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INA193AMDBVREPG4

Texas Instruments

INA193AMDBVREPG4 by Texas Instruments

Texas Instruments' INA193AMDBVREPG4 is a 5-terminal operational amplifier with a small outline, low profile package. Featuring a rectangular shape and gull wing terminal form, it has a max seated height of 1.45mm and operates at peak reflow temperature of 260°C for up to 30 seconds. Ideal for military-grade applications requiring high precision amplification in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,461 parts In-Stock

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5,461

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Digiode

USA . 3,358 parts In-Stock

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3,358

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Nova Conductors

Japan . 300 parts In-Stock

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300

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,053 parts In-Stock

1+ parts

$3.456

100+ parts

-

1k+ parts

$3.980

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2,053

$3.456

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$3.980

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DigiPath Technology Company

USA . 468 parts In-Stock

1+ parts

$3.805

100+ parts

$3.501

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-

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468

$3.805

$3.501

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ChromeModa Solutions

Germany . 3,634 parts In-Stock

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$3.883

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$3.184

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3,634

$3.883

$3.184

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IDEA Electronic Components Group

UK . 1,668 parts In-Stock

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$3.883

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$3.495

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1,668

$3.883

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$3.495

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Advanced Electronics

New Zealand . 55 parts In-Stock

1+ parts

$4.822

100+ parts

$4.581

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$4.581

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55

$4.822

$4.581

$4.581

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One Stop Electronics

USA . 183 parts In-Stock

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$5.410

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183

$5.410

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Corohmni

South Africa . 80 parts In-Stock

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$6.663

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80

$6.663

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Ampacity Inc.

Singapore . 975 parts In-Stock

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$8.410

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975

$8.410

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Semicontronic

India . 414 parts In-Stock

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$8.410

100+ parts

$8.200

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$8.158

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414

$8.410

$8.200

$8.158

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AZTECH Wire

Italy . 317 parts In-Stock

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$17.811

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317

$17.811

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Argo Parts USA

USA . 3,489 parts In-Stock

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Kepictronics

USA . 3,250 parts In-Stock

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Corphita

USA . 3,246 parts In-Stock

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Microchip USA

USA . 1,546 parts In-Stock

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1,546

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Bastille Electronics

Australia . 1,000 parts In-Stock

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1,000

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Continental Prestige Electronics

USA . 699 parts In-Stock

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699

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Overview

Discover the superior quality and precision of the INA193AMDBVREPG4 by Texas Instruments, a leading manufacturer in operational amplifiers. Ideal for a wide range of applications, this compact and reliable op amp offers unmatched performance and versatility. With its innovative design and military-grade temperature grade, this amplifier ensures optimal functionality and durability in any environment. Trust Texas Instruments to deliver the best-in-class solutions for all your operational amplifier needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a long lifespan for the product.

Surface Mount: YES

Allows for easy and efficient assembly onto circuit boards, saving time and effort during the manufacturing process.

No. of Terminals: 5

Offers sufficient connectivity options for various applications, making the product versatile and adaptable.

Maximum Seated Height: 1.45 mm

Enables a compact and low-profile design which is advantageous for space-constrained applications.

Temperature Grade: MILITARY

Suitable for use in harsh and demanding environments, ensuring reliable performance even under extreme conditions.

Technical Specifications

Operational Amplifiers (Op Amps) INA193AMDBVREPG4 attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Total Functions:

1

Sub-Category:

Operational Amplifiers

Operational Characteristics

Peak Reflow Temperature:

260 °C (500 °F)

Reflow Peak Time Limit:

30 s

Physical Characteristics

Length:

0.114 in (2.9 mm)

Width:

0.063 in (1.6 mm)

Maximum Seated Height:

0.057 in (1.45 mm)

Total Terminals:

5

Terminal Pitch:

0.037 in (0.95 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel Palladium Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

2

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Packaging and Shipping

Package Code:

Package Shape:

Package Style:

Small Outline, Low Profile, Shrink Pitch

Trade Compliance

INA193AMDBVREPG4 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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