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DRV1101U

Texas Instruments

DRV1101U by Texas Instruments

DRV1101U by Texas Instruments is a Line Driver with 5.5V max supply voltage, 25ns max transmit delay, and 85°C max operating temperature. Ideal for industrial applications requiring differential output and complementary polarity in a compact package.

Median Price

$10.776

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

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Texas Instruments

USA . 18,088 parts In-Stock

1+ parts

$9.603

100+ parts

$8.388

1k+ parts

$5.785

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$9.603

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$5.785

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Rochester

USA . 8,186 parts In-Stock

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-

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$9.560

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$8.550

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$8.050

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$9.560

$8.550

$8.050

DigiKey

USA . 8,186 parts In-Stock

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$12.580

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$12.580

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Verical

USA . 4,681 parts In-Stock

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$11.950

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$10.688

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$10.063

4,681

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$10.688

$10.063

Distributors (In-Stock)

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Digiode

USA . 4,595 parts In-Stock

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$7.628

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Nova Conductors

Japan . 70 parts In-Stock

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Vyrian

USA . 8,906 parts In-Stock

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Bristol Electronics

USA . 266 parts In-Stock

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Atlantic Semiconductor

USA . 266 parts In-Stock

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Elcom Components

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SPM Sales

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DigiKey Marketplace

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ComSIT Distribution GmbH

Germany . 29 parts In-Stock

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Distributors (Availability)

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Corohmni

South Africa . 662 parts In-Stock

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$6.267

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$6.267

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Corphita

USA . 2,690 parts In-Stock

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$7.227

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$7.227

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Continental Prestige Electronics

USA . 4,043 parts In-Stock

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$8.430

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$8.261

4,043

$8.430

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$8.261

Netroflash

USA . 50 parts In-Stock

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$8.430

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$8.261

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$8.430

$8.261

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Parana Technologies

USA . 1,640 parts In-Stock

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$9.217

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$9.860

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$9.217

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$9.860

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ChromeModa Solutions

Germany . 3,993 parts In-Stock

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$10.356

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$8.492

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$10.356

$8.492

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IDEA Electronic Components Group

UK . 1,574 parts In-Stock

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$10.356

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$9.838

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$9.320

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1,574

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A-Z Elektronik GmbH

Germany . 5,151 parts In-Stock

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Kepictronics

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Glotronic Ltd.

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Argo Parts USA

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Alle Elektronik GmbH

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Authorized Procurement Solutions

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DigiPath Technology Company

USA . 1,885 parts In-Stock

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Perfect Parts

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Microchip USA

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Assy Fe

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Overview

Enhance your electronics projects with the Texas Instruments DRV1101U Line Driver & Receiver. Manufactured by industry leader Texas Instruments, this product offers unparalleled quality and reliability. Ideal for a wide range of applications, this line driver ensures fast data transmission and precise signal reception. Experience the benefits of seamless connectivity and improved performance with the DRV1101U. Unlock the full potential of your designs with this innovative solution.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good mechanical strength and protects the internal components of the product, ensuring durability and reliability.

Surface Mount: YES

Surface mount technology makes the product easy to install on printed circuit boards, saving space and improving efficiency.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage allows for versatile use in various applications without the risk of damaging the device.

Package Shape: RECTANGULAR

The rectangular shape of the package makes it easy to mount and integrate into existing circuit designs.

Maximum Transmit Delay: 25 ns

The low transmit delay ensures fast and efficient data transmission, making the product suitable for high-speed applications.

Power Supplies (V): 5

Operating at a standard 5V power supply makes the product compatible with common power sources and easy to integrate into existing systems.

Output Characteristics: DIFFERENTIAL

Differential output enables noise immunity and signal integrity, making the product ideal for long-distance communication and industrial applications.

Minimum Operating Temperature: -40 °C

With a wide operating temperature range, the product can perform reliably in harsh environmental conditions, making it suitable for industrial applications.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making the product energy-efficient and reliable in various operating conditions.

Interface IC Type: LINE DRIVER

Designed specifically for driving communication lines, this product ensures efficient and reliable data transmission in various applications.

Technical Specifications

Line Drivers & Receivers DRV1101U attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

1

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Out Swing:

8.5 V

Output Characteristics:

DIFFERENTIAL

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Maximum Seated Height:

1.75 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

38 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Maximum Supply Voltage-1:

5.5 V

Minimum Supply Voltage-1:

4.5 V

Nominal Supply Voltage-1:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Transmit Delay:

25 ns

Width:

3.9 mm

Trade Compliance

DRV1101U Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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