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LM3311SQX-HIOP/NOPB

Texas Instruments

LM3311SQX-HIOP/NOPB by Texas Instruments

LM3311SQX-HIOP/NOPB by Texas Instruments is a 24-terminal switching regulator with a max output current of 2.6A and a control mode of current-mode PWM. Operating b/w -40 to 125°C, it's ideal for automotive applications requiring boost switcher configuration at up to 1280kHz frequency.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,772 parts In-Stock

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3,772

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Digiode

USA . 3,150 parts In-Stock

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3,150

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Anansix

USA . 2,329 parts In-Stock

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2,329

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Nova Conductors

Japan . 100 parts In-Stock

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100

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Distributors (Availability)

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Ampacity Inc.

Singapore . 771 parts In-Stock

1+ parts

$2.500

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771

$2.500

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AZTECH Wire

Italy . 312 parts In-Stock

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$5.164

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312

$5.164

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One Stop Electronics

USA . 1,290 parts In-Stock

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$6.500

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1,290

$6.500

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Parana Technologies

USA . 7 parts In-Stock

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$13.802

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$14.287

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7

$13.802

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$14.287

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DigiPath Technology Company

USA . 1,189 parts In-Stock

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$15.198

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$13.982

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1,189

$15.198

$13.982

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IDEA Electronic Components Group

UK . 1,496 parts In-Stock

1+ parts

$15.508

100+ parts

$14.733

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$13.957

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1,496

$15.508

$14.733

$13.957

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ChromeModa Solutions

Germany . 695 parts In-Stock

1+ parts

$15.508

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$12.717

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695

$15.508

$12.717

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Corphita

USA . 4,762 parts In-Stock

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4,762

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Bastille Electronics

Australia . 500 parts In-Stock

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500

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Microchip USA

USA . 110 parts In-Stock

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Overview

Elevate your electronic designs with the LM3311SQX-HIOP/NOPB by Texas Instruments, a cutting-edge switching regulator and controller that offers unmatched quality and reliability. With a sleek square package shape and innovative control mode, this product is perfect for a wide range of applications in automotive and industrial settings. Trust in Texas Instruments' reputation for excellence and experience the value of seamless operation, high efficiency, and advanced performance that the LM3311SQX-HIOP/NOPB brings to your projects. Choose excellence, choose Texas Instruments.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and efficient mounting on PCBs, saving space and simplifying assembly process.

Package Shape: SQUARE

Square shape allows for better utilization of space on the PCB compared to other shapes.

No. of Terminals: 24

Provides ample connectivity options for various components, increasing versatility and functionality.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile enhances thermal management and saves space in the design.

Maximum Operating Temperature: 125 °C

Suitable for applications operating in high-temperature environments, ensuring reliable performance under challenging conditions.

Control Mode: CURRENT-MODE

Current-mode control allows for consistent and stable regulation of output, improving overall efficiency and performance.

Minimum Operating Temperature: -40 °C

Capable of operating in low-temperature conditions, making it suitable for a wide range of environments.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and corrosion resistance, ensuring reliable connections over time.

Terminal Position: QUAD

Quad terminal position allows for easy and secure connection to the PCB, reducing the risk of disconnection or malfunction.

Maximum Seated Height: 0.8 mm

Low seated height enables compact component placement, facilitating miniaturization of the overall system design.

Width (mm): 4 mm

Narrow width saves space on the PCB, making it ideal for compact and densely populated designs.

Other IC type: SWITCHING REGULATOR

Switching regulator technology offers high efficiency and precise voltage regulation, making it suitable for a wide range of applications.

Nominal Input Voltage: 2.5 V

Designed to operate effectively with a nominal input voltage of 2.5V, making it suitable for specific power supply requirements.

Maximum Time At Peak Reflow Temperature (s): 30

Allows for reliable reflow soldering process within a specified time frame, ensuring consistent and robust solder joints.

Peak Reflow Temperature °C: 260

Capable of withstanding high reflow temperatures, ensuring proper soldering and device integrity during assembly.

Length: 4 mm

Compact length helps in space-saving applications, accommodating tight layouts and designs.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, meeting stringent quality and reliability standards required for automotive electronics.

Maximum Switching Frequency: 1280 kHz

High switching frequency allows for fast response and precise control, suitable for demanding power supply requirements.

Maximum Output Current: 2.6 A

Capable of delivering high output current, making it suitable for applications requiring higher power levels.

Terminal Form: NO LEAD

Lead-free terminal form complies with environmental regulations and reduces the risk of lead contamination.

Control Technique: PULSE WIDTH MODULATION

PWM control technique enables efficient and accurate regulation of output voltage, enhancing overall performance and stability.

Switcher Config: BOOST

Boost configuration allows for step-up voltage conversion, ideal for applications requiring higher output voltages than the input.

Terminal Pitch: 0.5 mm

Fine terminal pitch enables precise connection to the PCB, suitable for compact and high-density designs.

Minimum Input Voltage: 2.5 V

Capable of operating with a minimum input voltage of 2.5V, ensuring compatibility with low voltage power sources.

Maximum Input Voltage: 7 V

Supports input voltages up to 7V, making it versatile for a wide range of power supply applications.

Technical Specifications

Switching Regulators & Controllers LM3311SQX-HIOP/NOPB attributes and parameters. Explore more Switching Regulators & Controllers devices from Texas Instruments

Specs

Other IC type:

Control Mode:

CURRENT-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

7 V

Minimum Input Voltage:

2.5 V

Nominal Input Voltage:

2.5 V

JESD-30 Code:

S-XQCC-N24

JESD-609 Code:

e3

Length:

4 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

2.6 A

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC24,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

YES

Switcher Config:

BOOST

Maximum Switching Frequency:

1280 kHz

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

4 mm

Trade Compliance

LM3311SQX-HIOP/NOPB Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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