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DDC112Y/250G4

Texas Instruments

DDC112Y/250G4 by Texas Instruments

DDC112Y/250G4 by Texas Instruments is a 20-bit ADC with 0.025% EL, 2 analog in channels, and 5V supply. Ideal for industrial applications, it offers a sample rate of 0.002 MHz and operates b/w -40 to 85°C. With a compact design and serial output format, this converter is suitable for various precision measurement systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,496 parts In-Stock

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6,496

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Digiode

USA . 1,159 parts In-Stock

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1,159

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Nova Conductors

Japan . 300 parts In-Stock

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300

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Distributors (Availability)

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One Stop Electronics

USA . 1,580 parts In-Stock

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$6.000

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1,580

$6.000

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Parana Technologies

USA . 1,637 parts In-Stock

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$7.307

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$7.800

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1,637

$7.307

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$7.800

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DigiPath Technology Company

USA . 1,863 parts In-Stock

1+ parts

$8.046

100+ parts

$7.402

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1,863

$8.046

$7.402

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ChromeModa Solutions

Germany . 2,956 parts In-Stock

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$8.210

100+ parts

$6.732

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2,956

$8.210

$6.732

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IDEA Electronic Components Group

UK . 1,358 parts In-Stock

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$8.210

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$7.389

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1,358

$8.210

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$7.389

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AZTECH Wire

Italy . 760 parts In-Stock

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$9.976

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760

$9.976

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Ampacity Inc.

Singapore . 763 parts In-Stock

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$21.000

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$21.000

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Corphita

USA . 3,761 parts In-Stock

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3,761

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Kepictronics

USA . 3,260 parts In-Stock

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Bastille Electronics

Australia . 100 parts In-Stock

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100

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Overview

Unlock precision and reliability with the Texas Instruments DDC112Y/250G4 Analog-to-Digital Converter. Crafted with superior quality materials and cutting-edge technology, this product offers unparalleled performance in a compact package. Ideal for a wide range of applications, this converter provides fast and accurate data conversion, ensuring seamless operation in industrial settings. Experience the value and benefits of Texas Instruments' expertise with the DDC112Y/250G4, delivering high efficiency and precise results for your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and reliability for long-term use.

No. of Analog In Channels: 2

With 2 analog input channels, this product offers flexibility in capturing and converting two separate analog signals simultaneously.

Surface Mount: YES

Being surface mount compatible makes installation and integration of this product into circuit boards simple and efficient.

Package Shape: SQUARE

The square package shape allows for a more compact design and efficient use of board space in electronic systems.

No. of Bits: 20

With 20 bits, this product provides high resolution and accuracy in converting analog signals to digital data.

Maximum Linearity Error (EL): 0.025 %

The low maximum linearity error ensures precise and consistent conversion results, making this product suitable for high-precision applications.

Power Supplies (V): 5

Operating at a voltage of 5V allows for compatibility with standard power sources, making it easy to integrate into existing systems.

No. of Terminals: 32

This product has 32 terminals, providing ample connectivity options for interfacing with other components in a circuit.

Package Style (Meter): FLATPACK, THIN PROFILE

The flatpack, thin profile package style offers space-saving benefits and ease of integration into compact electronic devices.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions, ensuring reliable performance in various settings.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows this product to function effectively in cold environments, increasing its versatility.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability and performance.

Terminal Position: QUAD

The quad terminal position enhances stability and connectivity, making it easier to interface with other components in a circuit.

Maximum Conversion Time: 220 us

The fast maximum conversion time allows for quick and efficient analog-to-digital signal processing, ideal for time-sensitive applications.

Maximum Seated Height: 1.2 mm

The low maximum seated height provides a compact form factor, making this product suitable for space-constrained applications.

Width: 7 mm

The width of 7mm offers a slim profile, allowing for efficient use of space on a circuit board.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum time at peak reflow temperature of 30 seconds, this product is easy to solder and integrate into electronic assemblies.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance ensures durability and reliability during the manufacturing and assembly processes.

Length: 7 mm

The length of 7mm contributes to the compact and space-efficient design of this product.

Temperature Grade: INDUSTRIAL

Designed for industrial use, this product can withstand demanding environments and operating conditions, ensuring reliability in industrial applications.

Maximum Analog Input Voltage: 0 V

The maximum analog input voltage of 0V protects the device from potential voltage overload, safeguarding it against damage.

Sample Rate: 0.002 MHz

With a sample rate of 0.002 MHz, this product can accurately capture and convert analog signals at a high frequency, suitable for fast-paced applications.

Technology: CMOS

Utilizing CMOS technology provides low power consumption and high-speed operation, making this product energy-efficient and reliable.

Terminal Form: GULL WING

The gull wing terminal form offers secure attachment and efficient soldering, ensuring a reliable and stable connection in electronic circuits.

Converter Type: ADC, DELTA-SIGMA

Featuring ADC delta-sigma converter type, this product delivers high-resolution digital outputs with low noise and high accuracy.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5V ensures compatibility with standard power sources, making integration into existing systems straightforward.

Output Bit Code: BINARY

Outputting data in binary bit code format enables easy interpretation and processing of converted digital signals.

Terminal Pitch: 0.8 mm

With a terminal pitch of 0.8mm, this product offers a compact and efficient layout for easy connection and integration.

Output Format: SERIAL

The serial output format simplifies data transmission and communication with other digital devices, enhancing connectivity and compatibility.

Moisture Sensitivity Level (MSL): 2

Featuring a moisture sensitivity level of 2, this product is resistant to moisture damage, ensuring long-term reliability in various environmental conditions.

Technical Specifications

Analog-to-Digital Converters DDC112Y/250G4 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

2

No. of Functions:

1

No. of Bits:

20

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.025 %

Sample Rate:

2 kHz

Maximum Conversion Time:

220 µs

Electrical Specifications

Power Supplies:

5 V

Maximum Analog Input Voltage:

0 mV

Nominal Supply Voltage:

5 V

Operating Conditions

Moisture Sensitivity Level (MSL):

2

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Quad

No. of Terminals:

32

Terminal Form:

Terminal Pitch:

0.031 in (0.8 mm)

Surface Mount:

Yes

Width:

0.276 in (7 mm)

Length:

0.276 in (7 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Flatpack, Thin Profile

Package Shape:

Package Equivalence Code:

TQFP32,.35SQ,32

Package Code:

Standards and Codes

JESD-30 Code:

S-PQFP-G32

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

DDC112Y/250G4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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