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F280039CSPZR

Texas Instruments

F280039CSPZR by Texas Instruments

The Texas Instruments F280039CSPZR microcontroller features a 32-bit CPU with C28X family, 23-Ch 12-Bit ADC, and 2-Ch 12-Bit DAC. Ideal for applications requiring low power mode, it offers connectivity options like CAN, I2C, LIN, SCI, and SPI along with peripherals such as PWM and timers. Operating temperature ranges from -40 to 125 °C.

Median Price

$8.906

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 5,200 parts In-Stock

1+ parts

$6.311

100+ parts

$5.145

1k+ parts

$3.430

10k+ parts

-

5,200

$6.311

$5.145

$3.430

-

Mouser Electronics

USA . 760 parts In-Stock

1+ parts

$11.500

100+ parts

$7.400

1k+ parts

$5.620

10k+ parts

-

760

$11.500

$7.400

$5.620

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,078 parts In-Stock

1+ parts

$5.995

100+ parts

-

1k+ parts

-

10k+ parts

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3,078

$5.995

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-

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Vyrian

USA . 6,001 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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6,001

-

-

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Cyclops Electronics Ltd

UK . 2,000 parts In-Stock

1+ parts

-

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2,000

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-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,123 parts In-Stock

1+ parts

$5.680

100+ parts

-

1k+ parts

-

10k+ parts

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2,123

$5.680

-

-

-

Microchip USA

USA . 2,249 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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2,249

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Native Components

USA . 825 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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825

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Northwest PG Solutions

USA . 66 parts In-Stock

1+ parts

-

100+ parts

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66

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Overview

Elevate your projects with the F280039CSPZR microcontroller by Texas Instruments, a leader in cutting-edge technology. Designed for precision and reliability, this powerful device offers a wide range of applications in various industries. With its advanced features and high-quality construction, customers can expect unparalleled performance and efficiency. Experience the value and benefits of this top-of-the-line microcontroller, equipped to meet all your needs and take your projects to the next level. Trust Texas Instruments for quality you can rely on.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material provides durability and reliability to the product.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly.

Maximum Supply Voltage: 1.32 V

Operates within a safe voltage range, ensuring stable performance.

On Chip Data RAM Width: 8

8-bit data RAM width enhances data processing capabilities.

Package Shape: SQUARE

Square package shape allows for efficient space utilization on the PCB.

Bit Size: 32

32-bit architecture offers high computational power and efficiency.

DAC Channels: YES

Integrated DAC channels enable analog output functionality.

No. of Terminals: 100

Ample number of terminals for versatile connectivity options.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Sleek package style with fine pitch for compact design and easy PCB mounting.

Minimum Supply Voltage: 1.14 V

Low minimum supply voltage for efficient power consumption.

Maximum Operating Temperature: 125 °C

High maximum operating temperature range for reliable performance in various environments.

CPU Family: C28X

C28X CPU family offers advanced processing capabilities for demanding applications.

No. of External Interrupts: 5

Sufficient external interrupts for handling external events and tasks efficiently.

Minimum Operating Temperature: -40 °C

Wide minimum operating temperature range for use in harsh conditions.

ADC Channels: YES

Integrated ADC channels for precise analog data conversion.

DMA Channels: YES

DMA channels improve data transfer efficiency and reduce CPU load.

Terminal Position: QUAD

Quad terminal position for stable and secure connections.

ROM Words: 196608

Large ROM capacity for storing program data and instructions.

Maximum Seated Height: 1.6 mm

Low seated height for slim and compact device design.

Digital To Analog Convertors: 2-Ch 12-Bit

Dual 12-bit DACs for high-resolution analog output signals.

Width: 14 mm

Compact width for space-efficient PCB layout.

Boundary Scan: YES

Boundary scan capability for enhanced testing and debugging during development.

Peripherals: BOR, COMPARATOR(4), DMA(6), POR, PWM(16), TIMER(3), WDT(2)

Rich set of peripherals for versatile functionality and application support.

Maximum Clock Frequency: 25 MHz

High clock frequency for fast data processing and real-time operations.

Length: 14 mm

Optimal length for board space optimization and compact design.

Peripheral IC Type: MICROCONTROLLER, RISC

Microcontroller with RISC architecture for efficient and high-performance computing.

No. of Timers: 3

Multiple timer channels for time-sensitive operations and event scheduling.

RAM Bytes: 70656

Large RAM capacity for storing and processing data during runtime.

Technology: CMOS

CMOS technology for low power consumption and high-speed operation.

Terminal Form: GULL WING

Gull wing terminal form for secure soldering and robust connection.

Analog To Digital Convertors: 23-Ch 12-Bit

23 channels of 12-bit ADC for high-precision analog input conversion.

Maximum Supply Current: 108 mA

Low supply current for energy-efficient operation and extended battery life.

Nominal Supply Voltage: 1.2 V

Stable nominal supply voltage for consistent performance and reliability.

No. of Serial I/Os: 7

Multiple serial I/O interfaces for communication and data exchange with external devices.

PWM Channels: YES

PWM channels for precise control of analog output signals and motor speed.

Connectivity: CAN(2), FSI, I2C(2), LIN(2), SCI(2), SPI(2)

Multiple connectivity options for interfacing with diverse communication protocols and networks.

ROM Programmability: FLASH

Flash ROM programmability for easy firmware updates and flexible memory management.

Terminal Pitch: 0.5 mm

Fine terminal pitch for high-density PCB integration and miniaturization.

Format: FLOATING POINT

Floating-point format for accurate mathematical calculations and signal processing tasks.

Speed: 120 rpm

Operates at fast speed of 120 rotations per minute for quick data processing and output.

Low Power Mode: YES

Low power mode feature for energy-saving operation and extended battery runtime.

On Chip Program ROM Width: 16

16-bit on-chip program ROM width for efficient program storage and execution.

No. of I/O Lines: 51

Abundant I/O lines for versatile interfacing and connectivity options.

Technical Specifications

Microcontrollers F280039CSPZR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

C28X

Maximum Clock Frequency:

25 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

Low Power Mode:

YES

No. of DMA Channels:

6

No. of External Interrupts:

5

No. of I/O Lines:

51

No. of Serial I/Os:

7

No. of Terminals:

100

No. of Timers:

3

On Chip Data RAM Width:

8

On Chip Program ROM Width:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

RAM Bytes:

70656

ROM Words:

196608

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

120 rpm

Maximum Supply Current:

108 mA

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(2), FSI, I2C(2), LIN(2), SCI(2), SPI(2)

Peripherals:

BOR, COMPARATOR(4), DMA(6), POR, PWM(16), TIMER(3), WDT(2)

Analog To Digital Convertors:

23-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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