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DDC316CGXGR

Texas Instruments

DDC316CGXGR by Texas Instruments

The Texas Instruments DDC316CGXGR is a 16-bit ADC with 0.0244% EL, operating at 0-70°C. It features 16 analog in channels, 3.3/5V supplies, and a sample rate of 0.1 MHz. Ideal for applications requiring high precision conversion like industrial automation and instrumentation systems.

Median Price

$80.540

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2,662 parts In-Stock

1+ parts

$71.430

100+ parts

$63.493

1k+ parts

$46.686

10k+ parts

-

2,662

$71.430

$63.493

$46.686

-

Rochester

USA . 635 parts In-Stock

1+ parts

-

100+ parts

$80.540

1k+ parts

$72.060

10k+ parts

$67.820

635

-

$80.540

$72.060

$67.820

DigiKey

USA . 635 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

635

-

-

-

-

Verical

USA . 635 parts In-Stock

1+ parts

-

100+ parts

$100.675

1k+ parts

$90.075

10k+ parts

$84.775

635

-

$100.675

$90.075

$84.775

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 858 parts In-Stock

1+ parts

$61.598

100+ parts

-

1k+ parts

-

10k+ parts

-

858

$61.598

-

-

-

Vyrian

USA . 4,504 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,504

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 363 parts In-Stock

1+ parts

$9.549

100+ parts

-

1k+ parts

-

10k+ parts

-

363

$9.549

-

-

-

Parana Technologies

USA . 851 parts In-Stock

1+ parts

$23.727

100+ parts

$2,203.449

1k+ parts

$21.355

10k+ parts

-

851

$23.727

$2,203.449

$21.355

-

Native Components

USA . 265 parts In-Stock

1+ parts

$25.369

100+ parts

-

1k+ parts

-

10k+ parts

-

265

$25.369

-

-

-

DigiPath Technology Company

USA . 1,413 parts In-Stock

1+ parts

$26.127

100+ parts

$24.037

1k+ parts

-

10k+ parts

-

1,413

$26.127

$24.037

-

-

ChromeModa Solutions

Germany . 1,221 parts In-Stock

1+ parts

$26.660

100+ parts

$21.861

1k+ parts

-

10k+ parts

-

1,221

$26.660

$21.861

-

-

IDEA Electronic Components Group

UK . 68 parts In-Stock

1+ parts

$26.660

100+ parts

$25.327

1k+ parts

$23.994

10k+ parts

-

68

$26.660

$25.327

$23.994

-

Northwest PG Solutions

USA . 1,197 parts In-Stock

1+ parts

$27.906

100+ parts

$25.116

1k+ parts

-

10k+ parts

-

1,197

$27.906

$25.116

-

-

Advanced Electronics

New Zealand . 3,000 parts In-Stock

1+ parts

$29.262

100+ parts

$26.628

1k+ parts

$23.995

10k+ parts

-

3,000

$29.262

$26.628

$23.995

-

Corphita

USA . 4,987 parts In-Stock

1+ parts

$58.356

100+ parts

-

1k+ parts

-

10k+ parts

-

4,987

$58.356

-

-

-

Microchip USA

USA . 2,080 parts In-Stock

1+ parts

$142.810

100+ parts

$140.330

1k+ parts

$139.090

10k+ parts

$137.850

2,080

$142.810

$140.330

$139.090

$137.850

Overview

Experience unparalleled precision and efficiency with the Texas Instruments DDC316CGXGR Analog-to-Digital Converter. With 16 analog input channels and a maximum linearity error of only 0.0244%, this product offers superior performance in a compact, high-quality package. Ideal for a wide range of applications, this converter provides exceptional value for customers seeking reliable and accurate data conversion. Trust in Texas Instruments' reputation for excellence and innovation, and elevate your projects with the DDC316CGXGR today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes this product lightweight and cost-effective.

No. of Analog In Channels: 16

Having 16 analog input channels allows for multiple analog signals to be converted simultaneously, making it versatile for various applications.

