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DAC902U/1KG4

Texas Instruments

DAC902U/1KG4 by Texas Instruments

DAC902U/1KG4 by Texas Instruments is a 12-bit D/A converter with 1.25V max analog output voltage, 0.061% linearity error, and 5V power supply. Ideal for industrial applications due to its small outline package style, CMOS technology, and -40 to 85°C operating temperature range.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,004 parts In-Stock

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Digiode

USA . 3,884 parts In-Stock

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Northwest PG Solutions

USA . 53 parts In-Stock

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$3.069

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AZTECH Wire

Italy . 395 parts In-Stock

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$11.907

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Parana Technologies

USA . 105 parts In-Stock

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$22.680

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$23.344

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One Stop Electronics

USA . 1,158 parts In-Stock

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$24.000

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$24.000

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DigiPath Technology Company

USA . 823 parts In-Stock

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$24.973

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ChromeModa Solutions

Germany . 6,900 parts In-Stock

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$25.483

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$20.896

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$25.483

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IDEA Electronic Components Group

UK . 2,200 parts In-Stock

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$25.483

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$24.209

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$22.935

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Corphita

USA . 4,451 parts In-Stock

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Glotronic Ltd.

UK . 3,790 parts In-Stock

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Native Components

USA . 194 parts In-Stock

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Overview

Unlock the power of precision with the Texas Instruments DAC902U/1KG4 Digital-to-Analog Converter. Crafted with industry-leading expertise, this compact device offers unparalleled accuracy and reliability in converting digital signals to analog output. Perfect for industrial applications, this innovative converter delivers a maximum analog output voltage of 1.25V with minimal linearity error. Trust Texas Instruments to provide cutting-edge technology that enhances your projects with unmatched quality and performance. Elevate your designs with the DAC902U/1KG4 and experience the difference today.

Feature Benefit Bullets

Maximum Analog Output Voltage: 1.25 V

This high maximum analog output voltage allows for a wide range of output signal levels, making this product suitable for various applications.

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and protection for the internal components of the converter, ensuring reliability in different operating conditions.

No. of Bits: 12

With 12 bits of resolution, this digital-to-analog converter can provide precise and accurate analog output signals, making it ideal for applications that require high fidelity conversion.

Maximum Linearity Error (EL): 0.061 %

The low maximum linearity error ensures that the output signals closely match the input digital values, resulting in minimal distortion and accurate analog signal reproduction.

Power Supplies (V): 5

Operating at a voltage of 5V, this converter is compatible with standard power supplies, making it easy to integrate into existing systems.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this converter can withstand elevated temperatures without sacrificing performance, making it suitable for industrial applications.

Technical Specifications

Digital-to-Analog Converters DAC902U/1KG4 attributes and parameters. Explore more Digital-to-Analog Converters devices from Texas Instruments

Converter Specifications

Technology:

CMOS

Sub-Category:

Other Converters

Input Format:

Parallel, Word

Input Bit Code:

Binary

Maximum Linearity Error (EL):

0.061 %

Nominal Settling Time (tstl):

30 ns

Maximum Supply Current:

30 mA

No. of Bits:

12

No. of Functions:

1

Electrical Specifications

Nominal Supply Voltage:

5 V

Minimum Analog Output Voltage:

-1 V

Maximum Analog Output Voltage:

1.25 V

Power Supplies:

5 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Moisture Sensitivity Level (MSL):

2

Form Factor

No. of Terminals:

28

Terminal Form:

Terminal Position:

Dual

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Finish:

Nickel Palladium Gold

Surface Mount:

Yes

Width:

0.295 in (7.5 mm)

Length:

0.705 in (17.9 mm)

Maximum Seated Height:

0.104 in (2.65 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

Small Outline

Package Code:

SOP

Package Equivalence Code:

SOP28,.4

Standards and Codes

Qualified:

No

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Trade Compliance

DAC902U/1KG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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