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LM331MWC

Texas Instruments

LM331MWC by Texas Instruments

LM331MWC by Texas Instruments is a voltage to frequency converter with 0.02% linearity error, operating at up to 0.1 MHz frequency. It has a supply voltage range of 4.5V to 20V and can handle temperatures from 0°C to 70°C. Ideal for applications requiring precise frequency conversion in commercial-grade environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,243 parts In-Stock

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Anansix

USA . 1,773 parts In-Stock

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Digiode

USA . 1,472 parts In-Stock

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1,472

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One Stop Electronics

USA . 1,373 parts In-Stock

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$6.000

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$6.000

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AZTECH Wire

Italy . 876 parts In-Stock

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$6.656

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876

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Parana Technologies

USA . 1,549 parts In-Stock

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$17.692

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$17.878

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1,549

$17.692

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$17.878

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ChromeModa Solutions

Germany . 6,804 parts In-Stock

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$19.879

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$16.301

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6,804

$19.879

$16.301

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IDEA Electronic Components Group

UK . 426 parts In-Stock

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$19.879

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$18.885

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$17.891

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426

$19.879

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DigiPath Technology Company

USA . 2,184 parts In-Stock

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$17.923

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Corphita

USA . 317 parts In-Stock

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Overview

Unlock the potential of your electronic applications with the LM331MWC by Texas Instruments. As a leader in Analog Special Purpose Converters, Texas Instruments delivers unmatched quality and reliability. This voltage to frequency converter offers precise conversion with minimal linearity error, making it ideal for a wide range of applications. From industrial automation to medical devices, the LM331MWC provides exceptional value, performance, and versatility for all your design needs. Experience the difference with Texas Instruments today.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and compact integration onto circuit boards, saving space and simplifying assembly.

Maximum Supply Voltage: 20 V

Can handle a wide range of supply voltages, making it versatile for various applications.

Maximum Linearity Error (EL): 0.02 %

High level of precision and accuracy in converting voltage to frequency signals.

Package Style (Meter): UNCASED CHIP

Compact and durable packaging suitable for industrial environments.

Minimum Supply Voltage: 4.5 V

Operates efficiently even with relatively low supply voltages.

Maximum Operating Temperature: 70 °C

Can function reliably in high temperature conditions.

Minimum Operating Temperature: 0 °C

Operates in a wide temperature range, suitable for various environments.

Terminal Position: UPPER

Easy accessibility for connecting external components.

Temperature Grade: COMMERCIAL

Meets industry standards for commercial-grade performance.

Technology: BIPOLAR

Utilizes bipolar technology for high performance and accuracy.

Terminal Form: NO LEAD

Eliminates the risk of lead contamination and is more environmentally friendly.

Converter Type: VOLTAGE TO FREQUENCY CONVERTER

Specifically designed for converting voltage signals to frequency signals, suitable for various measurement applications.

Nominal Supply Voltage: 5 V

Optimal operating voltage for efficient performance.

Maximum Negative Input Voltage: -0.2 V

Can handle negative input voltages without issues.

Maximum Positive Input Voltage: 3 V

Can handle a wide range of positive input voltages.

Maximum Operating Frequency: 0.1 MHz

Capable of converting signals at a high frequency, suitable for fast data processing.

Technical Specifications

Analog Special Purpose Converters LM331MWC attributes and parameters. Explore more Analog Special Purpose Converters devices from Texas Instruments

Converter Specifications

Technology:

Bipolar

Maximum Operating Frequency:

100 kHz

Maximum Linearity Error (EL):

0.02 %

No. of Functions:

1

Electrical Specifications

Nominal Supply Voltage:

5 V

Maximum Positive Input Voltage:

3 V

Maximum Negative Input Voltage:

-0.2 V

Minimum Supply Voltage:

4.5 V

Maximum Supply Voltage:

20 V

Operating Conditions

Maximum Operating Temperature:

70 °C (158 °F)

Minimum Operating Temperature:

0 °C (32 °F)

Temperature Grade:

Form Factor

Terminal Position:

Upper

Terminal Form:

Surface Mount:

Yes

Packaging

Package Style:

Uncased Chip

Package Code:

DIE

Standards and Codes

Qualification:

Not Qualified

JESD-30 Code:

X-XUUC-N

Trade Compliance

LM331MWC Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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