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LM201AU

Texas Instruments

LM201AU by Texas Instruments

LM201AU by Texas Instruments is an operational amplifier with a max input offset voltage of 3000uV, suitable for applications requiring precise voltage amplification. With a power supply range of +-5/+-20V and operating temperatures from -25 to 85°C, it offers stable performance in various environments. This op amp features a ceramic package body material, surface mount capability, and a flatpack style making it versatile for electronic circuit designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,702 parts In-Stock

1+ parts

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5,702

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Digiode

USA . 4,955 parts In-Stock

1+ parts

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4,955

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 655 parts In-Stock

1+ parts

$4.410

100+ parts

-

1k+ parts

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655

$4.410

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-

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Parana Technologies

USA . 105 parts In-Stock

1+ parts

$5.150

100+ parts

-

1k+ parts

$5.746

10k+ parts

-

105

$5.150

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$5.746

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DigiPath Technology Company

USA . 425 parts In-Stock

1+ parts

$5.670

100+ parts

$5.217

1k+ parts

-

10k+ parts

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425

$5.670

$5.217

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ChromeModa Solutions

Germany . 6,051 parts In-Stock

1+ parts

$5.786

100+ parts

$4.745

1k+ parts

-

10k+ parts

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6,051

$5.786

$4.745

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IDEA Electronic Components Group

UK . 1,298 parts In-Stock

1+ parts

$5.786

100+ parts

-

1k+ parts

$5.207

10k+ parts

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1,298

$5.786

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$5.207

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AZTECH Wire

Italy . 205 parts In-Stock

1+ parts

$12.056

100+ parts

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205

$12.056

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Corphita

USA . 4,668 parts In-Stock

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4,668

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Overview

Elevate your circuit designs with the LM201AU from Texas Instruments, a premium quality operational amplifier that delivers unmatched performance and reliability. Manufactured by the industry leader in semiconductor technology, this op amp is perfect for a wide range of applications, from precision instrumentation to audio amplification. With its innovative design and superior components, the LM201AU offers customers exceptional value, ensuring optimal functionality and efficiency in their projects. Experience the difference with Texas Instruments' LM201AU - where quality meets innovation.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic material provides excellent thermal conductivity and high temperature resistance, making this product suitable for applications with stringent temperature requirements.

Maximum Input Offset Voltage: 3000 uV

Low input offset voltage contributes to high precision in signal processing applications, ensuring accurate output results.

Surface Mount: YES

Surface mounting capability simplifies assembly processes and allows for compact and space-efficient circuit designs.

Power Supplies (V): +-5/+-20

Wide range of power supply voltages accommodates various operating conditions, offering flexibility in system integration.

No. of Terminals: 10

Sufficient number of terminals for connectivity and functionality, enabling versatile circuit configurations.

Package Style (Meter): FLATPACK

Flatpack package style facilitates easy handling and installation, enhancing user convenience.

Maximum Operating Temperature: 85 °C

High maximum operating temperature tolerance ensures reliable performance in demanding environmental conditions.

Maximum Bias Current (IIB) @25°C: 0.075 uA

Low bias current minimizes input signal distortion and enhances signal fidelity in amplification applications.

Minimum Operating Temperature: -25 °C

Wide temperature range support enables the device to operate in both extreme hot and cold environments.

Terminal Position: DUAL

Dual terminal configuration allows for differential signal processing, improving noise rejection and signal quality.

Technology: BIPOLAR

Bipolar technology offers high input impedance and low output impedance, ideal for precise signal amplification and processing.

Terminal Form: FLAT

Flat terminal form ensures secure and stable connections, reducing the risk of signal loss or interference.

Amplifier Type: OPERATIONAL AMPLIFIER

Operational amplifier design provides high gain, bandwidth, and input impedance, making it suitable for various signal processing applications.

Architecture: VOLTAGE-FEEDBACK

Voltage-feedback architecture offers stable and predictable performance characteristics, ensuring consistent operation over a wide range of operating conditions.

Terminal Pitch: 1.27 mm

Fine terminal pitch allows for precise and compact circuit layout, optimizing signal transmission efficiency and reducing parasitic effects.

Technical Specifications

Operational Amplifiers (Op Amps) LM201AU attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

BIPOLAR

Power Supply:

±5/±20 V

Total Functions:

1

Sub-Category:

Operational Amplifiers

Frequency Compensation:

No

Low-Offset:

No

Performance Specifications

Input Offset Voltage Limit:

3000 uV

Maximum Bias Current (IIB) @25 °C:

75 nA

Operational Characteristics

Lowest Operating Temperature:

-25 °C (-13 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Physical Characteristics

Total Terminals:

10

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Package Body Material:

Ceramic

Surface Mount:

Yes

Manufacturing and Reliability

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-XDFP-F10

Packaging and Shipping

Package Code:

DFP

Package Shape:

Package Style:

Flatpack

Package Equivalence Code:

FL10,.3

Trade Compliance

LM201AU Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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