Solutions

Germany . 3,743 parts In-Stock

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$7.290

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$5.978

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3,743

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$5.978

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IDEA Electronic Components Group

UK . 2,118 parts In-Stock

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$7.290

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$6.561

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Corphita

USA . 467 parts In-Stock

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467

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Overview

Enhance your electronic designs with the LM3578AMDC from Texas Instruments, a top-of-the-line switching regulator that guarantees high quality and reliability. Ideal for various applications, this product offers a boost switcher configuration and a maximum output current of 0.75 A, ensuring efficient power management. With a wide input voltage range of 2-40 V and a compact surface mount package style, the LM3578AMDC is the perfect choice for your next project. Trust in Texas Instruments to deliver cutting-edge solutions that add value to your designs.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy installation on PCBs, making it suitable for compact designs and mass production.

Package Style (Meter): UNCASED CHIP

Compact and space-saving design for efficient use of board space.

Maximum Operating Temperature: 70 °C

Can operate in relatively high temperature environments without overheating, increasing reliability.

Minimum Operating Temperature: 0 °C

Can operate in low temperature conditions, providing versatility in various environments.

Terminal Position: UPPER

Easy accessibility for wiring and connections.

Other IC type: SWITCHING REGULATOR

Efficient power conversion with minimal energy loss.

Temperature Grade: COMMERCIAL

Suitable for standard commercial applications.

Maximum Switching Frequency: 100 kHz

High switching frequency for fast response and regulation.

Maximum Output Current: 0.75 A

Decent output current for powering various electronic devices.

Terminal Form: NO LEAD

Lead-free terminal form for environmental considerations and RoHS compliance.

Switcher Config: BOOST

Boost configuration for increasing voltage output, suitable for specific applications.

Minimum Input Voltage: 2 V

Can operate at low input voltages, maximizing efficiency.

Maximum Input Voltage: 40 V

Wide input voltage range for versatility in power supply sources.

Technical Specifications

Switching Regulators & Controllers LM3578AMDC attributes and parameters. Explore more Switching Regulators & Controllers devices from Texas Instruments

Specs

Other IC type:

Maximum Input Voltage:

40 V

Minimum Input Voltage:

2 V

JESD-30 Code:

X-XUUC-N

No. of Functions:

1

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Maximum Output Current:

.75 A

Package Body Material:

UNSPECIFIED

Package Code:

DIE

Package Shape:

Package Style (Meter):

UNCASED CHIP

Qualification:

Not Qualified

Surface Mount:

YES

Switcher Config:

BOOST

Maximum Switching Frequency:

100 kHz

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Position:

UPPER

Trade Compliance

LM3578AMDC Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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