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DDC118IRTCR

Texas Instruments

DDC118IRTCR by Texas Instruments

ADC, DELTA-SIGMA; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE;

Median Price

$44.431

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 10,579 parts In-Stock

1+ parts

$44.431

100+ parts

$39.494

1k+ parts

$29.040

10k+ parts

-

10,579

$44.431

$39.494

$29.040

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,682 parts In-Stock

1+ parts

$42.209

100+ parts

-

1k+ parts

-

10k+ parts

-

2,682

$42.209

-

-

-

Vyrian

USA . 7,454 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,454

-

-

-

-

Bristol Electronics

USA . 43 parts In-Stock

1+ parts

-

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-

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43

-

-

-

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Atlantic Semiconductor

USA . 43 parts In-Stock

1+ parts

-

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-

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43

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 543 parts In-Stock

1+ parts

$0.060

100+ parts

-

1k+ parts

-

10k+ parts

$0.058

543

$0.060

-

-

$0.058

Parana Technologies

USA . 1,076 parts In-Stock

1+ parts

$12.491

100+ parts

-

1k+ parts

$12.931

10k+ parts

-

1,076

$12.491

-

$12.931

-

DigiPath Technology Company

USA . 1,278 parts In-Stock

1+ parts

$13.754

100+ parts

-

1k+ parts

-

10k+ parts

-

1,278

$13.754

-

-

-

ChromeModa Solutions

Germany . 1,986 parts In-Stock

1+ parts

$14.035

100+ parts

$11.509

1k+ parts

-

10k+ parts

-

1,986

$14.035

$11.509

-

-

IDEA Electronic Components Group

UK . 812 parts In-Stock

1+ parts

$14.035

100+ parts

$13.333

1k+ parts

$12.632

10k+ parts

-

812

$14.035

$13.333

$12.632

-

AZTECH Wire

Italy . 437 parts In-Stock

1+ parts

$17.970

100+ parts

-

1k+ parts

-

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437

$17.970

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-

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Corphita

USA . 183 parts In-Stock

1+ parts

$39.988

100+ parts

-

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-

10k+ parts

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183

$39.988

-

-

-

Microchip USA

USA . 2,186 parts In-Stock

1+ parts

$83.650

100+ parts

$82.200

1k+ parts

$81.470

10k+ parts

$80.740

2,186

$83.650

$82.200

$81.470

$80.740

QUARKTWIN TECHNOLOGY LTD

USA . 6,784 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

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6,784

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-

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Kepictronics

USA . 1,000 parts In-Stock

1+ parts

-

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1,000

-

-

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Northwest PG Solutions

USA . 194 parts In-Stock

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194

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Technical Specifications

Analog-to-Digital Converters DDC118IRTCR attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

8

No. of Functions:

1

No. of Bits:

20

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary, Offset Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.025 %

Sample Rate:

3.125 kHz

Electrical Specifications

Power Supplies:

3,5 V

Nominal Supply Voltage:

5 V

Operating Conditions

Moisture Sensitivity Level (MSL):

3

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Quad

No. of Terminals:

48

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Width:

0.276 in (7 mm)

Length:

0.276 in (7 mm)

Maximum Seated Height:

0.035 in (0.9 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Chip Carrier, Heat Sink/Slug, Very Thin Profile

Package Shape:

Package Equivalence Code:

LCC48,.27SQ,20

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-N48

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

DDC118IRTCR Converters trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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