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DS34C87TMX

Texas Instruments

DS34C87TMX by Texas Instruments

DS34C87TMX by Texas Instruments is a 4-function line driver with 5V supply, EIA-422 interface standard, and 11ns max transmit delay. Ideal for industrial applications requiring CMOS technology and differential output in a compact small outline package.

Median Price

$0.720

Lifecycle Status

Suppliers In-Stock

25

In-Stock Inventory

1k+

Distributors (Authorized)

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Rochester

USA . 12,500 parts In-Stock

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$0.720

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$0.710

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$0.690

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$0.720

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Digiode

USA . 3,401 parts In-Stock

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Prism Electronics

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LIBRA Elektronik GmbH

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ComSIT Distribution GmbH

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Sogenti Electronics

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Lantek

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Anansix

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PC Components Company LLC

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Legend Electronics Inc.

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Resion

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Vyrian

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Nova Conductors

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Electronic Expediters

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Right Parts Inc.

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Distributors (Availability)

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Parana Technologies

USA . 2,151 parts In-Stock

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$7.897

100+ parts

$733.353

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$7.107

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One Stop Electronics

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DigiPath Technology Company

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IDEA Electronic Components Group

UK . 2,153 parts In-Stock

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$8.429

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ChromeModa Solutions

Germany . 2,129 parts In-Stock

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$7.276

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AZTECH Wire

Italy . 319 parts In-Stock

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Ampacity Inc.

Singapore . 410 parts In-Stock

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Component Stockers USA

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Metaverse IC Inc.

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Perfect Parts

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Cyclops Electronics Ltd (Excess)

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Alle Elektronik GmbH

Germany . 1,700 parts In-Stock

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GreenTree Electronics

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Microchip USA

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Overview

Transform the way you transmit data with the DS34C87TMX by Texas Instruments. Crafted from high-quality materials and boasting top-of-the-line technology, this line driver offers unmatched reliability and performance. From industrial applications to communication systems, trust in Texas Instruments to deliver seamless connectivity and efficiency. Experience the value of precise data transmission and discover the benefits of using the DS34C87TMX in your projects. Elevate your operations with this innovative solution today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is durable and lightweight, making the product suitable for various applications while ensuring long-term reliability.

Surface Mount: YES

Surface mount design allows for easy and convenient installation on circuit boards, saving space and facilitating automated assembly processes.

Maximum Supply Voltage: 5.5 V

Support for a maximum supply voltage of 5.5V ensures compatibility with a wide range of systems and voltage requirements.

No. of Functions: 4

Multiple functions integrated into a single device provide cost-effective solutions for complex signal processing needs.

Package Shape: RECTANGULAR

Rectangular package shape makes it easy to integrate the product into existing circuit designs and layouts.

Maximum Transmit Delay: 11 ns

Low transmit delay of 11 nanoseconds ensures fast signal propagation, ideal for high-speed data transmission applications.

Power Supplies (V): 5

Standard power supply voltage of 5V simplifies compatibility with existing systems and reduces the need for additional power conversion components.

No. of Terminals: 16

Multiple terminals provide flexible connectivity options and support for various input and output configurations.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the circuit board and allows for dense mounting of components in limited spaces.

Maximum High Level Input Current: 0.000001 Amp

Low input current requirements result in minimal power consumption and reduced heat generation, suitable for energy-efficient designs.

Minimum Supply Voltage: 4.5 V

Support for a minimum supply voltage of 4.5V ensures reliable operation even under low voltage conditions, improving system robustness.

Maximum Operating Temperature: 85 °C

Wide operating temperature range of up to 85°C allows for reliable operation in various environmental conditions.

Output Characteristics: 3-STATE

3-STATE output allows for high impedance output state, enabling multi-drop bus arrangements and reducing signal interference.

Minimum Operating Temperature: -40 °C

Low operating temperature of -40°C ensures the product's performance and reliability in extreme cold environments.

Terminal Finish: TIN LEAD

TIN LEAD terminal finish provides reliable electrical connections and solderability, ensuring consistent performance over the product's lifespan.

Terminal Position: DUAL

Dual terminal position offers flexibility in board layout and component placement, facilitating easy integration into circuit designs.

Maximum Seated Height: 1.75 mm

Low seated height of 1.75mm reduces the overall profile of the product, making it suitable for applications with height constraints.

Width: 3.9 mm

Narrow width of 3.9mm enables space-efficient placement on the circuit board, allowing for compact design layouts.

Differential Output: YES

Differential output configuration provides improved noise immunity and signal integrity, enhancing the product's performance in noisy environments.

Maximum Time At Peak Reflow Temperature (s): 20

Maximum reflow time of 20 seconds at peak temperature ensures proper soldering and reliability during the manufacturing process.

Peak Reflow Temperature °C: 235

Peak reflow temperature of 235°C facilitates reliable soldering and assembly processes, ensuring product quality.

Length: 9.9 mm

Compact length of 9.9mm allows for efficient placement on the circuit board and supports high-density component layouts.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable performance in harsh industrial environments, making the product suitable for rugged applications.

Maximum Receive Delay: 0 ns

Zero receive delay ensures instantaneous response to input signals, ideal for high-speed data communication and signal processing.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and fast switching speeds, enhancing the product's performance and efficiency.

Terminal Form: GULL WING

Gull wing terminal form provides secure mechanical connections and ease of soldering during assembly, ensuring reliable electrical contacts.

Interface Standard: EIA-422

Compliance with EIA-422 interface standard ensures compatibility with industry-standard communication protocols, making the product versatile for various applications.

Input Characteristics: STANDARD

Standardized input characteristics simplify integration with other components and systems, ensuring seamless interoperability in diverse applications.

Nominal Supply Voltage: 5 V

Nominal supply voltage of 5V ensures stable operation and compatibility with standard voltage levels, reducing the need for additional voltage regulation.

Terminal Pitch: 1.27 mm

Fine terminal pitch of 1.27mm allows for compact terminal placement, supporting high-density PCB layouts and reducing board footprint.

Driver No. of Bits: 4

4-bit driver configuration provides sufficient drive capability for multiple signal lines, ensuring reliable data transmission and signal integrity.

Interface IC Type: LINE DRIVER

Line driver interface IC type offers robust signal amplification and noise suppression, making the product suitable for long-distance signal transmission.

Technical Specifications

Line Drivers & Receivers DS34C87TMX attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

4

Maximum High Level Input Current:

.000001 Amp

Input Characteristics:

STANDARD

Interface IC Type:

Interface Standard:

EIA-422

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e0

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Maximum Seated Height:

1.75 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

20

Maximum Transmit Delay:

11 ns

Width:

3.9 mm

Trade Compliance

DS34C87TMX Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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