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DAC902E/2K5G4

Texas Instruments

DAC902E/2K5G4 by Texas Instruments

DAC902E/2K5G4 by Texas Instruments is a 12-bit D/A converter with max output voltage of 1.25V, 0.061% linearity error, and settling time of 0.03us. Ideal for industrial applications requiring precise analog signal generation in compact spaces due to its small outline package and low power consumption.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,441 parts In-Stock

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Digiode

USA . 2,131 parts In-Stock

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Distributors (Availability)

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Native Components

USA . 960 parts In-Stock

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$0.795

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960

$0.795

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Northwest PG Solutions

USA . 2,300 parts In-Stock

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$0.875

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2,300

$0.875

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AZTECH Wire

Italy . 797 parts In-Stock

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$10.341

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797

$10.341

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Parana Technologies

USA . 295 parts In-Stock

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$11.714

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$12.105

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295

$11.714

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$12.105

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DigiPath Technology Company

USA . 2,218 parts In-Stock

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$12.899

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$12.899

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ChromeModa Solutions

Germany . 5,286 parts In-Stock

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$13.162

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$10.793

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$10.793

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IDEA Electronic Components Group

UK . 2,373 parts In-Stock

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$13.162

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$12.504

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$11.846

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One Stop Electronics

USA . 693 parts In-Stock

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$19.000

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Corphita

USA . 1,847 parts In-Stock

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Kepictronics

USA . 880 parts In-Stock

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Microchip USA

USA . 155 parts In-Stock

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Overview

Unlock the power of precision with the DAC902E/2K5G4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality digital-to-analog converters for a wide range of applications. With a maximum analog output voltage of 1.25V and a compact, surface-mount package design, this product offers exceptional performance and reliability. Experience seamless integration, fast settling times, and unparalleled accuracy with the DAC902E/2K5G4. Elevate your projects to new heights with this cutting-edge technology from Texas Instruments.

Feature Benefit Bullets

Maximum Analog Output Voltage: 1.25 V

This high maximum analog output voltage allows for precise and accurate output signals, making this product suitable for applications requiring high resolution.

No. of Bits: 12

With a higher number of bits, this digital-to-analog converter offers finer resolution and smoother analog output signals, enhancing the overall performance of the system it is integrated into.

Maximum Linearity Error (EL): 0.061%

The low maximum linearity error ensures that the output signals closely match the input, providing high fidelity and accuracy in signal conversion.

Power Supplies (V): 5

Operating at a common voltage of 5V, this digital-to-analog converter can be easily integrated into various systems and circuits without requiring additional power conversion.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this digital-to-analog converter can withstand a wide operating temperature range (-40°C to 85°C) ensuring reliability and stability in harsh environments.

Technical Specifications

Digital-to-Analog Converters DAC902E/2K5G4 attributes and parameters. Explore more Digital-to-Analog Converters devices from Texas Instruments

Converter Specifications

Technology:

CMOS

Sub-Category:

Other Converters

Input Format:

Parallel, Word

Input Bit Code:

Binary

Maximum Linearity Error (EL):

0.061 %

Nominal Settling Time (tstl):

30 ns

Maximum Supply Current:

30 mA

No. of Bits:

12

No. of Functions:

1

Electrical Specifications

Nominal Supply Voltage:

5 V

Minimum Analog Output Voltage:

-1 V

Maximum Analog Output Voltage:

1.25 V

Power Supplies:

5 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Moisture Sensitivity Level (MSL):

2

Form Factor

No. of Terminals:

28

Terminal Form:

Terminal Position:

Dual

Terminal Pitch:

0.026 in (0.65 mm)

Terminal Finish:

Nickel Palladium Gold

Surface Mount:

Yes

Width:

0.173 in (4.4 mm)

Length:

0.382 in (9.7 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Package Code:

Package Equivalence Code:

TSSOP28,.25

Standards and Codes

Qualified:

No

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Trade Compliance

DAC902E/2K5G4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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