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ISO107P

Texas Instruments

ISO107P by Texas Instruments

The Texas Instruments ISO107P is an isolation amplifier with a 20 MHz bandwidth and 2500 V isolation voltage. With a package size of 40.64mm x 22.86mm x 9.4mm, it's ideal for applications requiring high common mode voltage protection in industrial settings. The device operates b/w -25°C to 85°C, making it suitable for various temperature conditions.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,511 parts In-Stock

1+ parts

-

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8,511

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Digiode

USA . 1,718 parts In-Stock

1+ parts

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1,718

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,315 parts In-Stock

1+ parts

$1.300

100+ parts

-

1k+ parts

$2.051

10k+ parts

-

1,315

$1.300

-

$2.051

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DigiPath Technology Company

USA . 1,131 parts In-Stock

1+ parts

$1.432

100+ parts

$1.317

1k+ parts

-

10k+ parts

-

1,131

$1.432

$1.317

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ChromeModa Solutions

Germany . 2,081 parts In-Stock

1+ parts

$1.461

100+ parts

$1.198

1k+ parts

-

10k+ parts

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2,081

$1.461

$1.198

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IDEA Electronic Components Group

UK . 2,030 parts In-Stock

1+ parts

$1.461

100+ parts

-

1k+ parts

$1.315

10k+ parts

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2,030

$1.461

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$1.315

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One Stop Electronics

USA . 2,755 parts In-Stock

1+ parts

$3.410

100+ parts

-

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10k+ parts

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2,755

$3.410

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AZTECH Wire

Italy . 478 parts In-Stock

1+ parts

$10.127

100+ parts

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478

$10.127

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Corphita

USA . 2,446 parts In-Stock

1+ parts

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2,446

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Overview

Experience superior quality and performance with the Texas Instruments ISO107P isolation amplifier. Designed by a trusted manufacturer, this product offers unparalleled reliability and precision in a wide range of applications. From industrial automation to medical equipment, the ISO107P provides essential isolation while delivering optimal signal transmission. Invest in excellence with the Texas Instruments ISO107P and enjoy the peace of mind that comes with top-tier technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring long-term reliability.

Nominal Supply Voltage / Vsup (V): 15

Optimal supply voltage for stable operation and performance.

Maximum Common Mode Voltage: 2500 V

High common mode voltage tolerance provides excellent protection against electrical interference.

Nominal Bandwidth (3dB): 20 MHz

Wide bandwidth allows for accurate signal transmission across various frequencies.

Minimum Isolation Voltage: 2500 V

High isolation voltage ensures safety and protection for sensitive equipment and personnel.

Technical Specifications

Isolation Amplifiers ISO107P attributes and parameters. Explore more Isolation Amplifiers devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Total Functions:

1

Performance Specifications

Nominal Bandwidth (3dB):

20 MHz

Maximum Common Mode Voltage:

2.5 KV

Operational Characteristics

Nominal Supply Voltage:

15 V

Maximum Supply Voltage:

18 V

Nominal Negative Supply Voltage (Vsup):

-15 V

Maximum Negative Supply Voltage:

-18 V

Lowest Operating Temperature:

-25 °C (-13 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Minimum Isolation Voltage:

2.5 KV

Physical Characteristics

Length:

1.6 in (40.64 mm)

Width:

0.9 in (22.86 mm)

Maximum Seated Height:

0.37 in (9.4 mm)

Total Terminals:

16

Terminal Pitch:

0.1 in (2.54 mm)

Terminal Position:

Dual

Terminal Form:

Package Body Material:

Plastic/Epoxy

Surface Mount:

No

Manufacturing and Reliability

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDIP-T16

Packaging and Shipping

Package Code:

DIP

Package Shape:

Package Style:

In-Line

Trade Compliance

ISO107P Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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