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LM25056APSQX/NOPB

Texas Instruments

LM25056APSQX/NOPB by Texas Instruments

LM25056APSQX/NOPB by Texas Instruments is a Power Management IC with 24 terminals, operating b/w -40 to 125 °C. It has an adjustable threshold voltage of +2.4V and supports supply voltages from 3V to 17V. Ideal for automotive applications due to its compact size and high-temperature tolerance up to 260C.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,396 parts In-Stock

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Digiode

USA . 1,862 parts In-Stock

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Semicontronic

India . 1,061 parts In-Stock

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$0.500

100+ parts

$0.488

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$0.485

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1,061

$0.500

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$0.485

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Ampacity Inc.

Singapore . 465 parts In-Stock

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$1.500

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One Stop Electronics

USA . 1,327 parts In-Stock

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$2.500

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Parana Technologies

USA . 1,867 parts In-Stock

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$7.988

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$8.568

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$7.988

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$8.568

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ChromeModa Solutions

Germany . 3,523 parts In-Stock

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$8.975

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$7.360

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$8.975

$7.360

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IDEA Electronic Components Group

UK . 2,292 parts In-Stock

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$8.975

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$8.526

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$8.078

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2,292

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$8.078

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AZTECH Wire

Italy . 347 parts In-Stock

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$13.123

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QUARKTWIN TECHNOLOGY LTD

USA . 28,338 parts In-Stock

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Corphita

USA . 4,059 parts In-Stock

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DigiPath Technology Company

USA . 621 parts In-Stock

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$8.092

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Corohmni

South Africa . 494 parts In-Stock

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Microchip USA

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Overview

Experience unparalleled power management capabilities with the LM25056APSQX/NOPB by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments ensures top-notch quality and reliability in all their products. The LM25056APSQX/NOPB falls under the Power Management ICs category, making it a versatile solution for various applications. With a wide voltage range and compact design, this product offers customers exceptional value and benefits. Trust in Texas Instruments to deliver cutting-edge technology that meets your power management needs effortlessly.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and convenient installation onto circuit boards, saving time and effort in production.

Nominal Supply Voltage (Vsup): 12 V

Provides a stable and common supply voltage, suitable for a wide range of applications.

Minimum Operating Temperature: -40 °C

Ensures reliable operation even in extremely cold environments, making it suitable for various conditions.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, ideal for applications where heat dissipation is a concern.

Terminal Finish: MATTE TIN

Ensures good conductivity and corrosion resistance on the terminals, improving the overall performance and longevity of the product.

Maximum Seated Height: 0.8 mm

Compact design with low profile allows for space-saving installation, especially in devices with limited space.

Nominal Threshold Voltage (V): +2.4V

Provides a specific voltage threshold for triggering certain actions, increasing the precision and accuracy of the device.

Temperature Grade: AUTOMOTIVE

Suitable for automotive applications where temperature fluctuations are common, ensuring reliable performance in harsh conditions.

Adjustable Threshold: YES

Offers flexibility to adjust the threshold voltage as needed for different applications, providing customization and versatility.

Technical Specifications

Power Management ICs LM25056APSQX/NOPB attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

RESET THRESHOLD VOLTAGE IS 2.4 VOLT

Adjustable Threshold:

YES

JESD-30 Code:

R-XQCC-N24

JESD-609 Code:

e3

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.8 mm

Maximum Supply Voltage (Vsup):

17 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

12 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Nominal Threshold Voltage (V):

+2.4V

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

4 mm

Trade Compliance

LM25056APSQX/NOPB Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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