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DRV10963EVM

Texas Instruments

DRV10963EVM by Texas Instruments

DRV10963EVM by Texas Instruments is a Power Management Evaluation Board for DRV10963 motor controller/driver IC. It supports BLDC motors, features potentiometer speed control, and comes in a box package. Ideal for testing and demonstrating motor control applications efficiently.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 4,952 parts In-Stock

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Digiode

USA . 3,728 parts In-Stock

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Native Components

USA . 168 parts In-Stock

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$0.253

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$0.243

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$0.243

Northwest PG Solutions

USA . 1,208 parts In-Stock

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$0.278

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$0.245

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AZTECH Wire

Italy . 519 parts In-Stock

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$11.158

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One Stop Electronics

USA . 365 parts In-Stock

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Semicontronic

India . 449 parts In-Stock

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$162.922

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$162.087

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Ampacity Inc.

Singapore . 638 parts In-Stock

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$209.100

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Corphita

USA . 2,541 parts In-Stock

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DigiPath Technology Company

USA . 2,003 parts In-Stock

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ChromeModa Solutions

Germany . 1,244 parts In-Stock

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IDEA Electronic Components Group

UK . 883 parts In-Stock

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Corohmni

South Africa . 406 parts In-Stock

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Parana Technologies

USA . 50 parts In-Stock

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Perfect Parts

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Overview

Unlock the potential of your motor control projects with the DRV10963EVM from Texas Instruments. From its high-quality manufacturing to its versatile applications in development boards and evaluation kits, this power management solution offers unmatched value and benefits to customers. With features like potentiometer speed control and compatibility with BLDC motors, this board is a must-have for anyone looking to optimize their motor control system. Experience the advantages of Texas Instruments technology with the DRV10963EVM.

Feature Benefit Bullets

Other Names: 296-37046, DRV10963EVM-ND

This product is easily identifiable and searchable with multiple reference names.

Category: Development Boards, Kits, Programmers, Evaluation Boards, Evaluation and Demonstration Boards and Kits

Versatile product that can be used for development, evaluation, and demonstration purposes.

Package: Box

Secure and protective packaging for the product.

Type: Power Management

Efficiently manages power for motor control applications.

Function: Motor Controller/Driver, Utilized IC / Part: DRV10963

Specifically designed for motor control applications using DRV10963 IC.

Primary Attributes: Motors (BLDC)

Suitable for Brushless DC motors, a common type of motor used in various applications.

Supplied Contents: Board(s)

Provides necessary components for easy setup and implementation.

Secondary Attributes: Potentiometer Speed Control

Allows for precise speed control using a potentiometer.

Base Product Number: DRV10963

Built on the reliable DRV10963 platform for motor control.

Moisture Sensitivity Level (MSL): 1 (Unlimited)

Can be used in various environments without moisture-related limitations.

Technical Specifications

Additional Parts DRV10963EVM attributes and parameters. Explore more Additional Parts devices from Texas Instruments

Technical Specifications

Other Names:

296-37046
DRV10963EVM-ND

Function:

Motor Controller/Driver

Type:

Power Management

Category:

Development Boards, Kits, Programmers
Evaluation Boards Evaluation and Demonstration Boards and Kits

Supplied Contents:

Board(s)

Secondary Attributes:

Potentiometer Speed Control

Utilized IC / Part:

DRV10963

Package:

Box

Primary Attributes:

Motors (BLDC)

Standard Package:

1

Base Product Number:

DRV10963

Moisture Sensitivity Level (MSL):

1 (Unlimited)

Trade Compliance

DRV10963EVM Miscellaneous Components trade compliance attributes, and parameters.

ECCN

EAR99

HTS

8473.30.1180

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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