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EZ430-F2013

Texas Instruments

EZ430-F2013 by Texas Instruments

EZ430-F2013 by Texas Instruments is an MCU evaluation board with MSP430 core processor. It features a 16-bit MCU, part number MSP430F2013, and belongs to the MSP430F2 series. This development kit is used for embedded applications and evaluation purposes in various industries.

Median Price

$27.000

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 55 parts In-Stock

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$20.690

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55

$20.690

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Newark

USA . 55 parts In-Stock

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$27.000

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55

$27.000

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Element14

Singapore . 55 parts In-Stock

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$38.220

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55

$38.220

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Digiode

USA . 4,544 parts In-Stock

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4,544

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Vyrian

USA . 3,255 parts In-Stock

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3,255

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Distributors (Availability)

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AZTECH Wire

Italy . 415 parts In-Stock

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$7.750

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415

$7.750

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Semicontronic

India . 595 parts In-Stock

1+ parts

$48.100

100+ parts

$46.898

1k+ parts

$46.657

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595

$48.100

$46.898

$46.657

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One Stop Electronics

USA . 433 parts In-Stock

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$95.100

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433

$95.100

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Advanced Electronics

New Zealand . 4,252 parts In-Stock

1+ parts

$127.375

100+ parts

$115.911

1k+ parts

$104.448

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4,252

$127.375

$115.911

$104.448

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Ampacity Inc.

Singapore . 938 parts In-Stock

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$170.100

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938

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Glotronic Ltd.

UK . 3,790 parts In-Stock

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Corphita

USA . 1,805 parts In-Stock

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Parana Technologies

USA . 1,608 parts In-Stock

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$0.775

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1,608

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$0.775

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DigiPath Technology Company

USA . 1,588 parts In-Stock

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1,588

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Northwest PG Solutions

USA . 1,154 parts In-Stock

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$4.719

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1,154

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$4.719

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IDEA Electronic Components Group

UK . 760 parts In-Stock

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760

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Native Components

USA . 530 parts In-Stock

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$4.671

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530

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$4.671

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ChromeModa Solutions

Germany . 197 parts In-Stock

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197

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Corohmni

South Africa . 68 parts In-Stock

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68

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Overview

Experience the power and precision of the EZ430-F2013 by Texas Instruments, a top-of-the-line development board that opens up endless possibilities for embedded systems projects. With Texas Instruments' reputation for quality and innovation, you can trust that this board will deliver exceptional performance. Whether you're a seasoned developer or just starting out, the EZ430-F2013 offers unmatched value and convenience, making it the perfect choice for creating cutting-edge applications in fields such as IoT, robotics, and consumer electronics. Unlock your creativity and take your projects to the next level with the EZ430-F2013 today.

Feature Benefit Bullets

Other Names: 296-20630, 296-20630-NDR

Easy to search and identify the product with multiple names.

Category: Development Boards, Kits, Programmers, Evaluation Boards, Embedded MCU, DSP Evaluation Boards

Versatile usability for development and evaluation purposes in different applications.

Series: MSP430F2

Belongs to a trusted series known for its performance and reliability.

Type: MCU 16-Bit

Offers a powerful 16-bit microcontroller unit for processing tasks efficiently.

Core Processor: MSP430

Utilizes the MSP430 core processor known for its low power consumption and high performance.

Utilized IC / Part: MSP430F2013

Specifically designed for the MSP430F2013 IC/part, ensuring compatibility and optimized performance.

Mounting Type: Fixed

Securely fixed mounting type for stable connections and operations.

Board Type: Evaluation Platform

Designed as an evaluation platform for testing and assessing the capabilities of the product.

Base Product Number: EZ430

Comes from the EZ430 product line known for user-friendly interfaces and functionalities.

Moisture Sensitivity Level (MSL): 1 (Unlimited)

Suitable for use in various environments with no moisture sensitivity limitations.

Technical Specifications

Additional Parts EZ430-F2013 attributes and parameters. Explore more Additional Parts devices from Texas Instruments

Technical Specifications

Core Processor:

MSP430

Other Names:

296-20630
296-20630-NDR
EZ430F2013
-296-20630-ND

Category:

Development Boards, Kits, Programmers
Evaluation Boards Embedded MCU, DSP Evaluation Boards

Mounting Type:

Fixed

Standard Package:

1

Series:

MSP430F2

Type:

MCU 16-Bit

Contents:

Board(s)

Board Type:

Evaluation Platform

Utilized IC / Part:

MSP430F2013

Package:

Box

Base Product Number:

EZ430

Moisture Sensitivity Level (MSL):

1 (Unlimited)

Trade Compliance

EZ430-F2013 Miscellaneous Components trade compliance attributes, and parameters.

ECCN

EAR99

HTS

8473.30.1180

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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