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INA194AIDBVRG4

Texas Instruments

INA194AIDBVRG4 by Texas Instruments

Texas Instruments' INA194AIDBVRG4 is an operational amplifier with 2000uV max input offset voltage and 300 kHz unity gain bandwidth. Ideal for automotive applications, it has a common mode voltage of 80V and operates b/w -40 to 125 °C. With a compact design, it features a small outline package style with dual terminals.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

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Chip Stock

USA . 5,370 parts In-Stock

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Digiode

USA . 4,934 parts In-Stock

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Vyrian

USA . 3,661 parts In-Stock

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Semtec, LLC

USA . 3,000 parts In-Stock

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Nova Conductors

Japan . 90 parts In-Stock

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Distributors (Availability)

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Advanced Electronics

New Zealand . 52 parts In-Stock

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$2.503

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$2.378

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$2.378

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52

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One Stop Electronics

USA . 1,550 parts In-Stock

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$3.410

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$3.410

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Ampacity Inc.

Singapore . 255 parts In-Stock

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$3.410

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Parana Technologies

USA . 1,483 parts In-Stock

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$3.513

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$4.038

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DigiPath Technology Company

USA . 1,456 parts In-Stock

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$3.868

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ChromeModa Solutions

Germany . 3,394 parts In-Stock

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$3.947

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$3.237

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IDEA Electronic Components Group

UK . 431 parts In-Stock

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$3.947

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$3.552

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Corohmni

South Africa . 460 parts In-Stock

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$5.684

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Semicontronic

India . 1,296 parts In-Stock

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$7.410

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$7.225

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$7.188

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AZTECH Wire

Italy . 587 parts In-Stock

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Continental Prestige Electronics

USA . 4,302 parts In-Stock

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Argo Parts USA

USA . 3,361 parts In-Stock

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Microchip USA

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Corphita

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Bastille Electronics

Australia . 100 parts In-Stock

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Kepictronics

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Overview

Experience superior quality and performance with the Texas Instruments INA194AIDBVRG4 operational amplifier. Crafted by a trusted manufacturer, this small outline, low profile device offers precision and reliability for a wide range of applications. From automotive to industrial uses, this amplifier provides a 300 kHz unity gain bandwidth and 100 dB minimum common mode reject ratio, ensuring optimal functionality in any setting. Trust in the value and benefits of Texas Instruments products for your amplification needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protects the internal components of the op amp, making it a reliable choice for various applications.

Maximum Input Offset Voltage: 2000 uV

The low input offset voltage ensures accurate signal processing, making this op amp suitable for precision measurement and control systems.

Surface Mount: YES

With surface mount capability, this op amp can be easily integrated into compact circuit designs, saving space and simplifying assembly.

No. of Functions: 1

This single-function op amp is straightforward to use and ideal for basic signal amplification applications.

Package Shape: RECTANGULAR

The rectangular shape of the package provides ease of handling and efficient PCB layout, contributing to a streamlined design process.

No. of Terminals: 5

The 5 terminals offer flexibility in connectivity options and allow for versatile circuit configurations, enhancing the op amp's adaptability.

Package Style: SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

This package style combines compact size with low profile design, making it suitable for space-constrained applications requiring high performance op amps.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this op amp can withstand harsh environmental conditions and remain reliable in demanding applications.

Maximum Common Mode Voltage: 80 V

The high common mode voltage tolerance ensures stable operation even in the presence of voltage fluctuations, enhancing the op amp's reliability in varying conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows this op amp to function effectively in cold environments, making it suitable for a wide range of applications.

Terminal Finish: NICKEL PALLADIUM GOLD

This terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability and consistent performance of the op amp.

Terminal Position: DUAL

The dual terminal position allows for easy soldering and secure connection, enhancing the overall reliability and performance of the op amp.

Maximum Seated Height: 1.45 mm

The low seated height of the package makes this op amp suitable for compact designs where space is limited, without compromising on performance.

Width: 1.6 mm

The narrow width of the op amp enables efficient PCB layout and integration into space-constrained applications, making it a versatile choice for various designs.

Maximum Time At Peak Reflow Temperature: 30s

The short reflow time allows for quick and efficient soldering of the op amp, reducing production time and ensuring consistent solder joint quality.

Peak Reflow Temperature: 260C

With a high peak reflow temperature, this op amp can withstand the reflow soldering process without degradation, ensuring reliable performance in manufacturing.

Length: 2.9 mm

The compact length of the op amp contributes to its space-saving design, making it well-suited for applications with size constraints.

Temperature Grade: AUTOMOTIVE

This op amp is designed to meet automotive industry standards, ensuring high reliability and performance in automotive applications.

Nominal Unity Gain Bandwidth: 300 kHz

The high unity gain bandwidth allows for fast signal processing and accurate amplification, making this op amp suitable for high-speed applications.

Minimum Common Mode Reject Ratio: 100 dB

The high common mode reject ratio ensures minimal interference from common-mode signals, improving the op amp's accuracy and performance in noisy environments.

Terminal Form: GULL WING

The gull wing terminal form simplifies soldering and ensures secure connections, enhancing the overall reliability and manufacturability of the op amp.

Amplifier Type: OPERATIONAL AMPLIFIER

This op amp is specifically designed for amplification and signal processing applications, making it a reliable choice for a wide range of electronic circuits.

Nominal Slow Rate: 1 V/us

The slow rate of change of output voltage allows for gradual signal amplification, making this op amp suitable for applications requiring smooth and controlled signal processing.

Terminal Pitch: 0.95 mm

The small terminal pitch enables compact circuit designs and efficient PCB layout, contributing to the op amp's versatility in various applications.

Nominal Voltage Gain: 50

With a nominal voltage gain of 50, this op amp provides consistent and predictable signal amplification, making it suitable for applications requiring specific gain levels.

Moisture Sensitivity Level (MSL): 2

The MSL 2 rating indicates that this op amp is moderately sensitive to moisture, allowing for safe storage and handling in typical manufacturing environments.

Technical Specifications

Operational Amplifiers (Op Amps) INA194AIDBVRG4 attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Total Functions:

1

Sub-Category:

Operational Amplifiers

Performance Specifications

Nominal Unity Gain Bandwidth:

300 kHz

Maximum Common Mode Voltage:

80 V

Minimum Common Mode Rejection Ratio (CMRR ):

100 dB

Input Offset Voltage Limit:

2000 uV

Nominal Voltage Gain:

50

Nominal Slew Rate:

1 V/us

Operational Characteristics

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Reflow Peak Time Limit:

30 s

Physical Characteristics

Length:

0.114 in (2.9 mm)

Width:

0.063 in (1.6 mm)

Maximum Seated Height:

0.057 in (1.45 mm)

Total Terminals:

5

Terminal Pitch:

0.037 in (0.95 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel Palladium Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

2

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Packaging and Shipping

Package Code:

Package Shape:

Package Style:

Small Outline, Low Profile, Shrink Pitch

Trade Compliance

INA194AIDBVRG4 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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