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DDC112YK/2KG4

Texas Instruments

DDC112YK/2KG4 by Texas Instruments

DDC112YK/2KG4 by Texas Instruments is a 20-bit ADC with 0.025% linearity error, operating at 5V. Ideal for commercial applications, it offers a sample rate of 0.003 MHz and serial output format. With a compact square package style and quad terminal position, this converter has a max conversion time of 220 us.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,135 parts In-Stock

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6,135

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Digiode

USA . 3,522 parts In-Stock

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3,522

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Distributors (Availability)

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Native Components

USA . 104 parts In-Stock

1+ parts

$5.290

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-

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104

$5.290

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Parana Technologies

USA . 1,615 parts In-Stock

1+ parts

$6.286

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-

1k+ parts

$7.039

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1,615

$6.286

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$7.039

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DigiPath Technology Company

USA . 847 parts In-Stock

1+ parts

$6.922

100+ parts

$6.368

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847

$6.922

$6.368

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IDEA Electronic Components Group

UK . 2,125 parts In-Stock

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$7.063

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$6.357

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2,125

$7.063

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$6.357

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ChromeModa Solutions

Germany . 1,578 parts In-Stock

1+ parts

$7.063

100+ parts

$5.792

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1,578

$7.063

$5.792

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AZTECH Wire

Italy . 245 parts In-Stock

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$14.895

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245

$14.895

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One Stop Electronics

USA . 732 parts In-Stock

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$30.000

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732

$30.000

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QUARKTWIN TECHNOLOGY LTD

USA . 6,785 parts In-Stock

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6,785

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Microchip USA

USA . 4,855 parts In-Stock

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4,855

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Corphita

USA . 2,360 parts In-Stock

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2,360

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Northwest PG Solutions

USA . 2,059 parts In-Stock

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$5.184

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2,059

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$5.184

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Overview

Enhance your analog-to-digital conversion experience with the cutting-edge DDC112YK/2KG4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments guarantees top-notch quality and reliability in all its products. The DDC112YK/2KG4 offers unparalleled precision and accuracy in converting analog signals to digital, making it an essential component in a wide range of applications. Experience seamless integration, high performance, and exceptional value with the DDC112YK/2KG4, setting new standards for efficiency and effectiveness in your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY package material provides durability and protection for the internal components of the Analog-to-Digital Converter, ensuring reliability in various operating conditions.

No. of Analog In Channels: 2

Having 2 analog input channels allows for flexibility in connecting multiple input signals to the converter, making it suitable for applications requiring multiple inputs.

No. of Bits: 20

A 20-bit resolution ensures high accuracy and precision in converting analog signals to digital data, making this converter suitable for applications requiring fine measurement.

Maximum Linearity Error (EL): 0.025%

The low linearity error of 0.025% ensures that the output digital data closely matches the input analog signal, guaranteeing accurate conversion results.

Maximum Conversion Time: 220 us

With a fast conversion time of 220 microseconds, this ADC can quickly process analog signals, making it suitable for applications that require real-time data acquisition.

Technical Specifications

Analog-to-Digital Converters DDC112YK/2KG4 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

2

No. of Functions:

1

No. of Bits:

20

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.025 %

Sample Rate:

3 kHz

Maximum Conversion Time:

220 µs

Electrical Specifications

Power Supplies:

5 V

Maximum Analog Input Voltage:

0 mV

Nominal Supply Voltage:

5 V

Operating Conditions

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Temperature Grade:

Form Factor

Terminal Position:

Quad

No. of Terminals:

32

Terminal Form:

Terminal Pitch:

0.031 in (0.8 mm)

Surface Mount:

Yes

Width:

0.276 in (7 mm)

Length:

0.276 in (7 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Flatpack, Thin Profile

Package Shape:

Package Equivalence Code:

TQFP32,.35SQ,32

Package Code:

Standards and Codes

JESD-30 Code:

S-PQFP-G32

Qualified:

No

Trade Compliance

DDC112YK/2KG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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