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DS125DF410SQE/NOPB

Texas Instruments

DS125DF410SQE/NOPB by Texas Instruments

DS125DF410SQE/NOPB by Texas Instruments is a line driver and receiver with 4 functions. It operates at a supply voltage range of 2.375V to 2.625V and has an industrial temperature grade. This IC is commonly used as a line transceiver in various applications.

Median Price

$30.550

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 49,987 parts In-Stock

1+ parts

$24.513

100+ parts

$21.412

1k+ parts

$14.767

10k+ parts

-

49,987

$24.513

$21.412

$14.767

-

DigiKey

USA . 571 parts In-Stock

1+ parts

$33.720

100+ parts

$24.018

1k+ parts

$23.185

10k+ parts

-

571

$33.720

$24.018

$23.185

-

Mouser Electronics

USA . 235 parts In-Stock

1+ parts

$33.720

100+ parts

$23.990

1k+ parts

$23.180

10k+ parts

-

235

$33.720

$23.990

$23.180

-

Arrow

USA . 250 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$27.381

10k+ parts

$24.426

250

-

-

$27.381

$24.426

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 74 parts In-Stock

1+ parts

$21.310

100+ parts

-

1k+ parts

-

10k+ parts

-

74

$21.310

-

-

-

Digiode

USA . 4,648 parts In-Stock

1+ parts

$23.287

100+ parts

-

1k+ parts

-

10k+ parts

-

4,648

$23.287

-

-

-

Vyrian

USA . 4,102 parts In-Stock

1+ parts

-

100+ parts

-

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4,102

-

-

-

-

TME

Poland . 250 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$24.770

10k+ parts

-

250

-

-

$24.770

-

Prism Electronics

USA . 12 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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12

-

-

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ComSIT Distribution GmbH

Germany . 2 parts In-Stock

1+ parts

-

100+ parts

-

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2

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,990 parts In-Stock

1+ parts

$8.712

100+ parts

-

1k+ parts

$9.393

10k+ parts

-

1,990

$8.712

-

$9.393

-

ChromeModa Solutions

Germany . 3,104 parts In-Stock

1+ parts

$9.789

100+ parts

$8.027

1k+ parts

-

10k+ parts

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3,104

$9.789

$8.027

-

-

IDEA Electronic Components Group

UK . 382 parts In-Stock

1+ parts

$9.789

100+ parts

$9.300

1k+ parts

$8.810

10k+ parts

-

382

$9.789

$9.300

$8.810

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Corphita

USA . 229 parts In-Stock

1+ parts

$22.062

100+ parts

-

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-

10k+ parts

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229

$22.062

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Microchip USA

USA . 2,435 parts In-Stock

1+ parts

$48.090

100+ parts

$47.250

1k+ parts

$46.830

10k+ parts

$46.410

2,435

$48.090

$47.250

$46.830

$46.410

Lixinc

USA . 9,118 parts In-Stock

1+ parts

-

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9,118

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A-Z Elektronik GmbH

Germany . 6,071 parts In-Stock

1+ parts

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6,071

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Alle Elektronik GmbH

Germany . 4,047 parts In-Stock

1+ parts

-

100+ parts

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4,047

-

-

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DigiPath Technology Company

USA . 36 parts In-Stock

1+ parts

-

100+ parts

$8.826

1k+ parts

-

10k+ parts

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36

-

$8.826

-

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Overview

Discover the DS125DF410SQE/NOPB by Texas Instruments, a cutting-edge Line Driver & Receiver that guarantees superior quality and unmatched performance. As a trusted manufacturer, Texas Instruments exemplifies excellence in innovation and technology. This versatile product offers limitless possibilities across various applications. With its advanced features, including differential output and input characteristics, the DS125DF410SQE/NOPB delivers seamless connectivity and optimum functionality. Experience unparalleled value with this chip carrier, heat sink/slug, very thin profile package, providing reliability, efficiency, and convenience. Upgrade your systems today and unlock the potential of the DS125DF410SQE/NOPB!

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY. This material provides durability and resistance to various environmental conditions, making the product a reliable choice.

Surface Mount:

YES. With a surface mount option, the product offers ease of installation and space-saving advantages, making it suitable for compact designs.

Maximum Supply Voltage:

2.625 V. The higher maximum supply voltage allows for greater flexibility in power requirements, accommodating a wider range of applications.

No. of Functions:

4. The multiple functions integrated into a single product offer cost-effectiveness and efficiency, saving space and reducing complexity.

Package Shape:

SQUARE. The square package shape allows for efficient use of PCB space and facilitates easier mounting and alignment, enhancing overall design convenience.

Maximum Supply Voltage-1:

2.625 V. Offering consistent maximum supply voltage across functions ensures reliable performance and compatibility in various circuits.

