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DS90UH949ATRGCTQ1

Texas Instruments

DS90UH949ATRGCTQ1 by Texas Instruments

DS90UH949ATRGCTQ1 by Texas Instruments is a Line Driver with 64 terminals, operating at -40 to 105 °C. It features a differential output, input characteristics, and interface IC type for industrial applications. The package style is chip carrier with a very thin profile and terminal finish of nickel palladium gold.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,805 parts In-Stock

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Digiode

USA . 732 parts In-Stock

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732

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Distributors (Availability)

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Native Components

USA . 810 parts In-Stock

1+ parts

$0.465

100+ parts

-

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$0.446

810

$0.465

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$0.446

Northwest PG Solutions

USA . 75 parts In-Stock

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$0.512

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$0.451

75

$0.512

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$0.451

Parana Technologies

USA . 1,402 parts In-Stock

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$2.974

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$3.475

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$2.974

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$3.475

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DigiPath Technology Company

USA . 2,338 parts In-Stock

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$3.275

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$3.013

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$3.275

$3.013

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ChromeModa Solutions

Germany . 2,446 parts In-Stock

1+ parts

$3.342

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$2.740

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$3.342

$2.740

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IDEA Electronic Components Group

UK . 2,369 parts In-Stock

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$3.342

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$3.008

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2,369

$3.342

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$3.008

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AZTECH Wire

Italy . 284 parts In-Stock

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$19.066

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$19.066

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One Stop Electronics

USA . 1,496 parts In-Stock

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$44.500

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$44.500

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Lixinc

USA . 7,278 parts In-Stock

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Corphita

USA . 4,338 parts In-Stock

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Microchip USA

USA . 1,393 parts In-Stock

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Overview

Unlock the power of seamless communication with the DS90UH949ATRGCTQ1 by Texas Instruments. Designed with precision and reliability in mind, this line driver & receiver offers unparalleled performance in a compact package. Perfect for industrial applications, this product ensures smooth data transmission even in challenging environments. Trust in Texas Instruments to deliver cutting-edge solutions that elevate your technology to new heights. Experience the difference with the DS90UH949ATRGCTQ1 and revolutionize the way you connect.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable for various applications.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving time and space.

Maximum Supply Voltage: 1.89 V

Provides a wide operating range, suitable for different voltage requirements.

Screening Level: AEC-Q100

Ensures high reliability and quality standards, making it suitable for automotive applications.

Minimum Operating Temperature: -40 °C

Can operate in extreme low-temperature conditions, suitable for various environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Offers superior corrosion resistance and conductivity for reliable connections.

Differential Output: YES

Allows for high-speed data transmission with reduced noise interference.

Width: 9 mm

Compact size for space-saving installation in tight layouts.

Maximum Time At Peak Reflow Temperature (s): 30

Allows for efficient soldering process during assembly.

Temperature Grade: INDUSTRIAL

Suitable for use in industrial settings with varying temperature conditions.

Input Characteristics: DIFFERENTIAL

Enables better signal integrity and noise rejection in data transmission.

Nominal Supply Voltage: 1.8 V

Common voltage supply level for compatibility with various systems.

Moisture Sensitivity Level (MSL): 3

Designed to withstand moderate moisture exposure during operation.

Interface IC Type: LINE DRIVER

Specifically designed for line driving applications, ensuring optimal performance.

Technical Specifications

Line Drivers & Receivers DS90UH949ATRGCTQ1 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

1

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e4

Length:

9 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

64

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100

Maximum Seated Height:

1 mm

Maximum Supply Voltage:

1.89 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Maximum Supply Voltage-1:

1.155 V

Minimum Supply Voltage-1:

1.045 V

Nominal Supply Voltage-1:

1.1 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

9 mm

Trade Compliance

DS90UH949ATRGCTQ1 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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