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LM350AMDC

Texas Instruments

LM350AMDC by Texas Instruments

LM350AMDC by Texas Instruments is a BIPOLAR technology adjustable regulator with a max output voltage of 33V and max output current of 3A. It operates in temperatures ranging from -40°C to 125°C, making it suitable for various applications requiring precise voltage regulation in challenging environments. This surface-mount device is ideal for power supply designs where space-saving and high performance are essential.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,227 parts In-Stock

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5,227

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Digiode

USA . 705 parts In-Stock

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705

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Anansix

USA . 157 parts In-Stock

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Distributors (Availability)

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Parana Technologies

USA . 1,036 parts In-Stock

1+ parts

$4.734

100+ parts

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$5.231

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1,036

$4.734

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$5.231

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IDEA Electronic Components Group

UK . 1,145 parts In-Stock

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$5.319

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$4.787

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1,145

$5.319

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$4.787

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ChromeModa Solutions

Germany . 956 parts In-Stock

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$5.319

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$4.362

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956

$5.319

$4.362

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AZTECH Wire

Italy . 844 parts In-Stock

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$15.315

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844

$15.315

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One Stop Electronics

USA . 316 parts In-Stock

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$15.500

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316

$15.500

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Corphita

USA . 2,716 parts In-Stock

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DigiPath Technology Company

USA . 1,298 parts In-Stock

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$4.796

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$4.796

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Overview

Unlock the power of reliable voltage regulation with the Texas Instruments LM350AMDC. As a leader in innovative semiconductor solutions, Texas Instruments delivers unparalleled quality and performance in their products. The LM350AMDC is an adjustable regulator that boasts a wide range of applications, making it a versatile solution for various electronic devices. With its surface mount design and high operating temperatures, this regulator offers exceptional value and benefits to customers seeking a dependable and efficient power management solution. Experience the difference with Texas Instruments LM350AMDC.

Feature Benefit Bullets

Surface Mount: YES

This product is surface mountable, making it ideal for compact electronic designs and PCBs.

Operating Temperature (TJ-Max): 125 °C

With a high maximum operating temperature, this regulator can withstand demanding thermal environments.

Technology: BIPOLAR

The bipolar technology used in this regulator ensures stable and reliable performance.

Terminal Form: NO LEAD

The no-lead terminal form factor is suitable for modern manufacturing processes and offers better thermal performance.

Operating Temperature (TJ-Min): -40 °C

With a low minimum operating temperature, this regulator can operate in a wide range of environmental conditions.

Minimum Output Voltage: 1.2 V

The low minimum output voltage allows for precision voltage regulation in various applications.

Package Style (Meter): UNCASED CHIP

The uncase chip package style offers flexibility in mounting options and is suitable for space-constrained designs.

Regulator Type: ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR

Being an adjustable positive single output standard regulator, this product offers versatility and reliable regulation for different voltage outputs.

Terminal Position: UPPER

The upper terminal position makes it easy to integrate this regulator into different circuit layouts and designs.

Maximum Output Voltage: 33 V

With a high maximum output voltage, this regulator can power a wide range of electronic devices and components.

Maximum Output Current: 3 A

The high maximum output current capability ensures that this regulator can provide sufficient power for demanding applications.

Technical Specifications

Adjustable Regulators - Positive Single Output Standard LM350AMDC attributes and parameters. Explore more Adjustable Regulators - Positive Single Output Standard devices from Texas Instruments

Specs

JESD-30 Code:

X-XUUC-N

No. of Functions:

1

Operating Temperature (TJ-Max):

125 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Output Current-1:

3 A

Maximum Output Voltage-1:

33 V

Minimum Output Voltage-1:

1.2 V

Package Body Material:

UNSPECIFIED

Package Code:

DIE

Package Shape:

UNSPECIFIED

Package Style (Meter):

UNCASED CHIP

Qualification Status:

Not Qualified

Surface Mount:

YES

Technology:

BIPOLAR

Terminal Form:

Terminal Position:

UPPER

Trade Compliance

LM350AMDC Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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