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F280037CSPTR

Texas Instruments

F280037CSPTR by Texas Instruments

The Texas Instruments F280037CSPTR microcontroller features 32-bit architecture, 131072 ROM words, and 14-Ch 12-Bit ADC. Ideal for applications requiring CAN, I2C, SPI connectivity and low power mode with a max clock frequency of 25 MHz. Package style is flatpack with a terminal pitch of 0.5 mm.

Median Price

$7.952

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 8,029 parts In-Stock

1+ parts

$5.575

100+ parts

$4.545

1k+ parts

$3.030

10k+ parts

-

8,029

$5.575

$4.545

$3.030

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Mouser Electronics

USA . 877 parts In-Stock

1+ parts

$10.330

100+ parts

$6.610

1k+ parts

$5.350

10k+ parts

-

877

$10.330

$6.610

$5.350

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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 892 parts In-Stock

1+ parts

$5.296

100+ parts

-

1k+ parts

-

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892

$5.296

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-

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Vyrian

USA . 3,765 parts In-Stock

1+ parts

-

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3,765

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Distributors (Availability)

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Ampacity Inc.

Singapore . 4,022 parts In-Stock

1+ parts

$4.740

100+ parts

-

1k+ parts

-

10k+ parts

-

4,022

$4.740

-

-

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Semicontronic

India . 4,007 parts In-Stock

1+ parts

$4.740

100+ parts

$4.622

1k+ parts

$4.598

10k+ parts

-

4,007

$4.740

$4.622

$4.598

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Corphita

USA . 2,351 parts In-Stock

1+ parts

$5.018

100+ parts

-

1k+ parts

-

10k+ parts

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2,351

$5.018

-

-

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Corohmni

South Africa . 411 parts In-Stock

1+ parts

$5.575

100+ parts

-

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10k+ parts

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411

$5.575

-

-

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Microchip USA

USA . 2,120 parts In-Stock

1+ parts

$23.240

100+ parts

$23.100

1k+ parts

$23.030

10k+ parts

$22.950

2,120

$23.240

$23.100

$23.030

$22.950

Native Components

USA . 867 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.475

10k+ parts

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867

-

-

$3.475

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Northwest PG Solutions

USA . 132 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$3.510

10k+ parts

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132

-

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$3.510

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Overview

Elevate your projects with the F280037CSPTR from Texas Instruments, a leading manufacturer known for top-quality microcontrollers. Designed with precision and innovation, this device offers unparalleled performance in various applications. With advanced features like 32-bit processing, dual DAC channels, and multiple peripherals, this microcontroller provides exceptional value and flexibility to meet your project needs. Trust in Texas Instruments to deliver cutting-edge technology that empowers your creations to reach new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material ensures durability and resistance to environmental factors, making the product suitable for a wide range of applications.

Surface Mount: YES

Surface mount capability allows for easy integration onto circuit boards, saving space and simplifying the manufacturing process.

Maximum Supply Voltage: 1.32 V

The high maximum supply voltage of 1.32V provides flexibility in power supply options and compatibility with various systems.

On Chip Data RAM Width: 8

Having a data RAM width of 8 allows for efficient data processing and storage, enhancing the overall performance of the microcontroller.

Package Shape: SQUARE

The square package shape offers a compact design and easy handling, making it ideal for space-constrained applications.

Bit Size: 32

A 32-bit architecture provides high computational power and precision, enabling complex calculations and operations.

DAC Channels: YES

Having DAC channels allows for precise analog signal generation, which is essential for various control and communication applications.

No. of Terminals: 48

The 48 terminals provide ample connectivity options and interface possibilities, supporting diverse system requirements.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, and fine pitch package style ensures easy assembly, reliability, and compatibility with modern PCB designs.

Minimum Supply Voltage: 1.14 V

The low minimum supply voltage of 1.14V allows for efficient power management and operation in low-power applications.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C ensures reliable performance even in harsh environmental conditions with elevated temperatures.

CPU Family: C28X

The C28X CPU family offers advanced processing capabilities and a rich set of features, making the microcontroller suitable for a wide range of applications.

No. of External Interrupts: 5

Having 5 external interrupt lines allows the microcontroller to respond quickly to external events, improving real-time responsiveness and control.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C enables operation in cold environments without compromising performance or reliability.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The terminal finish of Nickel/Palladium/Gold provides corrosion resistance, ensuring long-term reliability and electrical connectivity.

ADC Channels: YES

The presence of ADC channels allows for accurate analog to digital conversion, enabling precise measurement and control in various applications.

DMA Channels: YES

Having DMA channels allows for efficient data transfer and processing, reducing CPU load and improving overall system performance.

