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DS90UB925QSEVB/NOPB

Texas Instruments

DS90UB925QSEVB/NOPB by Texas Instruments

DS90UB925QSEVB/NOPB by Texas Instruments is an interface serializer with I2C interface. It comes in a box package and includes board(s) and cable(s). This development kit is used for evaluating DS90UB925 IC, commonly applied in automotive camera systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 5,881 parts In-Stock

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Digiode

USA . 3,524 parts In-Stock

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AZTECH Wire

Italy . 329 parts In-Stock

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$14.248

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Ampacity Inc.

Singapore . 563 parts In-Stock

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$33.100

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One Stop Electronics

USA . 614 parts In-Stock

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$36.100

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Semicontronic

India . 558 parts In-Stock

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$50.100

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$48.848

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$48.597

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558

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$48.848

$48.597

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Continental Prestige Electronics

USA . 1 parts In-Stock

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$374.320

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Corphita

USA . 4,640 parts In-Stock

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Northwest PG Solutions

USA . 1,579 parts In-Stock

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ChromeModa Solutions

Germany . 1,555 parts In-Stock

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DigiPath Technology Company

USA . 1,259 parts In-Stock

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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Native Components

USA . 942 parts In-Stock

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Corohmni

South Africa . 285 parts In-Stock

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IDEA Electronic Components Group

UK . 271 parts In-Stock

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Parana Technologies

USA . 211 parts In-Stock

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$1.276

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$1.276

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Overview

Experience superior quality and innovation with the DS90UB925QSEVB/NOPB by Texas Instruments. This interface serializer board offers unparalleled performance and reliability, making it the perfect choice for a wide range of applications. From development projects to evaluation boards, this product provides convenience and ease of use. Trust in Texas Instruments' reputation for excellence and unlock the full potential of your designs with the DS90UB925QSEVB/NOPB.

Feature Benefit Bullets

Other Names: 296-DS90UB925QSEVB/NOPB-ND

Different naming options make it easier to search for and identify the product.

Category: Development Boards, Kits, Programmers, Evaluation Boards

Versatile product that can be used for development, evaluation, and programming purposes.

Package: Box

Comes in a secure and convenient packaging for protection during transportation and storage.

Type: Interface

Facilitates communication and data transfer between components or systems.

Function: Serializer

Converts parallel data from a sensor to serial data for efficient transmission.

Utilized IC / Part: DS90UB925Q

Utilizes a specific IC or part known for its quality and reliability.

Supplied Contents: Board(s), Cable(s)

Comes with essential components for immediate use and connectivity.

Secondary Attributes: I2C Interface

Supports a common communication interface for easy integration with other devices.

Base Product Number: DS90UB925

Part of a series or product line known for its performance and features.

Moisture Sensitivity Level (MSL): 1 (Unlimited)

Can be stored and used in various environmental conditions without risk of moisture damage.

Technical Specifications

Additional Parts DS90UB925QSEVB/NOPB attributes and parameters. Explore more Additional Parts devices from Texas Instruments

Technical Specifications

Other Names:

296-DS90UB925QSEVB/NOPB-ND
296-DS90UB925QSEVB/NOPB
296-37496
DS90UB925QSEVB/NO
DS90UB925QSEVB/NOPB-ND

Function:

Serializer

Type:

Interface

Category:

Development Boards, Kits, Programmers
Evaluation Boards Evaluation and Demonstration Boards and Kits

Supplied Contents:

Board(s), Cable(s)

Secondary Attributes:

I2C Interface

Utilized IC / Part:

DS90UB925Q

Package:

Box

Standard Package:

1

Base Product Number:

DS90UB925

Moisture Sensitivity Level (MSL):

1 (Unlimited)

Trade Compliance

DS90UB925QSEVB/NOPB Miscellaneous Components trade compliance attributes, and parameters.

ECCN

EAR99

HTS

8543.70.9860

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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