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DS26LS31N

Texas Instruments

DS26LS31N by Texas Instruments

DS26LS31N by Texas Instruments is a 4-function LINE DRIVER with 5V supply, 15ns max transmit delay, and 3-STATE output. Ideal for EIA-422 interface standard applications due to its BIPOLAR technology and THROUGH-HOLE terminal form.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 9,692 parts In-Stock

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Digiode

USA . 2,139 parts In-Stock

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Distributors (Availability)

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Parana Technologies

USA . 775 parts In-Stock

1+ parts

$6.805

100+ parts

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$7.450

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775

$6.805

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$7.450

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DigiPath Technology Company

USA . 1,884 parts In-Stock

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$7.493

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$7.493

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ChromeModa Solutions

Germany . 600 parts In-Stock

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$7.646

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$6.270

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600

$7.646

$6.270

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IDEA Electronic Components Group

UK . 594 parts In-Stock

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$7.646

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$6.881

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594

$7.646

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$6.881

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Ampacity Inc.

Singapore . 1,633 parts In-Stock

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$8.500

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One Stop Electronics

USA . 336 parts In-Stock

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$10.500

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336

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AZTECH Wire

Italy . 876 parts In-Stock

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$18.616

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Corphita

USA . 1,046 parts In-Stock

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Native Components

USA . 773 parts In-Stock

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$3.168

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Northwest PG Solutions

USA . 734 parts In-Stock

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Microchip USA

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Overview

Enhance your electronic designs with the DS26LS31N by Texas Instruments, a top-tier manufacturer known for superior quality and reliability. As a versatile Line Driver & Receiver, this product offers unmatched performance in various applications. With its advanced technology and seamless interface standards, customers can expect efficient signal transmission and enhanced overall functionality. Trust in Texas Instruments to deliver cutting-edge solutions that exceed expectations, providing value and benefits that set you apart from the competition. Elevate your projects with the DS26LS31N and experience innovation at its finest.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protection for the components inside, ensuring a longer lifespan for the product.

Maximum Supply Voltage: 5.25 V

With a high maximum supply voltage, this product can handle higher voltage levels without risking damage, making it suitable for a variety of applications.

No. of Functions: 4

Having multiple functions in one product can help reduce the number of components needed in a circuit, simplifying the design and potentially saving space and cost.

Package Shape: RECTANGULAR

The rectangular shape of the package makes it easy to mount on circuit boards or enclosures, providing a compact and efficient design.

Maximum Transmit Delay: 15 ns

With a low maximum transmit delay, this product ensures fast signal transmission, making it ideal for applications where timing is critical.

Power Supplies (V): 5

Operating at a standard 5V power supply, this product is compatible with most systems and can be easily integrated into existing setups.

No. of Terminals: 16

The 16 terminals provide ample connection points for various inputs and outputs, allowing for flexibility in circuit configurations.

Output Characteristics: 3-STATE

The 3-state output allows the driver to be in one of three output states (high, low, or high impedance), providing versatility in signal control and reducing power consumption when not actively transmitting.

Temperature Grade: COMMERCIAL

Designed for commercial applications, this product is suitable for use in standard operating temperature ranges, ensuring reliability in typical environments.

Technical Specifications

Line Drivers & Receivers DS26LS31N attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

4

Maximum High Level Input Current:

.00002 Amp

Input Characteristics:

STANDARD

Interface IC Type:

Interface Standard:

EIA-422; FED STD 1020

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e0

Length:

19.05 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Minimum Out Swing:

2 V

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Maximum Seated Height:

4.318 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Transmit Delay:

15 ns

Width:

7.62 mm

Trade Compliance

DS26LS31N Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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