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DLPA1000YFFT

Texas Instruments

DLPA1000YFFT by Texas Instruments

DLPA1000YFFT by Texas Instruments is a consumer IC with 49 terminals in a grid array package. It operates b/w -10 to 85°C, with supply voltage range of 2.3V to 6V. This IC is ideal for applications requiring fine pitch and thin profile packages.

Median Price

$6.174

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,421 parts In-Stock

1+ parts

$4.458

100+ parts

$3.906

1k+ parts

$2.207

10k+ parts

-

1,421

$4.458

$3.906

$2.207

-

Mouser Electronics

USA . 92 parts In-Stock

1+ parts

$7.890

100+ parts

$4.570

1k+ parts

$3.460

10k+ parts

-

92

$7.890

$4.570

$3.460

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,336 parts In-Stock

1+ parts

$4.235

100+ parts

-

1k+ parts

-

10k+ parts

-

4,336

$4.235

-

-

-

Vyrian

USA . 7,502 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,502

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 964 parts In-Stock

1+ parts

$0.071

100+ parts

-

1k+ parts

-

10k+ parts

$0.068

964

$0.071

-

-

$0.068

Northwest PG Solutions

USA . 64 parts In-Stock

1+ parts

$0.078

100+ parts

-

1k+ parts

-

10k+ parts

$0.069

64

$0.078

-

-

$0.069

Parana Technologies

USA . 2,351 parts In-Stock

1+ parts

$2.077

100+ parts

-

1k+ parts

$2.596

10k+ parts

-

2,351

$2.077

-

$2.596

-

DigiPath Technology Company

USA . 964 parts In-Stock

1+ parts

$2.287

100+ parts

-

1k+ parts

-

10k+ parts

-

964

$2.287

-

-

-

ChromeModa Solutions

Germany . 6,175 parts In-Stock

1+ parts

$2.334

100+ parts

$1.914

1k+ parts

-

10k+ parts

-

6,175

$2.334

$1.914

-

-

IDEA Electronic Components Group

UK . 13 parts In-Stock

1+ parts

$2.334

100+ parts

-

1k+ parts

$2.101

10k+ parts

-

13

$2.334

-

$2.101

-

Advanced Electronics

New Zealand . 800 parts In-Stock

1+ parts

$2.339

100+ parts

$2.315

1k+ parts

$2.222

10k+ parts

-

800

$2.339

$2.315

$2.222

-

Corphita

USA . 4,858 parts In-Stock

1+ parts

$4.012

100+ parts

-

1k+ parts

-

10k+ parts

-

4,858

$4.012

-

-

-

Microchip USA

USA . 2,242 parts In-Stock

1+ parts

$26.800

100+ parts

$26.640

1k+ parts

$26.560

10k+ parts

$26.470

2,242

$26.800

$26.640

$26.560

$26.470

Authorized Procurement Solutions

USA . 4,800 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,800

-

-

-

-

Lixinc

USA . 2,162 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,162

-

-

-

-

Overview

Elevate your consumer electronics with the DLPA1000YFFT by Texas Instruments, a cutting-edge IC that brings unparalleled quality and reliability to the forefront. Manufactured by industry-leading experts, this product is designed to optimize performance and functionality in a variety of applications. With its sleek package body and advanced features, this IC offers customers the value and benefits they need for seamless integration and superior results. Upgrade your technology with the DLPA1000YFFT and experience the advantages of innovation at its finest.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides good durability and protection for the IC, ensuring longevity and reliability.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards, saving time and effort during manufacturing.

Package Shape: RECTANGULAR

The rectangular package shape provides a compact and space-saving design, ideal for modern electronic devices with limited space.

General IC Type: CONSUMER CIRCUIT

Designed specifically for consumer applications, this IC is optimized for performance and functionality in everyday electronic devices.

No. of Terminals: 49

Having 49 terminals allows for a wide range of connectivity options and functionalities, making the IC versatile for various circuit configurations.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The grid array package style with a very thin profile and fine pitch enables high-density integration and precise connection, enhancing overall performance.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, the IC can withstand elevated temperatures, ensuring stable operation in varying environmental conditions.

Minimum Operating Temperature: -10 °C

The low minimum operating temperature of -10°C allows the IC to function reliably even in colder environments, expanding its utility.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

The terminal finish of Tin/Silver/Copper provides excellent conductivity and corrosion resistance, ensuring optimal performance and durability.

Terminal Position: BOTTOM

Having terminals positioned at the bottom facilitates easy and secure soldering onto the circuit board, enhancing stability and reliability of connections.

Maximum Seated Height: 0.625 mm

The low maximum seated height of 0.625 mm allows for a slim and sleek design, suitable for thin electronic devices and space-constrained applications.

Width: 2.958 mm

With a compact width of 2.958 mm, the IC can be efficiently integrated into small electronic devices, maximizing space utilization.

Minimum Supply Voltage (Vsup): 2.3 V

Operating at a low minimum supply voltage of 2.3 V, the IC consumes less power, making it energy-efficient and suitable for battery-powered devices.

Peak Reflow Temperature °C: 260

With a high peak reflow temperature of 260°C, the IC can endure the reflow soldering process without damage, ensuring reliable assembly onto circuit boards.

Length: 3.154 mm

The compact length of 3.154 mm contributes to a small form factor design, enabling the IC to be easily integrated into various electronic devices without occupying much space.

Terminal Form: BALL

The ball terminal form provides a reliable and secure connection for soldering, enhancing the overall durability and longevity of the IC's electrical connections.

Terminal Pitch: 0.4 mm

With a fine terminal pitch of 0.4 mm, the IC allows for precise and compact soldering, enabling high-density PCB designs and improved performance.

Maximum Supply Voltage (Vsup): 6 V

Operational at a maximum supply voltage of 6 V, the IC can handle higher voltage levels for enhanced performance, making it versatile for a wide range of applications.

Technical Specifications

Other Function Consumer ICs DLPA1000YFFT attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

Additional Features:

ALSO AVAILABLE 2.7V TO 6V SUPPLY NOM

General IC Type:

JESD-30 Code:

R-PBGA-B49

JESD-609 Code:

e1

Length:

3.154 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

49

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-10 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.625 mm

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

2.958 mm

Trade Compliance

DLPA1000YFFT General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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