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DS90UH949ATRGCRQ1

Texas Instruments

DS90UH949ATRGCRQ1 by Texas Instruments

DS90UH949ATRGCRQ1 by Texas Instruments is a Line Driver with 64 terminals, operating at -40 to 105 °C. It has a differential output and input characteristics, suitable for industrial applications requiring a max supply voltage of 1.89 V. The package style is chip carrier with a very thin profile, making it ideal for compact designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,656 parts In-Stock

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Cyclops Electronics Ltd

UK . 3,000 parts In-Stock

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Digiode

USA . 2,873 parts In-Stock

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Parana Technologies

USA . 897 parts In-Stock

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$11.194

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$11.636

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897

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AZTECH Wire

Italy . 829 parts In-Stock

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$12.276

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DigiPath Technology Company

USA . 2,262 parts In-Stock

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$12.326

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$11.340

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ChromeModa Solutions

Germany . 4,877 parts In-Stock

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$12.578

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$10.314

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IDEA Electronic Components Group

UK . 1,616 parts In-Stock

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$12.578

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$11.949

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$11.320

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One Stop Electronics

USA . 1,593 parts In-Stock

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$29.500

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Authorized Procurement Solutions

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Lixinc

USA . 19,364 parts In-Stock

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Perfect Parts

USA . 17,920 parts In-Stock

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Microchip USA

USA . 12,439 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 10,554 parts In-Stock

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Corphita

USA . 3,935 parts In-Stock

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Native Components

USA . 950 parts In-Stock

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950

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Northwest PG Solutions

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Overview

Experience unparalleled quality and reliability with the DS90UH949ATRGCRQ1 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-of-the-line Line Drivers & Receivers that are versatile and high-performing. This product is designed to meet industrial standards, making it ideal for a wide range of applications. With advanced features and innovative technology, customers can expect superior value, efficiency, and precision. Trust Texas Instruments to provide the best solutions for your needs. Elevate your projects with the DS90UH949ATRGCRQ1 today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the line driver/receiver.

Surface Mount: YES

Allows for easy and convenient installation on circuit boards without the need for additional hardware.

Maximum Supply Voltage: 1.89 V

Ensures stable and reliable performance within the specified voltage range.

Screening Level: AEC-Q100

Meets automotive quality standards, making it suitable for use in automotive applications.

Minimum Operating Temperature: -40 °C

Can operate effectively in extreme cold environments, ensuring versatility in various applications.

Technical Specifications

Line Drivers & Receivers DS90UH949ATRGCRQ1 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

1

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e4

Length:

9 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

64

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100

Maximum Seated Height:

1 mm

Maximum Supply Voltage:

1.89 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Maximum Supply Voltage-1:

1.155 V

Minimum Supply Voltage-1:

1.045 V

Nominal Supply Voltage-1:

1.1 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

9 mm

Trade Compliance

DS90UH949ATRGCRQ1 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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