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LM2917D14

Texas Instruments

LM2917D14 by Texas Instruments

LM2917D14 by Texas Instruments is a voltage to frequency converter with 1% linearity error, operating at 12V. It comes in a small outline package with 14 terminals and can withstand industrial temperatures from -40°C to 85°C. Ideal for applications requiring precise frequency output in compact spaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,370 parts In-Stock

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Digiode

USA . 3,131 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 481 parts In-Stock

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Holdelec - ElecDif-Pro

France . 481 parts In-Stock

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LittleDiode

UK . 2 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 503 parts In-Stock

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$14.795

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503

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Parana Technologies

USA . 1,141 parts In-Stock

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$19.080

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$19.129

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$19.080

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$19.129

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DigiPath Technology Company

USA . 1,725 parts In-Stock

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$21.009

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$19.329

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$21.009

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ChromeModa Solutions

Germany . 1,281 parts In-Stock

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$21.438

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$17.579

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IDEA Electronic Components Group

UK . 396 parts In-Stock

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$21.438

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$20.366

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$19.294

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One Stop Electronics

USA . 907 parts In-Stock

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$27.000

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Corphita

USA . 1,334 parts In-Stock

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Overview

Unlock a world of precision and reliability with the LM2917D14 by Texas Instruments. As a leader in analog special purpose converters, Texas Instruments delivers top-quality products for various applications. The LM2917D14 stands out with its high linearity error of only 1%, making it a valuable tool for voltage to frequency conversion. With a compact small outline package and industrial-grade temperature range, this converter offers unmatched performance and durability. Trust Texas Instruments to provide innovative solutions that exceed your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components, ensuring a long lifespan for the product.

Surface Mount: YES

Allows for easy and convenient integration onto circuit boards, saving space and simplifying the assembly process.

Maximum Linearity Error (EL): 1 %

High accuracy ensures precise conversion of voltage to frequency, making it reliable for various applications.

Power Supplies (V): 12

With a power supply of 12V, this converter can handle a wide range of input voltages, suitable for many industrial applications.

No. of Terminals: 14

Sufficient terminals for connection to external components, offering flexibility in circuit design and functionality.

Maximum Operating Temperature: 85 °C

Capable of operating in high-temperature environments, making it suitable for industrial applications where heat may be a concern.

Technology: BIPOLAR

Bipolar technology ensures accurate and stable voltage to frequency conversion, providing reliable performance in diverse conditions.

Technical Specifications

Analog Special Purpose Converters LM2917D14 attributes and parameters. Explore more Analog Special Purpose Converters devices from Texas Instruments

Converter Specifications

Technology:

Bipolar

Maximum Linearity Error (EL):

1 %

No. of Functions:

1

Electrical Specifications

Nominal Supply Voltage:

12 V

Power Supplies:

12 V

Operating Conditions

Maximum Operating Temperature:

85 °C (185 °F)

Minimum Operating Temperature:

-40 °C (-40 °F)

Temperature Grade:

Form Factor

Terminal Position:

Dual

Terminal Form:

No. of Terminals:

14

Terminal Pitch:

0.05 in (1.27 mm)

Surface Mount:

Yes

Width:

0.154 in (3.9 mm)

Length:

0.341 in (8.65 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

Small Outline

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Standards and Codes

Qualification:

Not Qualified

JESD-30 Code:

R-PDSO-G14

Trade Compliance

LM2917D14 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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