Terminal Position: QUAD

The quad terminal position provides secure soldering points and mechanical support, ensuring robust connectivity in the circuit.

ROM Words: 131072

With 131072 ROM words, the microcontroller can store a large amount of program code and data, supporting complex algorithms and functions.

Maximum Seated Height: 1.6 mm

The low maximum seated height of 1.6mm allows for compact and slim design configurations, making the microcontroller suitable for space-constrained applications.

Digital To Analog Convertors: 2-Ch 12-Bit

Dual 12-bit DAC channels enable precise analog signal generation, essential for applications requiring accurate voltage or current output.

Width: 7 mm

The compact width of 7mm facilitates board-level integration and saves space in the overall system design.

Boundary Scan: YES

Boundary scan capability allows for efficient testing and debugging of the microcontroller during production, ensuring high manufacturing quality.

Peripherals: BOR, COMPARATOR(4), DMA(6), POR, PWM(16), TIMER(3), WDT(2)

A rich set of peripherals including brown-out reset, comparators, DMA, PWM, timers, and watchdog timers provide versatile functionality for diverse applications.

Maximum Clock Frequency: 25 MHz

The high maximum clock frequency of 25MHz enables fast and responsive operation, supporting real-time processing and control tasks.

Length: 7 mm

The moderate length of 7mm complements the compact width, offering a balanced form factor for easy integration and layout flexibility.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC-based microcontroller, it offers high performance, low power consumption, and efficient operation for a wide range of embedded applications.

No. of Timers: 3

Having 3 timers provides essential timing and scheduling capabilities for various tasks and event handling in the system.

RAM Bytes: 70656

With 70656 bytes of RAM, the microcontroller can efficiently manage data and variables during program execution, supporting complex algorithms and computations.

Technology: CMOS

The CMOS technology offers low power consumption, high noise immunity, and compatibility with modern digital systems, ensuring efficient operation and reliability.

Terminal Form: GULL WING

The gull wing terminal form simplifies soldering and provides mechanical stability, ensuring reliable electrical connections in the circuit.

Analog To Digital Convertors: 14-Ch 12-Bit

Fourteen 12-bit ADC channels enable precise analog signal acquisition, essential for sensor interfacing, analog data acquisition, and control applications.

Maximum Supply Current: 108 mA

The maximum supply current of 108mA indicates efficient power consumption and low operational costs, making the microcontroller an energy-efficient choice.

Nominal Supply Voltage: 1.2 V

A nominal supply voltage of 1.2V provides stable and efficient power distribution, ensuring reliable operation and compatibility with common power sources.

No. of DMA Channels: 6

Having 6 DMA channels allows for parallel data processing and efficient data transfer between peripherals and memory, enhancing overall system performance.

No. of Serial I/Os: 7

With 7 serial I/O interfaces, the microcontroller can communicate with multiple external devices, enabling data exchange, control, and interfacing with different systems.

PWM Channels: YES

The presence of PWM channels allows for accurate pulse-width modulation, essential for motor control, power regulation, and lighting applications.

Connectivity: CAN(2), FSI, I2C(2), LIN(2), SCI(2), SPI(2)

A diverse set of connectivity options including CAN, FSI, I2C, LIN, SCI, and SPI interfaces provide versatile communication capabilities for interfacing with various devices and networks.

ROM Programmability: FLASH

ROM programmability via Flash memory allows for easy firmware updates and customization, ensuring flexibility and adaptability to changing system requirements.

Terminal Pitch: 0.5 mm

The fine terminal pitch of 0.5mm facilitates high-density packaging and PCB design, allowing for compact and efficient system integration.

Format: FLOATING POINT

Support for floating-point format enhances numerical precision, enabling accurate calculations and mathematical operations in computational algorithms.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, the microcontroller can withstand moderate exposure to humidity during manufacturing and operation, ensuring reliability and performance.

Speed: 120 rpm

The maximum speed of 120 rpm indicates the capability to handle fast real-time operations and control tasks, making the microcontroller suitable for time-critical applications.

Technical Specifications

Microcontrollers F280037CSPTR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

C28X

Maximum Clock Frequency:

25 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e4

Length:

7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

6

No. of External Interrupts:

5

No. of I/O Lines:

14

No. of Serial I/Os:

7

No. of Terminals:

48

No. of Timers:

3

On Chip Data RAM Width:

8

On Chip Program ROM Width:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

RAM Bytes:

70656

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

120 rpm

Maximum Supply Current:

108 mA

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(2), FSI, I2C(2), LIN(2), SCI(2), SPI(2)

Peripherals:

BOR, COMPARATOR(4), DMA(6), POR, PWM(16), TIMER(3), WDT(2)

Analog To Digital Convertors:

14-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

F280037CSPTR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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