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HPA02180QRHLRQ1

Texas Instruments

HPA02180QRHLRQ1 by Texas Instruments

Texas Instruments' HPA02180QRHLRQ1 is an 8-bit bus driver with AEC-Q100 screening, operating at -40 to 125 °C. It features a propagation delay of 14.7 ns, TRUE output polarity, and 3-STATE characteristics. Ideal for automotive applications due to its CMOS technology and low profile chip carrier package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,989 parts In-Stock

1+ parts

-

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5,989

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Digiode

USA . 3,805 parts In-Stock

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-

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3,805

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 361 parts In-Stock

1+ parts

$6.404

100+ parts

-

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361

$6.404

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Parana Technologies

USA . 579 parts In-Stock

1+ parts

$20.630

100+ parts

-

1k+ parts

$20.735

10k+ parts

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579

$20.630

-

$20.735

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DigiPath Technology Company

USA . 1,702 parts In-Stock

1+ parts

$22.716

100+ parts

-

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1,702

$22.716

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IDEA Electronic Components Group

UK . 848 parts In-Stock

1+ parts

$23.180

100+ parts

$22.021

1k+ parts

$20.862

10k+ parts

-

848

$23.180

$22.021

$20.862

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ChromeModa Solutions

Germany . 441 parts In-Stock

1+ parts

$23.180

100+ parts

$19.008

1k+ parts

-

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441

$23.180

$19.008

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One Stop Electronics

USA . 487 parts In-Stock

1+ parts

$47.000

100+ parts

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487

$47.000

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Corphita

USA . 1,787 parts In-Stock

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1,787

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Overview

Enhance your automotive electronic designs with the HPA02180QRHLRQ1 by Texas Instruments. This high-quality bus driver and transceiver offers unmatched reliability and performance, thanks to its AEC-Q100 screening level and advanced CMOS technology. With a compact chip carrier package and very thin profile, this component is perfect for space-constrained applications. Whether you're working on vehicle control systems or communication networks, this versatile device provides 8 bits of true output polarity at nominal supply voltages from 1.2V to 1.5V. Trust Texas Instruments to deliver cutting-edge solutions that drive your projects forward.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection, making the product reliable for long-term use.

Surface Mount: YES

Surface mount design allows for easy and efficient installation, saving time and effort during assembly.

Screening Level: AEC-Q100

AEC-Q100 screening ensures high quality and reliability for automotive applications, meeting industry standards.

Nominal Supply Voltage / Vsup (V): 1.5

Stable supply voltage of 1.5V ensures consistent performance and efficiency of the product.

Propagation Delay (tpd): 14.7 ns

Low propagation delay of 14.7ns enhances the speed and responsiveness of the product, making it suitable for time-sensitive applications.

Maximum Operating Temperature: 125 °C

High maximum operating temperature of 125°C allows the product to withstand harsh environmental conditions and ensures reliable performance in various settings.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable in noisy environments.

Technical Specifications

Bus Driver & Transceivers HPA02180QRHLRQ1 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Family:

AVC

JESD-30 Code:

R-PQCC-N24

JESD-609 Code:

e4

Length:

5.5 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

2

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

24

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Propagation Delay (tpd):

14.7 ns

Screening Level:

AEC-Q100

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.2 V

Nominal Supply Voltage / Vsup (V):

1.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.5 mm

Trade Compliance

HPA02180QRHLRQ1 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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