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INA209AIPWRG4

Texas Instruments

INA209AIPWRG4 by Texas Instruments

INA209AIPWRG4 by Texas Instruments is a comparator with Vsup of 3.3V, operating temp range -40 to 125 °C, and max input offset voltage of 200uV. Ideal for automotive applications due to its small outline package style and open-collector output type.

Median Price

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Lifecycle Status

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5

In-Stock Inventory

1k+

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Chip Stock

USA . 3,970 parts In-Stock

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Vyrian

USA . 3,283 parts In-Stock

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Digiode

USA . 3,058 parts In-Stock

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Nova Conductors

Japan . 200 parts In-Stock

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200

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SPM Sales

USA . 60 parts In-Stock

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Corohmni

South Africa . 226 parts In-Stock

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$2.113

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Ampacity Inc.

Singapore . 477 parts In-Stock

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$4.410

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One Stop Electronics

USA . 313 parts In-Stock

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$4.410

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Parana Technologies

USA . 1,074 parts In-Stock

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$5.240

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$5.859

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Aztec Data Supply Inc.

USA . 4,599 parts In-Stock

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$5.670

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DigiPath Technology Company

USA . 1,568 parts In-Stock

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$5.770

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IDEA Electronic Components Group

UK . 931 parts In-Stock

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$5.888

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$5.299

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ChromeModa Solutions

Germany . 632 parts In-Stock

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$5.888

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AZTECH Wire

Italy . 675 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Argo Parts USA

USA . 4,618 parts In-Stock

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Corphita

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Continental Prestige Electronics

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Kepictronics

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Bastille Electronics

Australia . 100 parts In-Stock

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Overview

Get ready to experience top-notch quality and reliability with the INA209AIPWRG4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers unparalleled performance and precision in their comparators category. Whether you're in automotive, industrial, or consumer electronics, this product offers exceptional value and benefits. With its high-quality construction and advanced features, the INA209AIPWRG4 is sure to exceed your expectations. Upgrade your projects with the best in class from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, suitable for various applications.

Maximum Input Offset Voltage: 200 uV

Low input offset voltage ensures accurate and precise measurements, making this product reliable for sensitive applications.

Surface Mount: YES

Being surface mountable allows for easy installation and integration into compact electronic devices.

Nominal Supply Voltage / Vsup (V): 3.3

The nominal supply voltage of 3.3V makes it compatible with a wide range of electronic systems and circuits.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, this product can withstand harsh environmental conditions and ensure reliable performance.

Output Type: OPEN-COLLECTOR

The open-collector output type allows for easy interfacing with microcontrollers and other digital circuits for versatile applications.

Temperature Grade: AUTOMOTIVE

Designed for automotive use, this product meets the quality and reliability standards required for automotive applications.

Technical Specifications

Comparators INA209AIPWRG4 attributes and parameters. Explore more Comparators devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Total Functions:

1

Sub-Category:

Comparators

Output Type:

Open-Collector

Performance Specifications

Maximum Input Offset Voltage:

200 uV

Operational Characteristics

Nominal Supply Voltage:

3.3 V

Maximum Supply Voltage:

5.5 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Reflow Peak Time Limit:

30 s

Peak Reflow Temperature:

260 °C (500 °F)

Physical Characteristics

Length:

0.197 in (5 mm)

Width:

0.173 in (4.4 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Total Terminals:

16

Terminal Pitch:

0.026 in (0.65 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel Palladium Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

2

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Packaging and Shipping

Package Code:

Package Shape:

Package Type:

Small Outline, Thin Profile, Shrink Pitch

Trade Compliance

INA209AIPWRG4 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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