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DAC7801KUG4

Texas Instruments

DAC7801KUG4 by Texas Instruments

DAC7801KUG4 by Texas Instruments is a 12-bit D/A converter with 0.0244% linearity error and 0.8 us settling time. Ideal for industrial applications, it operates at temperatures ranging from -40 to 85 °C and requires a 5V supply voltage.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,351 parts In-Stock

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Digiode

USA . 686 parts In-Stock

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AZTECH Wire

Italy . 531 parts In-Stock

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$12.200

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531

$12.200

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One Stop Electronics

USA . 1,001 parts In-Stock

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$17.000

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$17.000

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Parana Technologies

USA . 1,044 parts In-Stock

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$18.710

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$18.803

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$18.710

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ChromeModa Solutions

Germany . 5,390 parts In-Stock

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$21.023

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$17.239

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$21.023

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IDEA Electronic Components Group

UK . 968 parts In-Stock

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$21.023

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$19.972

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$18.921

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968

$21.023

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$18.921

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Native Components

USA . 553 parts In-Stock

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$110.625

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$106.200

553

$110.625

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$106.200

Northwest PG Solutions

USA . 1,981 parts In-Stock

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$121.688

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Authorized Procurement Solutions

USA . 25,000 parts In-Stock

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Corphita

USA . 2,366 parts In-Stock

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DigiPath Technology Company

USA . 2,124 parts In-Stock

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Microchip USA

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Overview

Unlock the power of precision with the DAC7801KUG4 by Texas Instruments, a leading manufacturer known for top-quality digital-to-analog converters. Ideal for a wide range of applications, this product offers unmatched value and benefits to customers looking for reliable performance and efficiency. With fast settling times, high linearity accuracy, and a compact design, this converter is perfect for industrial-grade projects where precision is key. Experience seamless integration and superior results with the DAC7801KUG4 - the ultimate solution for your analog signal processing needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for applications where weight and robustness are important.

Surface Mount: YES

Surface mount capability allows for easy integration into circuit boards, saving space and reducing assembly time.

No. of Bits: 12

High resolution of 12 bits ensures accurate conversion of digital signals to analog, resulting in high-quality output.

Nominal Settling Time (tstl): 0.4 us

Fast settling time ensures quick and accurate conversion, suitable for applications that require rapid response times.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making the product energy-efficient and reliable in various environments.

Maximum Operating Temperature: 85 °C

High maximum operating temperature allows for use in industrial environments with elevated temperatures, ensuring reliable performance.

Input Format: PARALLEL, 8 BITS

Parallel input format with 8 bits simplifies interfacing with digital systems, enhancing compatibility and ease of integration.

Nominal Supply Voltage: 5 V

5V supply voltage is a common standard in many applications, ensuring compatibility and ease of power supply design.

Technical Specifications

Digital-to-Analog Converters DAC7801KUG4 attributes and parameters. Explore more Digital-to-Analog Converters devices from Texas Instruments

Converter Specifications

Technology:

CMOS

Sub-Category:

Other Converters

Input Format:

Parallel, 8 Bits

Input Bit Code:

Binary

Maximum Linearity Error (EL):

0.0244 %

Nominal Settling Time (tstl):

400 ns

Maximum Supply Current:

2 mA

Maximum Settling Time:

800 ns

No. of Bits:

12

No. of Functions:

1

Electrical Specifications

Nominal Supply Voltage:

5 V

Power Supplies:

5 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Moisture Sensitivity Level (MSL):

3

Form Factor

No. of Terminals:

24

Terminal Form:

Terminal Position:

Dual

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Finish:

Nickel Palladium Gold

Surface Mount:

Yes

Width:

0.295 in (7.5 mm)

Length:

0.606 in (15.4 mm)

Maximum Seated Height:

0.104 in (2.65 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

Small Outline

Package Code:

SOP

Package Equivalence Code:

SOP24,.4

Standards and Codes

Qualified:

No

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Trade Compliance

DAC7801KUG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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