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F2800135PMR

Texas Instruments

F2800135PMR by Texas Instruments

F2800135PMR by Texas Instruments is a 32-bit microcontroller with 64 terminals, operating at up to 25 MHz. It features 21-Ch 12-Bit ADC channels and offers connectivity options like CAN, I2C, SCI, and SPI. Ideal for applications requiring low power consumption and high-speed processing in industrial automation and automotive systems.

Median Price

$3.580

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2,327 parts In-Stock

1+ parts

$2.606

100+ parts

$2.283

1k+ parts

$1.290

10k+ parts

-

2,327

$2.606

$2.283

$1.290

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DigiKey

USA . 950 parts In-Stock

1+ parts

$3.580

100+ parts

$2.229

1k+ parts

$1.986

10k+ parts

$1.889

950

$3.580

$2.229

$1.986

$1.889

Mouser Electronics

USA . 513 parts In-Stock

1+ parts

$3.880

100+ parts

$2.440

1k+ parts

$2.090

10k+ parts

-

513

$3.880

$2.440

$2.090

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 165 parts In-Stock

1+ parts

$2.476

100+ parts

-

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-

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165

$2.476

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Vyrian

USA . 4,792 parts In-Stock

1+ parts

-

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4,792

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 719 parts In-Stock

1+ parts

$1.212

100+ parts

-

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-

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719

$1.212

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Northwest PG Solutions

USA . 824 parts In-Stock

1+ parts

$1.334

100+ parts

-

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-

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824

$1.334

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-

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Corohmni

South Africa . 135 parts In-Stock

1+ parts

$1.820

100+ parts

-

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135

$1.820

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Semicontronic

India . 1,424 parts In-Stock

1+ parts

$2.220

100+ parts

$2.164

1k+ parts

$2.153

10k+ parts

-

1,424

$2.220

$2.164

$2.153

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Corphita

USA . 2,814 parts In-Stock

1+ parts

$2.345

100+ parts

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2,814

$2.345

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Ampacity Inc.

Singapore . 1,166 parts In-Stock

1+ parts

$4.820

100+ parts

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1,166

$4.820

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Overview

Experience the power and precision of the F2800135PMR microcontroller by Texas Instruments. With a trusted manufacturer like TI, you can expect top-notch quality and reliability. This versatile device is perfect for a wide range of applications thanks to its advanced features and capabilities. From industrial automation to IoT solutions, this microcontroller offers exceptional value and benefits to customers looking for high performance and efficiency. Upgrade your projects with the F2800135PMR and unleash endless possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material for electronic components

Surface Mount: YES

Easy to install on printed circuit boards

Maximum Supply Voltage: 1.32 V

Efficient power usage for extended battery life

On Chip Data RAM Width: 8

Efficient data processing capability

Bit Size: 32

High processing capacity for complex operations

No. of Terminals: 64

Sufficient number of connections for peripherals

Maximum Operating Temperature: 125 °C

Suitable for industrial applications with varying temperature conditions

CPU Family: TMS320

Known for high performance and reliability

ADC Channels: YES

Allows for analog-to-digital conversion for sensor integration

ROM Words: 65536

Large memory storage capacity for program code

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture for efficient processing

Technology: CMOS

Low power consumption and high speed operation

Analog To Digital Convertors: 21-Ch 12-Bit

Multiple ADC channels with high resolution for accurate data conversion

Maximum Clock Frequency: 25 MHz

High speed processing capability

No. of Timers: 3

Timing and scheduling functions for various operations

RAM Bytes: 36864

Sufficient memory for data storage and processing

Connectivity: CAN, I2C(2), SCI(3), SPI

Diverse communication options for interfacing with different devices

Low Power Mode: YES

Energy-efficient operation for battery-powered applications

No. of I/O Lines: 37

Sufficient input/output connections for interfacing with external devices

Technical Specifications

Microcontrollers F2800135PMR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

TMS320

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of External Interrupts:

5

No. of I/O Lines:

37

No. of Serial I/Os:

4

No. of Terminals:

64

No. of Timers:

3

On Chip Data RAM Width:

8

On Chip Program ROM Width:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

36864

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

120 rpm

Maximum Supply Current:

50 mA

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

10 mm

Peripheral IC Type:

Connectivity:

CAN, I2C(2), SCI(3), SPI

Peripherals:

BOR, COMPARATOR(4), CAP(2), POR, PWM(14), QEP, TIMER(3), WDT(2)

Analog To Digital Convertors:

21-Ch 12-Bit

Trade Compliance

F2800135PMR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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