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DDC316CZXGR

Texas Instruments

DDC316CZXGR by Texas Instruments

The Texas Instruments DDC316CZXGR is a 16-bit ADC with 0.0244% EL, 16 analog in channels, and 0.1 MHz sample rate. Ideal for commercial applications, it features a low profile grid array package with 64 terminals and operates b/w 0-70°C.

Median Price

$102.090

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 3,832 parts In-Stock

1+ parts

$71.430

100+ parts

$63.493

1k+ parts

$46.686

10k+ parts

-

3,832

$71.430

$63.493

$46.686

-

DigiKey

USA . 808 parts In-Stock

1+ parts

$132.750

100+ parts

$106.743

1k+ parts

-

10k+ parts

-

808

$132.750

$106.743

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,315 parts In-Stock

1+ parts

$67.858

100+ parts

-

1k+ parts

-

10k+ parts

-

1,315

$67.858

-

-

-

Vyrian

USA . 6,150 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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6,150

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 185 parts In-Stock

1+ parts

$18.354

100+ parts

-

1k+ parts

-

10k+ parts

-

185

$18.354

-

-

-

AZTECH Wire

Italy . 792 parts In-Stock

1+ parts

$18.800

100+ parts

-

1k+ parts

-

10k+ parts

-

792

$18.800

-

-

-

Northwest PG Solutions

USA . 1,602 parts In-Stock

1+ parts

$20.189

100+ parts

$18.170

1k+ parts

-

10k+ parts

-

1,602

$20.189

$18.170

-

-

Parana Technologies

USA . 220 parts In-Stock

1+ parts

$20.487

100+ parts

-

1k+ parts

$20.550

10k+ parts

-

220

$20.487

-

$20.550

-

DigiPath Technology Company

USA . 660 parts In-Stock

1+ parts

$22.559

100+ parts

$20.754

1k+ parts

-

10k+ parts

-

660

$22.559

$20.754

-

-

ChromeModa Solutions

Germany . 3,561 parts In-Stock

1+ parts

$23.019

100+ parts

$18.876

1k+ parts

-

10k+ parts

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3,561

$23.019

$18.876

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IDEA Electronic Components Group

UK . 1,281 parts In-Stock

1+ parts

$23.019

100+ parts

$21.868

1k+ parts

$20.717

10k+ parts

-

1,281

$23.019

$21.868

$20.717

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Corphita

USA . 1,735 parts In-Stock

1+ parts

$64.287

100+ parts

-

1k+ parts

-

10k+ parts

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1,735

$64.287

-

-

-

Microchip USA

USA . 360 parts In-Stock

1+ parts

$119.970

100+ parts

$117.880

1k+ parts

$116.840

10k+ parts

$115.790

360

$119.970

$117.880

$116.840

$115.790

QUARKTWIN TECHNOLOGY LTD

USA . 19,030 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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19,030

-

-

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,000

-

-

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Resion (Excess)

USA . 360 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

360

-

-

-

-

Overview

Elevate your analog-to-digital conversion experience with the Texas Instruments DDC316CZXGR. Manufactured by a trusted industry leader, this ADC offers unparalleled quality and precision in its 16-bit conversion capabilities. Ideal for a wide range of applications, this product provides customers with reliable performance, exceptional value, and seamless integration thanks to its innovative design and advanced features. Experience the difference with Texas Instruments and take your projects to new heights with the DDC316CZXGR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material for the package ensures long-lasting performance and easy handling.

No. of Analog In Channels: 16

Provides the capability to convert signals from 16 different analog inputs, making it versatile for various applications.

Surface Mount: YES

Effortless and space-saving installation on a printed circuit board.

No. of Bits: 16

Higher number of bits allows for more accurate conversion of analog signals to digital, providing precise data output.

Maximum Linearity Error (EL): 0.0244 %

Low linearity error ensures minimal distortion in the converted digital output, maintaining data integrity.

No. of Terminals: 64

Sufficient number of terminals for connectivity and compatibility with various circuit designs.

Maximum Operating Temperature: 70 °C

Wide operating temperature range allows for reliable performance in different environmental conditions.

Minimum Operating Temperature: 0 °C

Functionality in low temperature settings enhances the product's versatility.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

Quality finish for terminals ensures good conductivity and corrosion resistance, improving longevity.

Output Format: SERIAL, PARALLEL, WORD

Various output formats provide flexibility in data transmission and compatibility with different systems.

Technical Specifications

Analog-to-Digital Converters DDC316CZXGR attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

16

No. of Functions:

1

No. of Bits:

16

Output Bit Code:

Binary, Offset Binary

Output Format:

Serial, Parallel, Word

Maximum Linearity Error (EL):

0.0244 %

Sample Rate:

100 kHz

Electrical Specifications

Nominal Supply Voltage:

5 V

Operating Conditions

Moisture Sensitivity Level (MSL):

3

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Bottom

No. of Terminals:

64

Terminal Form:

Terminal Pitch:

0.031 in (0.8 mm)

Surface Mount:

Yes

Width:

0.315 in (8 mm)

Length:

0.315 in (8 mm)

Maximum Seated Height:

0.057 in (1.45 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Grid Array, Low Profile, Fine Pitch

Package Shape:

Package Code:

Standards and Codes

JESD-30 Code:

S-PBGA-B64

JESD-609 Code:

e1

Trade Compliance

DDC316CZXGR Converters trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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