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LM25066IAPSQ/NOPB

Texas Instruments

LM25066IAPSQ/NOPB by Texas Instruments

LM25066IAPSQ/NOPB by Texas Instruments is a Power Management IC with 12V nominal voltage and 500A max output current. It features a rectangular package shape, operates in automotive temperature grade, and supports power supply circuits. Ideal for applications requiring low profile and surface mount compatibility.

Median Price

$4.337

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 68,000 parts In-Stock

1+ parts

$4.337

100+ parts

$3.536

1k+ parts

$2.357

10k+ parts

-

68,000

$4.337

$3.536

$2.357

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,496 parts In-Stock

1+ parts

$4.120

100+ parts

-

1k+ parts

-

10k+ parts

-

3,496

$4.120

-

-

-

Chip Stock

USA . 25,100 parts In-Stock

1+ parts

-

100+ parts

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25,100

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-

-

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Vyrian

USA . 8,171 parts In-Stock

1+ parts

-

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-

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8,171

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-

-

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Netsource Technology, Inc.

USA . 5,000 parts In-Stock

1+ parts

-

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5,000

-

-

-

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Semi Source

USA . 138 parts In-Stock

1+ parts

-

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-

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138

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-

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-

Speed Components Ltd

Israel . 15 parts In-Stock

1+ parts

-

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-

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15

-

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,176 parts In-Stock

1+ parts

$3.903

100+ parts

-

1k+ parts

-

10k+ parts

-

3,176

$3.903

-

-

-

Component Stockers USA

USA . 5,332 parts In-Stock

1+ parts

$7.780

100+ parts

$7.400

1k+ parts

$7.160

10k+ parts

-

5,332

$7.780

$7.400

$7.160

-

AZTECH Wire

Italy . 150 parts In-Stock

1+ parts

$12.520

100+ parts

-

1k+ parts

-

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150

$12.520

-

-

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Parana Technologies

USA . 699 parts In-Stock

1+ parts

$12.521

100+ parts

-

1k+ parts

$12.969

10k+ parts

-

699

$12.521

-

$12.969

-

DigiPath Technology Company

USA . 2,225 parts In-Stock

1+ parts

$13.787

100+ parts

$12.684

1k+ parts

-

10k+ parts

-

2,225

$13.787

$12.684

-

-

IDEA Electronic Components Group

UK . 2,192 parts In-Stock

1+ parts

$14.068

100+ parts

$13.365

1k+ parts

$12.661

10k+ parts

-

2,192

$14.068

$13.365

$12.661

-

ChromeModa Solutions

Germany . 1,678 parts In-Stock

1+ parts

$14.068

100+ parts

$11.536

1k+ parts

-

10k+ parts

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1,678

$14.068

$11.536

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Lixinc

USA . 15,878 parts In-Stock

1+ parts

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15,878

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QUARKTWIN TECHNOLOGY LTD

USA . 8,640 parts In-Stock

1+ parts

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8,640

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A-Z Elektronik GmbH

Germany . 7,309 parts In-Stock

1+ parts

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7,309

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Alle Elektronik GmbH

Germany . 4,206 parts In-Stock

1+ parts

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4,206

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-

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Metaverse IC Inc.

Canada . 3,000 parts In-Stock

1+ parts

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3,000

-

-

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Futuretech Components

Singapore . 2,250 parts In-Stock

1+ parts

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2,250

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Authorized Procurement Solutions

USA . 1,400 parts In-Stock

1+ parts

-

100+ parts

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1,400

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-

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GreenTree Electronics

Israel . 1,000 parts In-Stock

1+ parts

-

100+ parts

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1,000

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Overview

Experience superior power management with the LM25066IAPSQ/NOPB by Texas Instruments. As a leader in the industry, Texas Instruments delivers top-quality Power Management ICs that are surface mountable and designed for various applications. With a nominal supply voltage of 12V, this chip carrier offers excellent performance and reliability. Whether you're in the automotive sector or require power supply support circuits, this product provides the value, benefits, and advantages you need to enhance your projects. Trust Texas Instruments for cutting-edge solutions that meet your power management needs.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and efficient PCB assembly, saving time and effort during manufacturing.

Nominal Supply Voltage (Vsup): 12 V

Suitable for various applications that require a stable 12V power supply.

Maximum Operating Temperature: 125 °C

Ensures reliable operation even in high-temperature environments, making it suitable for industrial or automotive use.

Minimum Operating Temperature: -40 °C

Provides a wide temperature range for operation, allowing for use in both hot and cold conditions.

Maximum Output Current: 500 A

Capable of providing a high output current, making it suitable for powering devices with high power requirements.

Temperature Grade: AUTOMOTIVE

Designed to meet automotive industry standards for reliability and performance in vehicles.

Technical Specifications

Power Management ICs LM25066IAPSQ/NOPB attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-XQCC-N24

JESD-609 Code:

e3

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

500 A

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC24,.16X.2,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

12

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

8 mA

Maximum Supply Voltage (Vsup):

17 V

Minimum Supply Voltage (Vsup):

2.9 V

Nominal Supply Voltage (Vsup):

12 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

4 mm

Trade Compliance

LM25066IAPSQ/NOPB Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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