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INA214AIDCKTG4

Texas Instruments

INA214AIDCKTG4 by Texas Instruments

Texas Instruments' INA214AIDCKTG4 is a small outline, thin profile operational amplifier with 6 terminals. It has a rectangular package shape made of plastic/epoxy material and matte tin terminal finish. Ideal for automotive applications due to its compact size, dual terminal position, and high peak reflow temperature of 260°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 44,470 parts In-Stock

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44,470

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Vyrian

USA . 4,413 parts In-Stock

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4,413

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Digiode

USA . 3,349 parts In-Stock

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3,349

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Euro-Tech

UK . 250 parts In-Stock

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250

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Semi Source

USA . 190 parts In-Stock

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190

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Nova Conductors

Japan . 150 parts In-Stock

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150

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Connector Distribution Corp

USA . 67 parts In-Stock

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67

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Right Parts Inc.

USA . 67 parts In-Stock

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67

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 515 parts In-Stock

1+ parts

$0.410

100+ parts

-

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515

$0.410

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Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$1.644

100+ parts

$1.562

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$1.562

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500

$1.644

$1.562

$1.562

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Parana Technologies

USA . 1,133 parts In-Stock

1+ parts

$3.095

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$3.613

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1,133

$3.095

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$3.613

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DigiPath Technology Company

USA . 1,484 parts In-Stock

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$3.408

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$3.136

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1,484

$3.408

$3.136

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ChromeModa Solutions

Germany . 3,527 parts In-Stock

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$3.478

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$2.852

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3,527

$3.478

$2.852

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IDEA Electronic Components Group

UK . 454 parts In-Stock

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$3.478

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$3.130

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454

$3.478

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$3.130

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Corohmni

South Africa . 169 parts In-Stock

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$5.352

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169

$5.352

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One Stop Electronics

USA . 791 parts In-Stock

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$6.410

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791

$6.410

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Semicontronic

India . 1,484 parts In-Stock

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$7.410

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$7.225

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$7.188

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1,484

$7.410

$7.225

$7.188

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AZTECH Wire

Italy . 733 parts In-Stock

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$10.523

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733

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Component Stockers USA

USA . 528 parts In-Stock

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$99.990

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528

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QUARKTWIN TECHNOLOGY LTD

USA . 20,579 parts In-Stock

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Continental Prestige Electronics

USA . 1,827 parts In-Stock

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Microchip USA

USA . 1,404 parts In-Stock

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Argo Parts USA

USA . 961 parts In-Stock

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961

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Bastille Electronics

Australia . 300 parts In-Stock

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300

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Corphita

USA . 265 parts In-Stock

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265

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Overview

The Texas Instruments INA214AIDCKTG4 is a high-quality operational amplifier that offers precision and reliability for a wide range of applications. With Texas Instruments' reputation for excellence in manufacturing, customers can trust that this product will meet their needs with superior performance. Whether used in automotive systems, industrial equipment, or consumer electronics, this op amp delivers value by providing accurate signal amplification and low power consumption. Experience the benefits of quality engineering and advanced technology with the INA214AIDCKTG4 from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and helps in protecting internal components of the operational amplifier.

Surface Mount: YES

Surface mount capability allows for easy and convenient assembly onto circuit boards, saving time and effort.

Package Shape: RECTANGULAR

Rectangular shape makes the operational amplifier compact and easy to integrate into various electronic devices.

No. of Terminals: 6

A higher number of terminals provide more connectivity options and flexibility in circuit design.

Package Style: SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Compact package style with a thin profile and shrink pitch allows for space-efficient designs in electronic applications.

Terminal Finish: MATTE TIN

Matte tin finish enhances solderability and ensures reliable electrical connections during assembly.

Terminal Position: DUAL

Dual terminal position provides redundancy and improves signal transmission reliability in the operational amplifier.

Maximum Seated Height: 1.1 mm

Low profile design with maximum seated height of 1.1 mm facilitates compact and slim electronic product designs.

Width: 1.25 mm

Narrow width of 1.25 mm enables space-saving integration of the operational amplifier in tight layouts.

Maximum Time At Peak Reflow Temperature (s): 30

Short reflow time of 30 seconds at peak temperature of 260°C ensures efficient and quick soldering during assembly process.

Peak Reflow Temperature °C: 260

High peak reflow temperature of 260°C ensures proper bonding of components and reliability in solder joints.

Length: 2 mm

Compact length of 2 mm enables space-efficient placement of the operational amplifier in electronic circuits.

Temperature Grade: AUTOMOTIVE

Automotive grade ensures the operational amplifier can withstand harsh temperature conditions and vibrations in automotive applications.

Terminal Form: GULL WING

Gull wing terminal form provides strong mechanical support and secure soldering connections for reliable performance.

Amplifier Type: OPERATIONAL AMPLIFIER

Specifically designed as an operational amplifier, providing high gain, precision performance, and stability in various signal processing applications.

Terminal Pitch: 0.65 mm

Fine terminal pitch of 0.65 mm allows for high-density mounting and precise electrical connections in the operational amplifier.

Moisture Sensitivity Level (MSL): 2

Moisture sensitivity level 2 indicates the operational amplifier is suitable for reflow assembly processes with a peak temperature of 260°C.

Technical Specifications

Operational Amplifiers (Op Amps) INA214AIDCKTG4 attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Total Functions:

1

Sub-Category:

Operational Amplifiers

Operational Characteristics

Peak Reflow Temperature:

260 °C (500 °F)

Reflow Peak Time Limit:

30 s

Physical Characteristics

Length:

0.079 in (2 mm)

Width:

0.049 in (1.25 mm)

Maximum Seated Height:

0.043 in (1.1 mm)

Total Terminals:

6

Terminal Pitch:

0.026 in (0.65 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Matte Tin

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

2

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e3

Packaging and Shipping

Package Code:

Package Shape:

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Trade Compliance

INA214AIDCKTG4 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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