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DAC7741EVM

Texas Instruments

DAC7741EVM by Texas Instruments

DAC7741EVM by Texas Instruments is a 16-bit Voltage DAC Evaluation Board with Parallel Interface, 3 µs Settling Time. It is used for Development and Evaluation of Digital to Analog Converters (DACs). The board includes the DAC7741 IC and comes in Bulk packaging.

Median Price

$102.800

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

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DigiKey

USA . 1 parts In-Stock

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$102.800

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1

$102.800

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Vyrian

USA . 6,509 parts In-Stock

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6,509

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Digiode

USA . 1,967 parts In-Stock

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1,967

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Distributors (Availability)

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AZTECH Wire

Italy . 768 parts In-Stock

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$11.238

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768

$11.238

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Native Components

USA . 349 parts In-Stock

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$44.140

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$42.374

349

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$42.374

Northwest PG Solutions

USA . 1,501 parts In-Stock

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$48.554

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$48.554

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Advanced Electronics

New Zealand . 4,430 parts In-Stock

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$123.974

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$112.816

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$101.659

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$123.974

$112.816

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One Stop Electronics

USA . 1,424 parts In-Stock

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$137.100

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Ampacity Inc.

Singapore . 352 parts In-Stock

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$159.100

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352

$159.100

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Semicontronic

India . 379 parts In-Stock

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$249.100

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$242.872

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$241.627

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379

$249.100

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Corphita

USA . 2,642 parts In-Stock

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Parana Technologies

USA . 2,364 parts In-Stock

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$0.538

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2,364

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$0.538

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ChromeModa Solutions

Germany . 2,039 parts In-Stock

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DigiPath Technology Company

USA . 784 parts In-Stock

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Corohmni

South Africa . 439 parts In-Stock

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IDEA Electronic Components Group

UK . 348 parts In-Stock

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348

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Overview

Unleash the power of precision with the Texas Instruments DAC7741EVM. Manufactured by a trusted industry leader, this evaluation board offers unparalleled quality and reliability in the realm of digital to analog converters. Perfect for development projects and prototyping, this board boasts a lightning-fast settling time of just 3 µs, allowing for quick and accurate voltage conversions. Explore the endless possibilities of voltage control with the DAC7741EVM and experience the value it brings to your next project.

Feature Benefit Bullets

Package: Bulk

The bulk packaging ensures cost-effectiveness for purchasing multiple units of this product.

Number of Bits: 16

With 16 bits resolution, this product provides high precision and accuracy in digital-to-analog conversion.

Data Interface: Parallel

The parallel data interface allows for fast and efficient communication between the digital source and the DAC.

Settling Time: 3 µs

The fast settling time of 3 µs ensures quick and stable output voltage after a change in digital input, making this product suitable for real-time applications.

DAC Type: Voltage

Being a voltage DAC, this product is suitable for applications where precise voltage outputs are required.

Supplied Contents: Board(s)

The inclusion of board(s) in the supplied contents allows for easy evaluation and testing of the DAC7741.

Utilized IC / Part: DAC7741

This product utilizes the DAC7741 IC, ensuring compatibility and optimized performance.

Moisture Sensitivity Level (MSL): 1 (Unlimited)

The MSL 1 rating indicates that this product has unlimited exposure time to moisture, providing reliability in various environmental conditions.

Technical Specifications

Additional Parts DAC7741EVM attributes and parameters. Explore more Additional Parts devices from Texas Instruments

Technical Specifications

Other Names:

DAC7741EVM-ND
-296-19940
296-19940
-DAC7741EVM-ND
-DAC7741EVM-NDR
-296-19940-ND
296-19940-NDR

Category:

Development Boards, Kits, Programmers
Evaluation Boards Digital to Analog Converters (DACs) Evaluation Boards

Data Interface:

Parallel

Settling Time:

3 µs

Standard Package:

1

DAC Type:

Voltage

Number of DAC's:

1

Supplied Contents:

Board(s)

Number of Bits:

16

Utilized IC / Part:

DAC7741

Package:

Bulk

Base Product Number:

DAC7741

Moisture Sensitivity Level (MSL):

1 (Unlimited)

Trade Compliance

DAC7741EVM Miscellaneous Components trade compliance attributes, and parameters.

ECCN

EAR99

HTS

8473.30.1180

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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