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INA293A1IDBVR

Texas Instruments

INA293A1IDBVR by Texas Instruments

Texas Instruments' INA293A1IDBVR is a 5V Analog Circuit IC with 5 terminals. It operates b/w -40 to 125°C, suitable for automotive applications. The small outline package measures 2.9mm x 1.6mm x 1.45mm and supports surface mount technology, making it ideal for compact designs in various electronic systems.

Median Price

$2.125

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 22,438 parts In-Stock

1+ parts

$2.471

100+ parts

$2.041

1k+ parts

$1.103

10k+ parts

-

22,438

$2.471

$2.041

$1.103

-

Mouser Electronics

USA . 6,046 parts In-Stock

1+ parts

$3.350

100+ parts

$2.080

1k+ parts

$1.890

10k+ parts

$1.770

6,046

$3.350

$2.080

$1.890

$1.770

DigiKey

USA . 3,853 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$1.779

3,853

-

-

-

$1.779

Arrow

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

$1.436

3,000

-

-

-

$1.436

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 500 parts In-Stock

1+ parts

$1.655

100+ parts

-

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-

10k+ parts

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500

$1.655

-

-

-

Digiode

USA . 3,970 parts In-Stock

1+ parts

$2.347

100+ parts

-

1k+ parts

-

10k+ parts

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3,970

$2.347

-

-

-

Chip Stock

USA . 17,330 parts In-Stock

1+ parts

-

100+ parts

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17,330

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Vyrian

USA . 10,238 parts In-Stock

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10,238

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 7,644 parts In-Stock

1+ parts

$1.220

100+ parts

$1.190

1k+ parts

$1.183

10k+ parts

-

7,644

$1.220

$1.190

$1.183

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Ampacity Inc.

Singapore . 7,598 parts In-Stock

1+ parts

$1.220

100+ parts

-

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7,598

$1.220

-

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Continental Prestige Electronics

USA . 2,151 parts In-Stock

1+ parts

$1.655

100+ parts

-

1k+ parts

-

10k+ parts

$1.621

2,151

$1.655

-

-

$1.621

Argo Parts USA

USA . 2,145 parts In-Stock

1+ parts

$1.655

100+ parts

-

1k+ parts

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2,145

$1.655

-

-

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Corphita

USA . 3,552 parts In-Stock

1+ parts

$2.224

100+ parts

-

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10k+ parts

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3,552

$2.224

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

1+ parts

$3.139

100+ parts

$2.982

1k+ parts

$2.982

10k+ parts

-

3,000

$3.139

$2.982

$2.982

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Parana Technologies

USA . 885 parts In-Stock

1+ parts

$16.704

100+ parts

$1,551.258

1k+ parts

$15.034

10k+ parts

-

885

$16.704

$1,551.258

$15.034

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DigiPath Technology Company

USA . 488 parts In-Stock

1+ parts

$18.394

100+ parts

$16.922

1k+ parts

-

10k+ parts

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488

$18.394

$16.922

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-

ChromeModa Solutions

Germany . 1,928 parts In-Stock

1+ parts

$18.769

100+ parts

$15.391

1k+ parts

-

10k+ parts

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1,928

$18.769

$15.391

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IDEA Electronic Components Group

UK . 1,407 parts In-Stock

1+ parts

$18.769

100+ parts

$17.831

1k+ parts

$16.892

10k+ parts

-

1,407

$18.769

$17.831

$16.892

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Corohmni

South Africa . 364 parts In-Stock

1+ parts

$23.841

100+ parts

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364

$23.841

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Lixinc

USA . 7,062 parts In-Stock

1+ parts

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7,062

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A-Z Elektronik GmbH

Germany . 6,000 parts In-Stock

1+ parts

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6,000

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Authorized Procurement Solutions

USA . 940 parts In-Stock

1+ parts

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940

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Overview

Experience top-notch quality and performance with the Texas Instruments INA293A1IDBVR. As a leading manufacturer in the semiconductor industry, Texas Instruments delivers unparalleled reliability and innovation. The INA293A1IDBVR falls under the category of Other Function Semiconductors and is perfect for a wide range of applications. With its small outline, low profile package style, and dual terminal position, this product offers exceptional value and benefits to customers seeking high-quality analog circuit solutions. Trust Texas Instruments for cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the semiconductor, making it a reliable choice for various applications.

Surface Mount: YES

The surface mount design allows for easy installation and space-saving on circuit boards, making it convenient for compact electronics.

Package Shape: RECTANGULAR

The rectangular shape offers compatibility with standard circuit board layouts, ensuring easy integration into existing designs.

Nominal Supply Voltage (Vsup): 5 V

The 5V supply voltage is a common and widely supported power requirement, making this semiconductor versatile for a range of projects.

No. of Terminals: 5

With 5 terminals, this semiconductor provides multiple connection points for enhanced functionality and flexibility in circuit design.

Package Style (Meter): SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

This compact and low-profile package style saves space on the circuit board, ideal for applications with limited room.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures reliability in challenging environments, making this semiconductor suitable for industrial applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for reliable performance in cold conditions, expanding the range of possible applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish offers excellent conductivity and corrosion resistance, ensuring long-term performance and reliability.

Terminal Position: DUAL

Dual terminal positions provide increased connectivity options, allowing for versatile circuit configurations and enhanced functionality.

Maximum Seated Height: 1.45 mm

The low seated height minimizes the overall profile of the semiconductor, making it suitable for applications with space constraints.

Width (mm): 1.6 mm

The narrow width of 1.6mm allows for compact PCB layouts, making this semiconductor ideal for use in small electronic devices.

Other IC type: ANALOG CIRCUIT

An analog circuit type offers precise signal processing capabilities, making this semiconductor suitable for applications requiring accurate and stable analog performance.

Minimum Supply Voltage (Vsup): 2.7 V

The low minimum supply voltage of 2.7V enables energy-efficient operation, making this semiconductor cost-effective and suitable for battery-powered devices.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures proper soldering and reliable connections during manufacturing processes.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C enables secure solder joints, ensuring a durable and reliable connection in various assembly processes.

Length: 2.9 mm

The compact length of 2.9mm allows for efficient use of space on the circuit board, making this semiconductor suitable for compact electronic designs.

Temperature Grade: AUTOMOTIVE

The automotive temperature grade certification ensures reliable performance in harsh environmental conditions, making this semiconductor suitable for automotive applications.

Terminal Form: GULL WING

The gull-wing terminal form provides secure connections and ease of soldering, making this semiconductor suitable for automated assembly processes.

Terminal Pitch: 0.95 mm

The narrow terminal pitch of 0.95mm allows for high-density mounting on the PCB, making this semiconductor ideal for applications requiring space-saving designs.

Maximum Supply Voltage (Vsup): 20 V

The high maximum supply voltage of 20V provides flexibility for powering various components, making this semiconductor versatile for a wide range of applications.

Technical Specifications

Other Function Semiconductors INA293A1IDBVR attributes and parameters. Explore more Other Function Semiconductors devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Length:

2.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.45 mm

Maximum Supply Voltage (Vsup):

20 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

1.6 mm

Trade Compliance

INA293A1IDBVR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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