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DS125BR210SQE/NOPB

Texas Instruments

DS125BR210SQE/NOPB by Texas Instruments

DS125BR210SQE/NOPB by Texas Instruments is a Line Transceiver with 24 terminals, operating at -40 to 85°C. It has a power supply of 2.5/3.3V and offers no lead terminal form in a square chip carrier package for industrial applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,601 parts In-Stock

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8,601

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Digiode

USA . 838 parts In-Stock

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838

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 656 parts In-Stock

1+ parts

$9.814

100+ parts

$911.382

1k+ parts

$8.833

10k+ parts

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656

$9.814

$911.382

$8.833

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DigiPath Technology Company

USA . 2,360 parts In-Stock

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$10.806

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2,360

$10.806

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ChromeModa Solutions

Germany . 6,854 parts In-Stock

1+ parts

$11.027

100+ parts

$9.042

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6,854

$11.027

$9.042

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IDEA Electronic Components Group

UK . 636 parts In-Stock

1+ parts

$11.027

100+ parts

$10.476

1k+ parts

$9.924

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636

$11.027

$10.476

$9.924

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AZTECH Wire

Italy . 612 parts In-Stock

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$12.417

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612

$12.417

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One Stop Electronics

USA . 889 parts In-Stock

1+ parts

$44.500

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889

$44.500

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Corphita

USA . 4,461 parts In-Stock

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4,461

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Northwest PG Solutions

USA . 1,080 parts In-Stock

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1,080

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Native Components

USA . 975 parts In-Stock

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975

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Overview

Unlock the power of seamless data transmission with the DS125BR210SQE/NOPB from Texas Instruments. Built with precision and reliability, this line driver & receiver is designed for industrial-grade applications where high performance is crucial. With a package body material made of durable PLASTIC/EPOXY and a terminal pitch of 0.5mm, this chip carrier offers unparalleled quality and efficiency. Say goodbye to delays with a maximum receive delay of 0 ns, providing you with real-time data transmission. Trust in Texas Instruments to deliver cutting-edge technology that meets your needs for optimal performance. Elevate your projects with the DS125BR210SQE/NOPB and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a long product lifespan.

Surface Mount: YES

Allows for easy and secure installation onto circuit boards, saving time and effort during assembly.

Package Shape: SQUARE

Helps in optimizing space on the circuit board, making it suitable for compact designs.

Power Supplies (V): 2.5/3.3

Offers flexibility in power options, accommodating a wide range of applications and compatibility with different systems.

No. of Terminals: 24

Provides multiple connection points for enhanced functionality and versatility in circuit configurations.

Package Style (Meter): CHIP CARRIER

Facilitates efficient heat dissipation and protection of the internal components, ensuring reliability in operation.

Maximum Operating Temperature: 85 °C

Allows the product to function effectively in high-temperature environments, increasing its suitability for industrial applications.

Minimum Operating Temperature: -40 °C

Ensures reliable performance even in low-temperature conditions, making it suitable for a wide range of operating environments.

Terminal Position: QUAD

Enables easy and organized connection of external devices, enhancing the overall usability of the product.

Temperature Grade: INDUSTRIAL

Certifies the product for use in rigorous industrial settings, indicating its durability and reliability under harsh conditions.

Maximum Receive Delay: 0 ns

Ensures minimal delay in signal transmission, making the product ideal for high-speed communication applications.

Terminal Form: NO LEAD

Reduces the risk of lead contamination, ensuring safety compliance and environmental friendliness of the product.

Terminal Pitch: 0.5 mm

Allows for precise and compact connections, enabling efficient signal transmission and saving space on the circuit board.

Interface IC Type: LINE TRANSCEIVER

Facilitates seamless communication between different devices, enhancing compatibility and functionality in diverse electronic systems.

Technical Specifications

Line Drivers & Receivers DS125BR210SQE/NOPB attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Interface IC Type:

JESD-30 Code:

S-PQCC-N24

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC24,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Sub-Category:

Line Driver or Receivers

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

DS125BR210SQE/NOPB Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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