Surface Mount: YES

Being surface mountable makes installation and PCB assembly easier and more efficient.

No. of Bits: 16

With 16-bit resolution, this ADC provides high precision and accuracy in converting analog signals to digital data.

Maximum Linearity Error (EL): 0.0244 %

The low maximum linearity error ensures that the output digital data closely represents the input analog signal without significant distortion.

Power Supplies (V): 3.3,5

Supports multiple power supply voltages, offering flexibility in system integration and operation.

No. of Terminals: 64

Having 64 terminals allows for easy connectivity and integration within a system or circuit board.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The package style of grid array, low profile, and fine pitch makes it suitable for compact designs and high-density PCB layouts.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this ADC can operate reliably in various environmental conditions.

Minimum Operating Temperature: 0 °C

The ability to operate at temperatures as low as 0°C ensures functionality in a wide range of temperature environments.

Terminal Finish: Tin/Lead (Sn/Pb)

Tin/Lead terminal finish provides good solderability and reliability in electrical connections.

Maximum Seated Height: 1.45 mm

The low maximum seated height allows for a compact and space-efficient design.

Width: 8 mm

The compact width of 8mm enables ease of placement and integration into electronic systems.

Peak Reflow Temperature °C: 240

With a peak reflow temperature of 240°C, this product can withstand the soldering process during assembly.

Length: 8 mm

The compact length of 8mm complements the width, making it suitable for space-constrained applications.

Temperature Grade: COMMERCIAL

Designed for commercial-grade applications, ensuring reliable performance in standard operating environments.

Maximum Analog Input Voltage: 5.25 V

Supporting a maximum analog input voltage of 5.25V allows for compatibility with a wide range of analog signal levels.

Sample Rate: 0.1 MHz

With a sample rate of 0.1 MHz, this ADC can capture and convert analog signals at a high frequency, suitable for real-time data acquisition.

Terminal Form: BALL

The ball terminal form facilitates easy soldering and connection of the ADC to the circuit board.

Converter Type: ADC, PROPRIETARY METHOD

Utilizing a proprietary method for analog-to-digital conversion ensures optimized performance and accuracy in data conversion.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5V simplifies power requirements and compatibility with standard voltage levels.

Output Bit Code: BINARY, OFFSET BINARY

Offering binary and offset binary output bit codes provides flexibility in data format selection based on system requirements.

Terminal Pitch: 0.8 mm

With a terminal pitch of 0.8mm, this ADC allows for precise and secure connections in a compact layout.

Output Format: SERIAL, PARALLEL, WORD

Supports multiple output formats including serial, parallel, and word, catering to different interface requirements of various systems.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, this product can withstand moderate exposure to moisture during handling and storage.

Technical Specifications

Analog-to-Digital Converters DDC316CGXGR attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

16

No. of Functions:

1

No. of Bits:

16

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary, Offset Binary

Output Format:

Serial, Parallel, Word

Maximum Linearity Error (EL):

0.0244 %

Sample Rate:

100 kHz

Electrical Specifications

Power Supplies:

3.3,5 V

Maximum Analog Input Voltage:

5.25 V

Nominal Supply Voltage:

5 V

Operating Conditions

Moisture Sensitivity Level (MSL):

3

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Temperature Grade:

Peak Reflow Temperature:

240 °C (464 °F)

Form Factor

Terminal Position:

Bottom

No. of Terminals:

64

Terminal Form:

Terminal Pitch:

0.031 in (0.8 mm)

Surface Mount:

Yes

Width:

0.315 in (8 mm)

Length:

0.315 in (8 mm)

Maximum Seated Height:

0.057 in (1.45 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Grid Array, Low Profile, Fine Pitch

Package Shape:

Package Equivalence Code:

BGA64,8X8,32

Package Code:

Standards and Codes

JESD-30 Code:

S-PBGA-B64

Qualified:

No

JESD-609 Code:

e0

Trade Compliance

DDC316CGXGR Converters trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

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