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DS92LV3242TVS/NOPB

Texas Instruments

DS92LV3242TVS/NOPB by Texas Instruments

DS92LV3242TVS/NOPB by Texas Instruments is a Line Receiver IC with 4 functions, operating at -40 to 85°C. It has a supply voltage range of 3.135V to 3.465V and supports differential output. Ideal for industrial applications requiring high-speed data transmission in compact spaces due to its thin profile and fine pitch package style.

Median Price

$14.780

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 8,649 parts In-Stock

1+ parts

$11.570

100+ parts

$10.107

1k+ parts

$6.970

10k+ parts

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8,649

$11.570

$10.107

$6.970

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Mouser Electronics

USA . 85 parts In-Stock

1+ parts

$14.780

100+ parts

$11.370

1k+ parts

$9.360

10k+ parts

$9.350

85

$14.780

$11.370

$9.360

$9.350

DigiKey

USA . 1 parts In-Stock

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$19.180

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1

$19.180

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Digiode

USA . 3,072 parts In-Stock

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$10.992

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3,072

$10.992

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Bristol Electronics

USA . 601 parts In-Stock

1+ parts

$16.502

100+ parts

$14.598

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$13.532

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601

$16.502

$14.598

$13.532

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Vyrian

USA . 2,593 parts In-Stock

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2,593

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Dan-Mar Components

USA . 861 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 260 parts In-Stock

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Distributors (Availability)

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Native Components

USA . 19 parts In-Stock

1+ parts

$0.144

100+ parts

-

1k+ parts

-

10k+ parts

$0.138

19

$0.144

-

-

$0.138

Northwest PG Solutions

USA . 869 parts In-Stock

1+ parts

$0.158

100+ parts

-

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$0.140

869

$0.158

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$0.140

Parana Technologies

USA . 671 parts In-Stock

1+ parts

$4.442

100+ parts

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$4.868

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671

$4.442

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$4.868

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DigiPath Technology Company

USA . 1,657 parts In-Stock

1+ parts

$4.891

100+ parts

$4.500

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1,657

$4.891

$4.500

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ChromeModa Solutions

Germany . 2,458 parts In-Stock

1+ parts

$4.991

100+ parts

$4.093

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2,458

$4.991

$4.093

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IDEA Electronic Components Group

UK . 176 parts In-Stock

1+ parts

$4.991

100+ parts

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$4.492

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176

$4.991

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$4.492

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Corphita

USA . 1,931 parts In-Stock

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$10.413

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$10.413

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A-Z Elektronik GmbH

Germany . 6,377 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,251 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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Perfect Parts

USA . 2,828 parts In-Stock

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Futuretech Components

Singapore . 1,500 parts In-Stock

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Overview

Discover the high-quality DS92LV3242TVS/NOPB by Texas Instruments, a versatile solution in the Line Drivers & Receivers category. With its state-of-the-art design and reliable performance, this product is perfect for a wide range of applications. From industrial automation to automotive electronics, customers can trust in the value and benefits that this innovative technology brings. Experience seamless functionality and superior results with the DS92LV3242TVS/NOPB, designed to exceed expectations and deliver exceptional outcomes every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, ideal for portable or rugged applications.

Surface Mount: YES

Surface mount capability allows for easy integration onto printed circuit boards, saving space and enabling efficient manufacturing processes.

No. of Functions: 4

Having multiple functions in a single device reduces the need for additional components, simplifying the circuit design and improving overall system efficiency.

Package Shape: SQUARE

The square package shape provides a compact footprint, maximizing board space utilization and enabling efficient layout designs.

Maximum Supply Voltage-1: 3.465 V

The high maximum supply voltage tolerance ensures reliable operation and protection against voltage spikes or fluctuations in the system.

Power Supplies (V): 3.3

Operating at a standard power supply voltage of 3.3V simplifies compatibility with existing systems and reduces the need for additional power regulation.

No. of Terminals: 64

Having a higher number of terminals provides flexibility for connecting to various other components and peripherals, enhancing the device's functionality.

