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HPA01123DDAR

Texas Instruments

HPA01123DDAR by Texas Instruments

Texas Instruments HPA01123DDAR is a switching regulator with 8 terminals, operating b/w -40 to 85°C. It offers a max output current of 5A, voltage range from 0.76V to 6V, and a compact rectangular package ideal for industrial applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,686 parts In-Stock

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Digiode

USA . 1,959 parts In-Stock

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1,959

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Distributors (Availability)

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One Stop Electronics

USA . 263 parts In-Stock

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$2.500

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263

$2.500

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Semicontronic

India . 990 parts In-Stock

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$3.500

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$3.412

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$3.395

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990

$3.500

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$3.395

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Parana Technologies

USA . 696 parts In-Stock

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$3.975

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$4.444

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696

$3.975

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$4.444

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ChromeModa Solutions

Germany . 4,628 parts In-Stock

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$4.466

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$3.662

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$4.466

$3.662

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IDEA Electronic Components Group

UK . 1,046 parts In-Stock

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$4.466

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$4.019

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1,046

$4.466

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Ampacity Inc.

Singapore . 1,626 parts In-Stock

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$6.500

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1,626

$6.500

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AZTECH Wire

Italy . 206 parts In-Stock

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$15.132

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Corphita

USA . 4,352 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 3,049 parts In-Stock

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Microchip USA

USA . 2,119 parts In-Stock

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DigiPath Technology Company

USA . 1,028 parts In-Stock

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$4.027

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Corohmni

South Africa . 484 parts In-Stock

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Overview

Power up your projects with the HPA01123DDAR by Texas Instruments! This high-quality switching regulator offers unmatched efficiency and reliability, making it the perfect choice for a wide range of applications. With Texas Instruments' reputation for excellence in manufacturing, you can trust that this product will deliver outstanding performance every time. Say goodbye to power supply issues and hello to seamless operation with the HPA01123DDAR. Experience the value and benefits that this top-of-the-line regulator brings to your projects today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protects the internal components of the switching regulator, making it a reliable choice for long-term use.

Surface Mount: YES

Surface mount technology enables easy and efficient installation on circuit boards, saving space and making the product suitable for compact designs.

Minimum Output Voltage: 0.76 V

With a minimum output voltage as low as 0.76 V, this switching regulator is capable of providing precise and stable power supply to low voltage components or circuits.

Maximum Output Current: 5 A

The high maximum output current of 5 A allows the switching regulator to power multiple components or devices simultaneously, making it a versatile and efficient choice for various applications.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this switching regulator can withstand high temperatures without compromising performance, ensuring reliable operation in demanding environments.

Technical Specifications

Switching Regulators & Controllers HPA01123DDAR attributes and parameters. Explore more Switching Regulators & Controllers devices from Texas Instruments

Specs

Other IC type:

Maximum Input Voltage:

18 V

Minimum Input Voltage:

4.5 V

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.89 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

5 A

Maximum Output Voltage:

6 V

Minimum Output Voltage:

.76 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.7 mm

Surface Mount:

YES

Switcher Config:

BUCK

Maximum Switching Frequency:

650 kHz

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.9 mm

Trade Compliance

HPA01123DDAR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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