No. of Terminals:

48. The abundance of terminals allows for greater connectivity options, expanding the product's versatility and compatibility with different systems.

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE. This package style enables efficient heat dissipation, ensuring optimum performance even in compact designs with limited space for cooling.

Minimum Supply Voltage-1:

2.375 V. The lower minimum supply voltage enables efficient power consumption, making the product suitable for low-power applications.

Minimum Supply Voltage:

2.375 V. The product's ability to operate with a lower minimum supply voltage enhances energy efficiency and extends battery life in portable devices.

Maximum Operating Temperature:

85 °C. With a high maximum operating temperature, the product can withstand demanding environments, making it suitable for industrial applications.

Minimum Operating Temperature:

40 °C. The ability to operate in extreme temperatures ensures reliability and usability in a variety of environments, expanding the product's application range.

Terminal Finish:

MATTE TIN. The matte tin finish provides excellent solderability and corrosion resistance, ensuring long-term reliability and performance.

Terminal Position:

QUAD. The quad terminal position allows for secure and stable connections, reducing the risk of signal loss or interference, and ensuring robust operation.

Maximum Seated Height:

0.8 mm. With a low seated height, the product is suitable for compact designs, enabling thinner and more streamlined devices.

Width:

7 mm. The compact width of the product allows for space-efficient integration and compatibility with various board layouts and designs.

Receiver No. of Bits:

4. The inclusion of four bits in the receiver allows for higher data transmission capacity, enhancing the product's versatility and performance in data-intensive applications.

Differential Output:

YES. The differential output ensures superior signal integrity and noise immunity, making the product ideal for high-speed data transmission and demanding communication protocols.

Maximum Time At Peak Reflow Temperature (s):

30. With a maximum reflow time of 30 seconds, the product is easily and quickly integrated into manufacturing processes, reducing production time and costs.

Peak Reflow Temperature °C:

260. The high peak reflow temperature ensures secure and reliable soldering, eliminating the risk of connection failures during manufacturing or field use.

Length:

7 mm. The compact length of the product allows for space-efficient integration and compatibility with various board layouts and designs.

Minimum Out Swing:

2 V. The minimum output swing ensures proper signal levels, minimizing distortion and ensuring accurate data transmission in different environments.

Temperature Grade:

INDUSTRIAL. Designed for industrial applications, the product withstands harsh temperature conditions, ensuring long-term reliability and performance.

Maximum Receive Delay:

0 ns. The absence of receive delay in the product allows for real-time and synchronous data transmission, making it suitable for time-critical applications.

No. of Channels:

4. With four channels, the product provides multi-channel support, enabling simultaneous data transmission and reception, enhancing system throughput and efficiency.

Terminal Form:

NO LEAD. The no-lead terminal form enhances reliability, reducing the risk of solder joint failure and ensuring stable connections for improved performance.

Input Characteristics:

DIFFERENTIAL. The differential input characteristics provide superior noise rejection and common-mode voltage range, ensuring accurate data reception and reducing interference.

Nominal Supply Voltage:

2.5 V. The product operates at a nominal supply voltage of 2.5V, providing compatibility with a wide range of systems and voltage levels.

Terminal Pitch:

0.5 mm. The small terminal pitch allows for higher density mounting, enabling compact designs and increased functionality in limited spaces.

Nominal Supply Voltage-1:

2.5 V. With consistent nominal supply voltage across functions, this product offers compatibility and reliability in various circuit configurations.

Driver No. of Bits:

4. The inclusion of four bits in the driver allows for higher data transmission capacity, enhancing the product's versatility and performance in data-intensive applications.

Moisture Sensitivity Level (MSL):

3. The moisture sensitivity level 3 rating ensures proper handling and storage, reducing the risk of moisture-related damage during manufacturing and transportation.

Interface IC Type:

LINE TRANSCEIVER. The line transceiver interface provides seamless communication between different systems and devices, making the product suitable for various applications and network topologies.

Technical Specifications

Line Drivers & Receivers DS125DF410SQE/NOPB attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

4

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

4

No. of Functions:

4

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Out Swing:

2 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Receive Delay:

0 ns

Receiver No. of Bits:

4

Maximum Seated Height:

.8 mm

Maximum Supply Voltage:

2.625 V

Minimum Supply Voltage:

2.375 V

Nominal Supply Voltage:

2.5 V

Maximum Supply Voltage-1:

2.625 V

Minimum Supply Voltage-1:

2.375 V

Nominal Supply Voltage-1:

2.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Trade Compliance

DS125DF410SQE/NOPB Interface ICs trade compliance attributes, and parameters.

ECCN

5A991.B

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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