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INA211AIDCKTG4

Texas Instruments

INA211AIDCKTG4 by Texas Instruments

Texas Instruments' INA211AIDCKTG4 is a small outline, thin profile operational amplifier with 6 terminals. With a package size of 2x1.25 mm and max seated height of 1.1 mm, it is ideal for automotive applications requiring precise signal amplification at high temperatures up to 260°C during reflow soldering.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 7,120 parts In-Stock

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7,120

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Vyrian

USA . 5,537 parts In-Stock

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5,537

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Digiode

USA . 1,304 parts In-Stock

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1,304

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 602 parts In-Stock

1+ parts

$3.668

100+ parts

-

1k+ parts

$4.175

10k+ parts

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602

$3.668

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$4.175

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DigiPath Technology Company

USA . 1,305 parts In-Stock

1+ parts

$4.039

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1,305

$4.039

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ChromeModa Solutions

Germany . 5,326 parts In-Stock

1+ parts

$4.121

100+ parts

$3.379

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5,326

$4.121

$3.379

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IDEA Electronic Components Group

UK . 625 parts In-Stock

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$4.121

100+ parts

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$3.709

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625

$4.121

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$3.709

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One Stop Electronics

USA . 858 parts In-Stock

1+ parts

$4.410

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858

$4.410

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AZTECH Wire

Italy . 539 parts In-Stock

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$18.186

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539

$18.186

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Microchip USA

USA . 1,486 parts In-Stock

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1,486

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Perfect Parts

USA . 857 parts In-Stock

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857

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Corphita

USA . 558 parts In-Stock

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558

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Overview

Enhance your electronic designs with the INA211AIDCKTG4 by Texas Instruments, a top-tier manufacturer known for premium quality products. As a part of the Operational Amplifiers category, this small outline, thin profile amplifier offers exceptional performance and reliability. Ideal for automotive applications, this dual-terminal device provides precise measurements and accurate results. Elevate your projects with the value and benefits that only Texas Instruments can deliver.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material offers a good balance of durability and cost-effectiveness, making this Op Amp a reliable choice for various applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient PCB assembly, saving time and effort during the manufacturing process.

Package Shape: RECTANGULAR

The rectangular shape provides a compact design that can easily fit into tight spaces within electronic devices, maximizing space efficiency.

No. of Terminals: 6

With 6 terminals, this Op Amp offers flexibility in connectivity and allows for versatile circuit designs to meet specific requirements.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline, thin profile, and shrink pitch package style contributes to space-saving on the PCB, ideal for compact electronic devices.

Terminal Finish: MATTE TIN

The matte tin finish provides good solderability and corrosion resistance, ensuring a reliable connection between the Op Amp and the PCB.

Terminal Position: DUAL

Dual terminal positioning offers improved stability and better electrical performance, making this Op Amp suitable for demanding applications.

Maximum Seated Height: 1.1 mm

The low seated height allows for a slim profile design, which is advantageous for applications where space constraints are a concern.

Width: 1.25 mm

The narrow width of 1.25 mm contributes to the compact size of the Op Amp, enabling it to be used in space-limited electronic systems.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum reflow time of 30 seconds at peak temperature, this Op Amp is easy to integrate into automated assembly processes for efficient production.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C ensures reliable solder joints during assembly, enhancing the overall quality and durability of the product.

Length: 2 mm

The compact length of 2 mm further adds to the space-saving design of the Op Amp, making it suitable for applications where size is a critical factor.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, this Op Amp is built to withstand harsh operating conditions and temperature variations commonly encountered in automotive environments.

Terminal Form: GULL WING

The gull-wing terminal form offers mechanical strength and secure solder joints, ensuring reliable connectivity in demanding industrial applications.

Amplifier Type: OPERATIONAL AMPLIFIER

As an operational amplifier, this product is capable of high-performance signal processing and amplification, making it suitable for a wide range of electronic applications.

Terminal Pitch: 0.65 mm

The small terminal pitch of 0.65 mm enables high-density mounting, allowing for more components to be placed on the PCB, enhancing the functionality of the overall electronic system.

Technical Specifications

Operational Amplifiers (Op Amps) INA211AIDCKTG4 attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Total Functions:

1

Sub-Category:

Operational Amplifiers

Operational Characteristics

Peak Reflow Temperature:

260 °C (500 °F)

Reflow Peak Time Limit:

30 s

Physical Characteristics

Length:

0.079 in (2 mm)

Width:

0.049 in (1.25 mm)

Maximum Seated Height:

0.043 in (1.1 mm)

Total Terminals:

6

Terminal Pitch:

0.026 in (0.65 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Matte Tin

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e3

Packaging and Shipping

Package Code:

Package Shape:

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Trade Compliance

INA211AIDCKTG4 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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