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LM3000EVAL/NOPB

Texas Instruments

LM3000EVAL/NOPB by Texas Instruments

LM3000EVAL/NOPB by Texas Instruments is a DC/DC SMPS Evaluation Board for step-down applications. It offers 2 non-isolated outputs at 1.2V and 3.3V with output currents of 15A and 8A respectively. Operating at an input voltage range of 6V to 18V, this board features a Buck regulator topology and switching frequency of 500kHz, making it ideal for power supply development projects.

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Lifecycle Status

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1k+

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Vyrian

USA . 6,558 parts In-Stock

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AZTECH Wire

Italy . 502 parts In-Stock

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One Stop Electronics

USA . 1,401 parts In-Stock

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Component Stockers USA

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Semicontronic

India . 1,416 parts In-Stock

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DigiPath Technology Company

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IDEA Electronic Components Group

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ChromeModa Solutions

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Parana Technologies

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Overview

Discover the LM3000EVAL/NOPB by Texas Instruments, a top-of-the-line evaluation board that showcases the superior quality and innovation the manufacturer is known for. Designed for DC/DC applications, this board offers non-isolated outputs, a regulator topology of Buck, and a frequency switching of 500kHz. With a voltage input range of 6V to 18V and output options of 1.2V and 3.3V, this board is perfect for a variety of projects requiring efficient power management. Experience the value, benefits, and advantages this board brings to your development process. Elevate your designs with the LM3000EVAL/NOPB today!

Feature Benefit Bullets

Other Names: LM3000EVALNOPB

Easy to identify and locate the product for ordering or technical support

Category: Development Boards, Kits, Programmers, Evaluation Boards

Designed for testing and evaluating DC/DC & AC/DC SMPS applications

Main Purpose: DC/DC, Step Down

Specifically meant for step-down voltage applications

Outputs and Type: 2, Non-Isolated

Provides two non-isolated output voltages for versatility in usage

Voltage - Output: 1.2V, 3.3V

Offers commonly used output voltages for various electronic components

Current - Output: 15A, 8A

Capable of delivering high output currents for power-hungry devices

Voltage - Input: 6V ~ 18V

Accepts a wide range of input voltages for flexibility in power sources

Regulator Topology: Buck

Efficient buck regulator design for step-down voltage conversion

Frequency - Switching: 500kHz

High switching frequency for smoother voltage regulation and reduced component size

Board Type: Fully Populated

Ready-to-use board with all required components installed for quick testing

Supplied Contents: Board(s)

Comes with the necessary board(s) for immediate evaluation and testing

Utilized IC / Part: LM3000

Utilizes the LM3000 IC for efficient power conversion and regulation

Base Product Number: LM3000

Based on the LM3000 series of ICs known for reliability and performance

Moisture Sensitivity Level (MSL): 1 (Unlimited)

Low moisture sensitivity level ensures product reliability in various environments

Technical Specifications

Additional Parts LM3000EVAL/NOPB attributes and parameters. Explore more Additional Parts devices from Texas Instruments

Technical Specifications

Main Purpose:

DC/DC, Step Down

Other Names:

LM3000EVALNOPB

Category:

Development Boards, Kits, Programmers
Evaluation Boards DC/DC & AC/DC (Off-Line) SMPS Evaluation Boards

Current - Output:

15A, 8A

Standard Package:

1

Regulator Topology:

Buck

Frequency - Switching:

500kHz

Supplied Contents:

Board(s)

Voltage - Output:

1.2V, 3.3V

Board Type:

Fully Populated

Outputs and Type:

2, Non-Isolated

Utilized IC / Part:

LM3000

Package:

Box

Voltage - Input:

6V ~ 18V

Base Product Number:

LM3000

Moisture Sensitivity Level (MSL):

1 (Unlimited)

Trade Compliance

LM3000EVAL/NOPB Miscellaneous Components trade compliance attributes, and parameters.

ECCN

EAR99

HTS

8504.40.9580

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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