Package Style (Meter): FLATPACK, THIN PROFILE, FINE PITCH

The flatpack style with a thin profile and fine pitch ensures easy installation, improves signal integrity, and enables high-density packaging for space-constrained applications.

Minimum Supply Voltage-1: 3.135 V

The low minimum supply voltage requirement ensures operational reliability even under low-power conditions, making the device suitable for battery-powered devices.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the device can withstand harsh environmental conditions and maintain performance in demanding industrial settings.

Output Characteristics: 3-STATE

The 3-state output feature allows for tri-state operation, providing flexibility in signal control and enabling efficient communication protocols in the system.

Minimum Operating Temperature: -40 °C

The wide temperature range ensures reliable operation in extreme cold environments, making the device suitable for a diverse range of applications.

Terminal Finish: MATTE TIN

The matte tin terminal finish offers good solderability and corrosion resistance, ensuring robust interconnection with other components during assembly.

Terminal Position: QUAD

The quad terminal position simplifies the PCB layout and facilitates easy routing of connections, optimizing the overall circuit design.

Maximum Seated Height: 1.2 mm

The low seated height profile minimizes the overall package size and reduces the risk of mechanical interference in compact electronic devices.

Width: 10 mm

The 10mm width dimension provides a compact form factor, enabling easy integration into space-constrained applications without compromising performance.

Output Polarity: TRUE

Having a true output polarity ensures accurate signal transmission and compatibility with standard logic levels, simplifying system integration and compatibility.

Receiver No. of Bits: 4

The 4-bit receiver allows for encoding and decoding data signals with higher precision, improving signal integrity and enhancing communication reliability in the system.

Differential Output: YES

The presence of a differential output enhances noise immunity and signal integrity, making the device suitable for high-speed data transmission applications.

Maximum Time At Peak Reflow Temperature (s): 30

The short reflow time requirement simplifies the manufacturing process, reducing assembly time and improving overall production efficiency.

Peak Reflow Temperature °C: 260

With a high peak reflow temperature tolerance of 260°C, the device can withstand the reflow soldering process without degradation, ensuring reliable solder connections.

Length: 10 mm

The 10mm length dimension complements the compact width, offering a space-efficient package size for applications requiring small footprint components.

Temperature Grade: INDUSTRIAL

The industrial temperature grade rating ensures reliable performance across a wide range of operating temperatures, making the device suitable for industrial applications.

Maximum Receive Delay: 0 ns

The zero receive delay ensures real-time signal processing, minimizing latency and enabling rapid data transmission in high-speed communication systems.

Terminal Form: GULL WING

The gull wing terminal form offers mechanical stability and ease of soldering, ensuring secure connections and reliable performance in harsh operating conditions.

Maximum Supply Current: 265 mA

The 265mA maximum supply current rating indicates the device's power efficiency, consuming low power while delivering reliable performance under specified conditions.

Nominal Supply Voltage: 3.3 V

Operating at a standard nominal supply voltage of 3.3V ensures compatibility with common power sources and simplifies system integration.

Terminal Pitch: 0.5 mm

The 0.5mm terminal pitch enables high-density mounting on PCBs, allowing for compact layout designs and efficient use of board space.

Moisture Sensitivity Level (MSL): 3

The moisture sensitivity level of 3 indicates the device's robustness against moisture-induced failures, ensuring reliability in humid environments.

Interface IC Type: LINE RECEIVER

The use of a line receiver interface IC type enables reliable and accurate signal reception, making the device suitable for various data communication applications.

Technical Specifications

Line Drivers & Receivers DS92LV3242TVS/NOPB attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Interface IC Type:

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e3

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

4

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP64,.47SQ

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Receiver No. of Bits:

4

Maximum Seated Height:

1.2 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

265 mA

Nominal Supply Voltage:

3.3 V

Maximum Supply Voltage-1:

3.465 V

Minimum Supply Voltage-1:

3.135 V

Nominal Supply Voltage-1:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Trade Compliance

DS92LV3242TVS/NOPB Interface ICs trade compliance attributes, and parameters.

ECCN

5A991.B.1

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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