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LM3351MMX

Texas Instruments

LM3351MMX by Texas Instruments

LM3351MMX by Texas Instruments is a small outline, thin profile switching regulator with 8 terminals. It operates in industrial temperature range (-40 to 85°C) and has a max switching frequency of 275 kHz. Ideal for applications requiring buck-boost switcher configuration at input voltages b/w 2.5V to 3.65V and output voltage of 4.7V.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,563 parts In-Stock

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Digiode

USA . 3,705 parts In-Stock

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Chip Stock

USA . 2,850 parts In-Stock

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Anansix

USA . 2,548 parts In-Stock

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One Stop Electronics

USA . 658 parts In-Stock

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$3.500

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658

$3.500

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Parana Technologies

USA . 1,196 parts In-Stock

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$5.819

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$6.608

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$5.819

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$6.608

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ChromeModa Solutions

Germany . 3,665 parts In-Stock

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$6.538

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$5.361

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$6.538

$5.361

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IDEA Electronic Components Group

UK . 1,904 parts In-Stock

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$6.538

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$5.884

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$6.538

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$5.884

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AZTECH Wire

Italy . 193 parts In-Stock

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$16.173

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A-Z Elektronik GmbH

Germany . 7,273 parts In-Stock

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Corphita

USA . 3,772 parts In-Stock

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Assy Fe

Spain . 1,000 parts In-Stock

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DigiPath Technology Company

USA . 437 parts In-Stock

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$5.895

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Perfect Parts

USA . 392 parts In-Stock

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Overview

Upgrade your power management system with the LM3351MMX by Texas Instruments. As a leader in the industry, Texas Instruments ensures top-notch quality and reliability in their products. The LM3351MMX is a versatile switching regulator & controller that offers high efficiency and precise voltage regulation for a wide range of applications. With its compact design and industrial-grade temperature range, this IC is perfect for demanding environments. Trust Texas Instruments to deliver cutting-edge technology that meets your power management needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight and durable material, ensuring long-lasting performance of the product.

Surface Mount: YES

Surface mount technology allows for efficient and compact PCB design, saving space in electronic devices.

Maximum Operating Temperature: 85 °C

Can operate in high temperature environments, making it suitable for industrial applications.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, enhancing the efficiency of the regulator.

Nominal Input Voltage: 3.3 V

Compatible with common voltage supplies, ensuring ease of integration into various electronic systems.

Nominal Output Voltage: 4.7 V

Provides a stable output voltage for powering sensitive electronic components in the circuit.

Technical Specifications

Switching Regulators & Controllers LM3351MMX attributes and parameters. Explore more Switching Regulators & Controllers devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 5V INPUT VOLTAGE

Maximum Input Voltage:

3.65 V

Minimum Input Voltage:

2.5 V

Nominal Input Voltage:

3.3 V

JESD-30 Code:

S-PDSO-G8

Length:

3 mm

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Nominal Output Voltage:

4.7 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Maximum Seated Height:

1.09 mm

Surface Mount:

YES

Switcher Config:

BUCK-BOOST

Maximum Switching Frequency:

275 kHz

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width (mm):

3 mm

Trade Compliance

LM3351MMX Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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