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INA197AIDBVRG4

Texas Instruments

INA197AIDBVRG4 by Texas Instruments

Texas Instruments' INA197AIDBVRG4 is a small outline, low profile operational amplifier with 5 terminals. It features a package width of 1.6mm and length of 2.9mm, suitable for automotive applications. With a peak reflow temperature of 260°C and moisture sensitivity level of 2, it is ideal for surface mount designs in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 22,960 parts In-Stock

1+ parts

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22,960

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Vyrian

USA . 6,768 parts In-Stock

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6,768

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Digiode

USA . 1,872 parts In-Stock

1+ parts

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1,872

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Nova Conductors

Japan . 300 parts In-Stock

1+ parts

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300

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,269 parts In-Stock

1+ parts

$3.187

100+ parts

-

1k+ parts

$3.709

10k+ parts

-

1,269

$3.187

-

$3.709

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DigiPath Technology Company

USA . 352 parts In-Stock

1+ parts

$3.509

100+ parts

$3.229

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-

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352

$3.509

$3.229

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ChromeModa Solutions

Germany . 1,863 parts In-Stock

1+ parts

$3.581

100+ parts

$2.936

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-

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1,863

$3.581

$2.936

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IDEA Electronic Components Group

UK . 997 parts In-Stock

1+ parts

$3.581

100+ parts

-

1k+ parts

$3.223

10k+ parts

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997

$3.581

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$3.223

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Advanced Electronics

New Zealand . 150 parts In-Stock

1+ parts

$5.742

100+ parts

$5.455

1k+ parts

$5.455

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150

$5.742

$5.455

$5.455

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Corohmni

South Africa . 403 parts In-Stock

1+ parts

$6.190

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403

$6.190

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Semicontronic

India . 1,649 parts In-Stock

1+ parts

$7.410

100+ parts

$7.225

1k+ parts

$7.188

10k+ parts

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1,649

$7.410

$7.225

$7.188

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Ampacity Inc.

Singapore . 1,224 parts In-Stock

1+ parts

$7.410

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1,224

$7.410

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AZTECH Wire

Italy . 840 parts In-Stock

1+ parts

$9.089

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840

$9.089

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One Stop Electronics

USA . 554 parts In-Stock

1+ parts

$9.410

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554

$9.410

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Kepictronics

USA . 21,000 parts In-Stock

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Argo Parts USA

USA . 4,452 parts In-Stock

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4,452

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Continental Prestige Electronics

USA . 3,280 parts In-Stock

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3,280

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Corphita

USA . 2,027 parts In-Stock

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2,027

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Microchip USA

USA . 958 parts In-Stock

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958

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Bastille Electronics

Australia . 750 parts In-Stock

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750

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Overview

Enhance your electronic designs with the high-quality INA197AIDBVRG4 operational amplifier by Texas Instruments. Built by a trusted manufacturer, this amplifier offers exceptional performance and reliability for a wide range of applications. From automotive to industrial settings, this compact and versatile device delivers precision and efficiency. Experience the value and benefits of using the Texas Instruments INA197AIDBVRG4 in your projects, and elevate your designs to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and resistance to external elements, making the product suitable for a wide range of applications.

Surface Mount: YES

Allows for easy and cost-effective PCB assembly, saving time and effort during the manufacturing process.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient use of space on the PCB, making it ideal for compact designs.

No. of Terminals: 5

Provides enough connections for various input and output signals, offering flexibility in circuit design.

Package Style (Meter): SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Compact size, low profile, and shrink pitch design ensure space-saving and improved thermal performance in tight layouts.

Terminal Finish: NICKEL PALLADIUM GOLD

This finish enhances conductivity and corrosion resistance, ensuring reliable performance over the product's lifespan.

Terminal Position: DUAL

Dual terminal positioning allows for easy integration into the circuit, facilitating efficient signal routing and connection.

Maximum Seated Height: 1.45 mm

The low profile design reduces overall height, contributing to a sleek and space-efficient final product.

Width: 1.6 mm

Narrow width enables close component placement on the PCB, improving signal integrity and reducing interference.

Maximum Time At Peak Reflow Temperature (s): 30

Short reflow time minimizes heat exposure to the component, preventing damage and ensuring reliable solder joints.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance allows for compatibility with lead-free soldering processes, meeting modern industry standards.

Length: 2.9 mm

Compact length contributes to a space-saving design, making it suitable for applications with limited board space.

Temperature Grade: AUTOMOTIVE

Designed to withstand automotive temperature ranges and harsh environments, ensuring long-term reliability in automotive applications.

Terminal Form: GULL WING

Gull wing terminal form offers secure connections and ease of soldering, enhancing the product's durability and performance.

Amplifier Type: OPERATIONAL AMPLIFIER

Operational amplifiers are versatile and widely used in various electronic circuits for signal processing and amplification.

Terminal Pitch: 0.95 mm

Narrow terminal pitch allows for high-density mounting, enabling complex circuit designs in limited space conditions.

Moisture Sensitivity Level (MSL): 2

MSL 2 rating indicates moderate sensitivity to moisture exposure, suitable for applications with controlled humidity environments.

Technical Specifications

Operational Amplifiers (Op Amps) INA197AIDBVRG4 attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Total Functions:

1

Sub-Category:

Operational Amplifiers

Operational Characteristics

Peak Reflow Temperature:

260 °C (500 °F)

Reflow Peak Time Limit:

30 s

Physical Characteristics

Length:

0.114 in (2.9 mm)

Width:

0.063 in (1.6 mm)

Maximum Seated Height:

0.057 in (1.45 mm)

Total Terminals:

5

Terminal Pitch:

0.037 in (0.95 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel Palladium Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

2

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Packaging and Shipping

Package Code:

Package Shape:

Package Style:

Small Outline, Low Profile, Shrink Pitch

Trade Compliance

INA197AIDBVRG4 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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